JPS58133704A - Sheet material adapted to form electric connection bonded to substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to sheet materials useful for forming adhesive electrical connections to electronic components.

In the electrical equipment industry, small parallel (5ide-by-
5ide) There is a need for a means to make a convenient yet reliable electrical connection to a set of terminal pads. Promising techniques for forming such connections are described in UK published patent application no.
．． No. 048,582 A', which includes a flexible insulating sheet, a conductive adhesive covering a plurality of parallel discrete conductive stones and conductive stripes carried on the sheet. °Adhesive connector tape is taught. Electrical connections can be made by gluing the ends of the tape to a set of terminal bands with individual stripes on the tape in line with individual pads.

In order to satisfactorily use the sheet material described above, the conductive adhesive of the sheet material must have a low resistance adhesion that is stable over the length of time and under the operating conditions expected of the sheet material. . Conventional conductive adhesives do not have the necessary degree of stability and low resistance. The initial resistance is too high and/or the resistance increases to the extent that mechanical tightening techniques are often used to supplement the adhesive layer during use.

Also, a disadvantage of the above-described connector tapes is that the conductive adhesive covering the stripes unintentionally contacts other members of the electronic assembly at intermediate portions along the length of the tape. Such contact connects the middle portion of the tape, as was done in some small flanted cables of the prior art (U.S. Pat. ), this could be avoided by covering it with an insulating layer. However, such intermediate sheathing of cables is inconvenient and uneconomical. This is because this intermediate coating requires the application of a specific length of insulating material to the round for a specific application.Application of a specific length is an even more difficult operation, and there are various It is necessary to maintain an inventory of cables of various insulation lengths for the following products: Alternatively, the insulation must be removed from the ends of the cable, which is difficult and unsuitable for rapid automated operation.

The present invention, in a preferred embodiment, provides a new conductive adhesive sheet material that is insulated over its entire adhesive surface and yet can be operatively bonded directly to and electrically connected to electronic components. - In an embodiment, the new product has a conductive layer, such as a metal layer, deposited on the insulating sheet, giving the surface of the sheet material electrical conductivity. In other embodiments, such conductive layers are omitted, and the adhesive sheet material is applied between adherends having such conductive layers or to tapes having such conductive layers, etc. Can be glued
It is a "transfer type" adhesive.

In both embodiments, the sheet materials of the present invention generally contain conductive elements, such as discrete, separate metal particles, that are substantially the same or thicker than the thickness of the electromechanical layer or the adhesive layer. The monolayer comprises the polymeric layer or adhesive layer in which the monolayer is dispersed.

The electrically insulating thin layer is disposed over the single layer of the conductive element and is tack-free or poorly tack-free at room temperature (i.e., 20° G), 1 and has no tack through the layer to the conductive element in the tests described herein. has an electrical resistance value of at least 1 megohm, and which softens to an adhesive and flowable state when heated to high temperatures, but which becomes rigid and substantially non-flowable when cooled to room temperature. The sheet material is easy to handle and has no conductive adhesive properties at room temperature; however, when the sheet material is pressed and heated against a substrate, the conductive elements form an electrical connection with the substrate through the insulating layer. Stretched and glued connections can be formed.

The polymeric or adhesive layer in which the electrically conductive elements are dispersed is generally supported on a flexible support, and one or more electrically conductive layers are also supported on or attached to the support. may be configured.

The adhesive is heated to an elevated temperature to soften to an adhesive state, and then hardens at room temperature to a strong, substantially non-flowing state. Also, the conductive elements dispersed in the adhesive layer have an average thickness that is greater than the average thickness of the adhesive layer, and substantially the upper edge of each element extends at least one portion of the outer surface of the adhesive layer surrounding the element. Preferably, it is higher than the

During bonding of the preferred sheet material to the substrate, the adhesive surrounding the conductive element is pressed into contact with the substrate and forms an adhesive layer thereto.

The support carrying the adhesive layer is also pressed onto the substrate and fits around the conductive element which is thicker than the adhesive. The support is believed to be held under tension around the conductive element and to place the conductive element under compression relative to the substrate. having a low resistance with an adhesive layer in a strong but substantially non-flowing state and a conductive element held against the substrate;
A connection is formed which maintains this low resistance over a long useful life.

The utility of the sheet materials of the present invention is demonstrated in U.S. Pat.
This is in contrast to previous experience with commercially available pressure sensitive adhesive connector tape products of the type described in No. 213, L7. These tapes use a pressure sensitive adhesive layer coated on a conductive support, typically a metal foil, with a single layer of relatively large particles dispersed in the adhesive layer. The particles in these tapes were substantially the same thickness as the adhesive layer, and were sometimes even thicker than the adhesive layer. However, these tapes do not necessarily provide a low resistance electrical connection unless tightening is performed to hold the tape to the substrate. Apparently, the force holding the particles against the substrate gradually decreases as a result of adhesive flow after the tape is glued in place.

Despite such prior experience, the preferred sheet materials of the present invention incorporate a layer of insulating material of sufficient thickness to provide electrical insulation and physical protection, yet still provide reliable and reliable electrical protection. Connections can be made through an insulating layer using heat and pressure. This thermal pressure displaces the insulating material from above the conductor, and the insulating material remains rigid in its displaced position due to cooling of the insulating material. A low resistance electrical connection is formed that is maintained over a long useful life.

Typically, the sheet material of the present invention will take the form of a stretched tape wound onto itself in a roll for convenience in storage and use. A number of conductive layers are also included in narrow parallel elongated stripes supported on the elongated insulating web and laterally spaced from each other and spanning the length K of the insulating web. That is, connections are suitably formed between terminal boards that include multiple separate parallel terminal pads. However, for special applications, other configurations of conductive stripes or tracks in addition to parallel stripes are used in some embodiments of the sheet materials of the present invention.

The specific tape 10 shown in FIGS. 1 and 2 includes a flat electrically insulating sheet 11, a conductive stripe 12, a non-conductive adhesive material 13 covering the conductive stripe, conductive particles 14 dispersed in the adhesive material, and a tape. includes a thin layer 15 of electrically insulating material covering the entire top surface of the device.

Flat electrical insulation sheet 11 comprises a film or resin impregnated fibrous web, such as a typical Kt-1t polyethylene terephthalate or Boliimi P film. In a preferred construction, the sheet conforms to the surroundings of the conductive element during the gluing operation, but must be flexible so that the adhesive carried on the support is brought into contact with the substrate to be bonded. .

A preferred film is polyethylene terephthalate 2
It has a flexibility on the order of a 5 micrometer or 50 micrometer thick film. however,
Generally, by using greater pressure and a slightly thicker adhesive layer in the bonding operation, a less flexible film can be used, so the film does not need to be as large compatible with the thinner adhesive layer.

Conductive stripes 12 typically include a layer of metal, such as chain, gold, aluminum, or copper, deposited on a flat sheet. Metallic (may constitute the entire support or be glued to the 7-rat sheet with adhesive)
other conductive layers, such as a layer of metal sputtered onto a flat sheet, or a conductive paint #1 containing a paint vehicle and a conductor, typically metal or carbon particles, or formed from an ink. The adhesive material 13 is a thermally activated material that forms an adhesive layer upon heating. During the heating operation, the adhesive material wets the substrate to be bonded. The adhesive is then cured, either by cooling or by reaction of the components, and the sheet material and conductive particles of the present invention are held in place with respect to an adherend.

In this regard, the adhesive material is either non-tacky or poorly tacky. Non-tacky or poorly tacky, but becomes pressure sensitive and highly tacky when heated. Good adhesion forms immediately at tack temperature & VC without the need for cross-linking or other chemical reactions. The adhesive material is an acrylic polymer or at least 111
a mixture of acrylic polymers of alkyl acrylate and (t) alkyl methacrylate monomers (referred to as "acrylic ester monomers" in heavy weight 1181F), and 1), acrylic ester monomers; The polymer is at least 50 mol% of one or more acrylic polymers in the adhesive layer.
2) of the one or more acrylic polymers;
1g (glass transition temperature) or weight average Tg is -10℃
3), the layer of adhesive material has a) a Proso tack value (defined below) of less than 75 g force (gf) at 20°C; and b) a temperature of at least 50°C. C) with a Zorope tack value of at least 75 gf, which remains essentially constant after 60 days at 40°C, and a new value (C) at 65°C;
Below? 4) A(:acrylic acid, methacrylic acid, itaconic acid, maleic acid or maleic anhydride, amides of said acids, acrylonitrile, methacrylonitrile, and 5 of one or more acrylic polymers by a copolymerizable monomer having a polar group such as N-vinyl-2-pyrrolidone.
The one or more acrylic polymers differ from prior art adhesive materials in that they can provide up to 0 mol % of
A homopolymer of an acrylic ester monomer, such as a homopolymer of methyl acrylate, or a copolymerizable polar monomer with an acrylic ester monomer having a Tg within the range of 80° C. It may be a combination. Useful acrylate monomers that homopolymerize to a Tg of at least -10°) include methyl acrylate, methyl methacrylate, ethyl methacrylate, profyl methacrylate, butyl methacrylate, bornyl acrylate, bornyl methacrylate. , 2-7 enoxyethyl acrylate, M2-phenoxymethyl acrylate, mono- and di-methyl and ethyl esters of itaconic acid, and mono- and di-methyl and ethyl esters of maleic acid. Useful acrylate monomers that provide low Tg include ethyl acrylate, zotyl acrylate and octyl acrylate and n-aryl methacrylate, hexyl methacrylate and octyl methacrylate. Methyl methacrylate 43 mol Lead, methyl acrylate 53 mol%
and a copolymer with 4 mol% acrylamide has a Tg of about 50
℃ was hairy. A copolymer of 73 mole % methyl methacrylate, 19 mole % methyl acrylate, 4 mole % ethyl acrylate and 4 mole % acrylamide had a Tg of about 79°C.

The heat-tack adhesive material is typically used in the present invention at a temperature of about 40°C or higher, preferably 75°C.
Becomes pressure sensitive and extremely sticky when heated to or above temperatures. It is possible to maintain adequate bond strength when subsequently exposed to temperatures at or above the bonding temperature. Conductive particles can be dispersed in an adhesive material to form a conductive bond, and the particles and adherend tend to be held in their bonded position by the strong adhesive material at room temperature as well as at elevated temperatures.

Other copolymerizable monomers may also be used in small amounts without reducing the above values of the acrylic copolymer for the purposes taught in this application. Among such copolymerizable monomers are styrene, vinyl acetate, and vinyl chloride, each of which may be used in amounts up to about 5 mole percent of total monomers.

Other heat-activated adhesive materials used include hot melt adhesive materials, which are thermoplastic materials, and epoxy-based adhesives, which are typically softened to a flowable state and then cooled to form an adhesive layer. It is a reactive composition such as Sheet materials where the adhesive is pressure-sensitive at room temperature are also pressure-sensitive adhesives on flexible supports under circumstances where the bonded electrical connections formed using the sheet material experience high environmental temperatures and pressures. The benefits of the present invention may also be obtained by using a conductive element having the size relationships taught herein with a layer of an agent.

The conductive particles 14 in the sheet material of the present invention shown in FIGS. 1 and 2 are flattened to a typical conventional thickness. For example, a batch of originally spherical particles can be sieved or passed through nip rolls such as a paint mill. See US Pat. No. 3,475,213. Flattened particles are particularly desirable. This is because the particles are on the flattened side and a high percentage of the particles participate in conduction through the adhesive layer in the adhesive layer. Spherical particles are also useful, especially when sieved into narrow ranges of size such that a high percentage of particles are approximately the same size. The particles must be sufficiently strong or hard to penetrate the insulating layer during the bonding operation. The particles are usually metal, preferably silver, but alternately # or aluminum (the additives described in U.S. Pat. No. 3,475,213 are desirable to achieve compatibility).
, or various other metal-coated particles such as metals, glass beads, carbon particles, etc. The conductive elements may also take the form of material embossed from the conductive support, such as embossed protrusions from metal foil as taught in U.S. Pat. No. 3,497,383.

Alternatively, small particles closely packed together can form cores containing conductive elements.

The particles can range in thickness from at least 10 micrometers to 500 micrometers, although the preferred range for presently intended products is from about 20 micrometers to 100 micrometers. The layers may range in thickness from at least 6 micrometers to 450 micrometers. (The average thickness of the adhesive layer measures the approximate volume of adhesive material in the layer E7
, which is then determined by dividing this volume by the area of the sheet material. ) It is generally difficult to obtain a good adhesive layer to the substrate when the average thickness of the adhesive layer is less than about 60% of the average thickness of the conductive elements.

[Although] the adhesive layer is significantly thinner than the conductive III element,
Thus, a durable, low resistance electrical connection of a preferred construction is generally obtained by making the adhesive layer with an average thickness of about 90% or less of the average thickness of the conductive elements. The best results are obtained when the average thickness of the N, Fi, adhesive layer is about 70% to 80% of the average thickness of the conductive element.

As a corollary of the foregoing discussion, and as a further contribution to durable low resistance electrical connections, the upper edges of substantially every conductive element of the preferred construction include an adhesive layer surrounding the particles. higher than at least a part of That is, the dimension 16 of substantially each particle 140 in FIG. 1 is larger than the dimension 17 of the adhesive layer at at least some points on the outer surface of the adhesive by surrounding the particle. Preferably, substantially all of each particle is surrounded by a surface of the adhesive layer that is no higher than the upper edge of the conductive element. It is also preferred that the conductive elements are substantially all separated on the average by at least the average diameter of the elements, more typically the average diameter to fit the support around the elements during the bonding operation. 4 or 5 times or more. On the other hand, the conductive elements preferably occupy at least 2%, more preferably at least 4%, of the area of the sheet material.

A layer 15 of electrically insulating material provides effective electrical insulation over the conductive particles 14 of the structure shown in FIGS. 2 and 3 as thin as 10 micrometers in thickness.

A resistance of at least 1 megohm to conductive particles through layer 15 must be achieved. Resistance is measured by placing the test sample on a 13 square steel substrate, with the outer surface of the insulating layer of the sample facing the substrate, and then placing a 5001 weight on the test sample at room temperature. An electrical connection is previously made between the metal conductor and the conductive layer of the test specimen, for example the strip of sheet material 12 shown in FIGS. 1 and 2.

Ground the copper board and apply a voltage of 5 ports to the metal conductor,
The resistance of the circuit is then measured.

Preferably, the insulating layer 15Fi includes the same or similar material as the adhesive material 13 in which the conductive particles 14 are dispersed.

The heat-tack adhesive taught in the aforementioned co-pending application is a preferred material. One advantage is that the adhesive bond is maintained even if the adhesive surface is not cooled to room temperature. be adhesive over a wide temperature range. In some cases, the insulating layer may include various thermal tack adhesives having a lower glass transition temperature (Tg) than the adhesive material, in which conductive particles are dispersed. Good. A higher Tg adhesive material will provide more strength at room temperature, while a lower Tg insulating layer will flow more easily and will aid in the formation of the desired adhesive layer.Hot melt adhesive or reactive composition. Other adhesive materials may also be used, such as.

In the embodiment of the sheet material shown in FIGS. 1 and 2, the particles 14Vi are only partially embedded in the layer of non-conductive adhesive material 13.

Further, the insulating layer 15 has a constant thickness of 9, and moreover conforms to the contour left by the protruding particles. The result of this is that there are small valleys between adjacent particles in which the insulating material is advantageously moved during the bonding operation.

The displacement of the insulating material causes the adhesive material 13 and particles 14 to be placed only on top of the conductive stripes 12, thus leaving further valleys between adjacent stripes.

In a less preferred embodiment of the sheet material of the invention, the outer surface of the insulating layer is planar, such as when the conductive particles are immersed in an adhesive layer of substantially the same thickness as the particles. Such embodiments are preferably used with terminal substrates that apply higher pressures at the locations where they are bonded to move the insulating material. For example, the terminal pads may be slightly elevated to apply more pressure on the insulating and adhesive materials between the terminal pads and the conductive strip or layer.

The sheet material embodiments shown in FIGS. 1 and 2 illustrate other desirable percentages of the present invention. That is, the adhesive surface of the sheet material has at least one surface of the adhesive.
It may be desirable to contour the adhesive surface by contouring the portions, for example those located in the spaces between the conductive stripes, below the other portions of the bonding surface. Accordingly, some of the adhesive material in the portions of the conductive stripes can migrate to the loose areas between the stripes during the bonding operation, and the conductive elements are kept in tighter electrical bond with the substrate. Such displacement occurs in proportion to the degree of migration of the adhesive material and the degree of heat and pressure applied to the adhesive material during the adhesive operation. Because the heat-adhesive adhesive material does not flow extensively during the bonding operation, the flexible column supports can conform to the contoured thickness of the adhesive layer. The dull areas of the adhesive layer are at least 10%, preferably at least 2% below the average height of the uneven areas of the adhesive layer.
It is desirable to set it at 5%. The insulating layer 15 of the embodiment of FIGS. 1 and 2 is of fairly constant thickness and conforms to the contour left by the protruding particles and adhesive material 13.

After adhering to a substrate, the contact surface of the sheet material of the present invention generally follows the surface of the substrate. The Dango substrate in which the sheet material of the present invention is used is planar with terminal pads embedded within the substrate;
However, it is flush with the rest of the substrate. In this case, the sheet material of the invention forms generally planar, full contact with the substrate. However, preferably the terminal pads are slightly elevated as described above. In a finished bond, the conductive element also allows any necessary dielectric breakdown through the bonding material, yet has a sufficient proportion of the thickness of the bonding layer to obtain conduction between the conductive strip and the substrate to which the sheet material is bonded. occupies The conductive element preferably occupies a small portion of the area of the adhesive surface and covers a small area with respect to the area of the conductive stripes in order to leave a substantial portion of the adhesive in contact with the adherend. Together the elements provide a conductive adhesive layer that is conductive through the layer but not laterally within the layer.

In some embodiments of the invention, as shown in FIG.
The conductive adhesive 20 is spread over one side of the sheet material of the present invention, thereby eliminating the need for limited deposition of conductive adhesive on only the conductive stripes. Since the conductive adhesive is not laterally conductive, the IIL contact stripes 7'21 are electrically isolated from each other. The conductive particles 22 in the conductive adhesive connect from the conductive stripes 21 to the terminal pads with which the stripes are aligned only through the adhesive.

Another type of sheet material of the present invention, shown in FIG. 4, includes a conductive support 24 extending over the entire extent of the sheet material. Sheet materials with such supports, which may take the form of metal foils or metallized polymeric films, can be used to produce ground connections, such as between metal chassis and components mounted on the chassis. It is useful for

FIG. 5 illustrates a different embodiment of the invention in which both the insulating layer 26 and the conductive adhesive 270 are applied only on the conductive stripes 28, and the spaces between the stripes are filled with a different adhesive 29. Explain in detail. For example, a pressure sensitive adhesive can be used to provide the sheet material with warm-temperature adhesion to the substrate, which is subsequently supplemented by heating the insulating layer and conductive adhesive on the stripes 28.

A hot melt or reactive adhesive could also fill the spaces between the stripes.

The sheet material of the present invention can be applied with a low adhesion layer on a release liner placed on a non-stick adhesive side, or on an insulating layer, especially in the case of a stretched tape wound on itself in the form of a roll. including. A primer may also be applied to the polymeric or metallic support to promote adhesion to adhesive or insulating layers carried on the support.

The sheet material of the present invention is generally applied by aligning one end of the tape onto the desired substrate on which the connection is to be made, pressing the sheet material against the substrate, and simultaneously heating the sheet material.

The transferable adhesive sheet material of the present invention can be placed between a desired adhesive and a bonded electrical connection made by applying heat and pressure. In such transferable adhesive sheet materials, the conductive elements may be dispersed in the adhesive material forming the support web of the element, and the insulating layer may be disposed on one or both sides of the particle-containing web, and the electrically conductive elements may be disposed on one or both sides of the particle-containing web, and may protrude from both sides of the web. Alternatively, the material in which the particles are dispersed is a non-adhesive polymeric film, provided by an adhesive or insulating layer. Similarly, in Figure 1, ↓Hi#, 2
Layer 13d of the product shown in the figure may be non-adhesive, for example to respond to a durable firm condition.

The invention is further illustrated by the following examples.

Example 1 A polyethylene terephthalate film with a thickness of 25 micrometers was deposited on one side through a mask with a miso paste.
875 micrometers wide continuous stripes of pots spaced 75 micrometers apart formed a continuous stripe approximately 40 nm thick (40 nanometers).
and had an electrical resistance value of 4 ohms for a length of 1 cfn. The conductive adhesive was 10.4% by weight of methyl methacrylate, 85% by weight of methyl acrylate dissolved in ethyl acetate.
4.9 parts by volume of acrylic tar/IJ mom containing 6% by weight and 4% by weight of acrylamide were added to 5.1 parts by volume of copper particles.
Produced by mixing with parts by volume. Particles are 14
0 mesh sieve (US standard, mesh size 10
5 micrometers) and remains on a 170 mesh sieve (88 micrometers).
The particles were then flattened through a roller mill to a thickness of about 48 micrometers. The adhesive and particle mixture was applied in superposition onto the conductive stripes by applying through an aperture mask. After drying, the adhesive terpolymer occupied a thickness of about 20 micrometers. An insulating layer of an acrylic terpolymer containing 40% by weight ethyl acrylate, 56% by weight methyl acrylate, and 4% by weight acrylamide dissolved in ethyl acetate at a solids content of about 25% by weight was then applied to the sheet material by bar coating. The entire surface was coated to cover the adhesive coated stripes and the film support between the stripes. After drying, a layer of approximately 10 micrometers of fairly constant thickness was formed as shown in FIG. The ratio of the combined thickness of the adhesive layer and the insulating layer (30 micrometers) to the average thickness of the particles is 62.5.
%Met.

The resistance value of the layer measured by the above method is about 1000
Atsuku in Megohm. For comparison, a similar tape without the insulating layer was manufactured and found to exhibit a resistance of 10 ohms.

150 bonds per square inch (10,5k
The tape was adhered to the conductive terminal pads of a printed circuit test board by pressing the tape with a force of 100 g per square inch and then heating the edge of the tape to a temperature of 170° C. for 5 seconds. After the connection was allowed to cool, the resistance in the connection was measured by the four-terminal resistance method and found to be 10 milliohms. support,
The surface was roughened as shown in FIG. The peel strength of the adhesive against the substrate was also measured by A8TM D-1000 and was found to be from 2.5 pounds per inch width to 5 bonds per inch width (from 0.45 kg per inch to 0.9 kg per inch width). Do you get it.

Example 2 Sufficient adhesion of a mixture of two different tapes of the type described in Example 1 with particles that are flattened and are about 40 micrometers thick, giving an adhesive layer about 15 micrometers thick. Material and two different thicknesses, namely one (Example 2
A) is about 9 micrometers and the other (Example 2B) is about 21 micrometers.
Manufactured using micrometer insulation layers. The ratio of the combined thickness of the adhesive layer and the insulating adhesive layer to the average particle is Example 2
60% for humans and 90% for Example 2B.

Cut a piece of tape to size and heat it at 150℃ for 5 minutes.
Using a pressure of 200 psi per second, indium tin oxide (I
T O) Adhered between the vapor deposition surfaces. Dual connections made to each tape's ITO test panel were monitored for individual contact resistance using a four-wire ohmic method. The test panels were cycled between -40°C and 105°C every 4 hours.

Table 1 below shows the results of the maximum contact resistance values observed during the reported test period. The data is 6 for the particle thickness.
12 showed stable electrical performance during thermal cycling for structures using adhesive thicknesses in the range of 0% and poor electrical performance when the deposited adhesive thickness was 90% of the particle thickness. show.

In other tests, tapes with a 90% adhesive thickness to particle thickness ratio provided adequate stability with fewer temperature cycles and shorter times.

Table 1 Influence of adhesive thickness on performance in thermal aging test 1 The following points were made: (1) 1 To give the Zorode tack values at various test temperatures, the annular weight was heated above 220°C. 1. Heat the Zorode and the annular weight to the test temperature, but not.

(2), Sorode end has an inner and outer diameter of 3.83m1+
and a 5.10M ring.

(3), the annular weight is 19.8 g.

(41. Determine the Zoroso tack value as described in A8TM D-2979, except for a 10 second pause.

2. Shear values are determined by heating bright annealed stainless steel panels in an oven for 15 minutes at 115° C. above the weight average Tg of the adhesive polymer. With the steel panel horizontal, place two pieces of 1-27cm wide tape in each direction.
2 0.4 that meets US Federal Standard 147
Glue to the steel panel using a kg hand roller. Accurately measure the length of the tape to be adhered to the panel: 1-2751
This assembly was trimmed to 15% at the bonding temperature.
I left it for a long time. The plate is transferred at its top to a dryer with a shear stand that provides a large 2° backward tilt of the panel (the shear weight advances the tape slightly into the panel).

After 15 minutes at 65°C, a 1 kg weight is suspended from the free end of the tape. The time for the weight to fall after that is 65 degrees Celsius.
is the shear value of

[Brief explanation of the drawing]

FIG. 1 is an enlarged perspective view of the distal end portion of an exemplary electrical connector tape of the present invention, and FIG. 2 is a cross-sectional view of the exemplary electrical connector tape of the present invention shown in FIG. 3 through 5 are cross-sectional views of various exemplary electrical connector tapes of the present invention. 10: Tape 11: Flat electrically insulating sheet 12. 21. 28: Conductive stripe 13: Non-conductive adhesive material 14. 22: Conductive particles 15: Thin layer of electrically insulating material 16: Substantial dimensions of each particle 17: Adhesive Dimensions of layer 20.27: Conductive adhesive 24: Conductive support 26: Insulating layer 29: Adhesive agent Asamura Kogai 4 person procedural amendment (taste) June 1981 lb. To the Commissioner of the Patent Office 1. - Display of 11 cases Patent Application No. 234985 of 1982 2, Title of Invention Related to the formation of electrical connections bonded to a substrate Patent Applicant's Address Address: 1980 Month, Day 6, Supplement 11: Inventions that increase due to Number 7, Supplement 11: Subject (1) Claims are corrected as shown in the attached sheet. [2. Claims (1) Substantially the same as or -tm
A thin layer of electrically insulating material, in a sheet material suitable for the formation of electrical connections adhered to a substrate, in which a monolayer of thick, discrete and isolated conductive elements is dispersed. is distributed over said single layer of conductive element, and the silE layer of insulating material is tack-free or tack-free at room temperature and exhibits an electrical resistance through the layer to the conductive element in the tests described herein. value is at least 1
It is a megohm, which softens to an adhesive and flowable state when heated to a cylindrical radius, and then assumes a firm and substantially non-flowing state when cooled to room temperature, which makes the material easy to kiln and handle. and does not contain a conductive adhesive at room temperature, but can be pressed and heated in one layer to the substrate to form a bonded contact M in which the conductive element extends through the insulating layer and into electrical connection with the substrate. That't
- a sheet material suitable for forming electrical connections adhered to a substrate, characterized in that 2. The sheet material of claim 1, comprising at least one conductive layer underlying said single layer of conductive elements. (3) Conductive adhesive mt- supported on insulating queso
A sheet of material adhered to a substrate that fails to form an electrical connection, including discrete conductive l! a thin electrically insulating layer disposed over the single layer of conductive elements and a non-conductive heat-activated adhesive material having a conductive element dispersed therein; In the test described in the specification, the conductivity required through the layer T
has an electrical resistance value of at least 1 megohm to A;
It softens to an adhesive and flowable state when heated to high temperatures and then becomes solid and substantially torrent when cooled to room temperature.
The sheet material is easily handled and contains no conductive adhesive at room temperature, but is pressed to the board and heated to allow the conductive elements to pass through the insulation NII to the board. A sheet material suitable for the production of electrical connections glued to a substrate, characterized in that it is capable of forming stretched, tangential electrical connections. (4) The sheet material of claim 3 further comprising at least one electrically conductive layer supported on an insulating wafer, and wherein an adhesive layer is disposed in contact with the electrically conductive layer. 15) The sheet material of claim 1184, wherein there are multiple conductive layers covering a limited portion of the insulation material. 6. The sheet material of claim 5, wherein said plurality of conductive layers comprises narrow parallel elongated conductive stripes. (7) The sheet material of claim 5, wherein the conductive adhesive layer extends only over the plurality of conductive layers. (8) The conductive element is disposed only over the conductive layers. Sheet materials in range 5. (9) The sheet material according to claim 5, wherein the four-electrode adhesive is spread over the insulating material covering both the conductive layer and the interlayer space. The sheet material of claim 7, 8, or jIP, which is spread over a piece of wood covering both. αυ conductive adhesive is placed only on the conductive stripe,
The outer surface of the conductive adhesive is raised above the outer surface of the tape between the conductive stripes, and the electrically insulating material is spread over the entire web, and the conductive strip covered with adhesive and the raised surface between the stripes are 7. A sheet material as claimed in claim 6 in which the sheet material is a layer of substantially constant thickness, following the contour of the non-contact portion. a3 A sheet material according to claim 117, in which different adhesive materials are arranged between the conductive layers. The outer surface of the insulating layer is located above the conductive layer and has a higher i than the part between the layers. Contoured with %IPF#11
A sheet material according to any one of Items 5 to 12 of Item 181. I.11L has an average thickness greater than the average thickness of the polymeric layer or adhesive layer, and substantially the upper edge of the 11 wood is the outer surface of the polymeric layer or adhesive layer surrounding the element. higher than at least one part of %#! F. A sheet material according to any one of claims 1 to 16. (4) When heated to a high temperature, it softens to adhesive property 11, and then hardens in home appliances to form a strong and substantially non-flowing property II.
in a sheet material suitable for forming an electrical connection adhered to a substrate that exhibits a monolayer of discrete and separated conductive elements dispersed in an adhesive layer, wherein the conductive elements have a thickness greater than the average thickness of the adhesive layer. forming an electrical connection adhered to a substrate having a large average thickness and substantially such that the upper edge of each element is higher than at least a portion of the outer surface of the adhesive layer surrounding the screen; Sheet material packed in Oasli! ! The average thickness of the layer material is conductive l! The average thickness of the raw material is approximately 60 gk and 90
11. The sheet material of claim 15, wherein the sheet material is between 11 and 11. 171 The aS of claims wherein the conductive elements are on average separated by a distance equal to at least the average diameter of the elements
Sheet material according to Item 15 or Item 16 of Fushimi. The average thickness of the conductive elements must be 100 micrometers or less, and the adhesive layer strength is 90 μm!
The sheet material of claim I [claim 15 or 16 O as a flexible support on which an adhesive layer is carried, carrying a micrometer or less
. The sheet material according to any one of claims 15 to 18, comprising a substrate, wherein the support is a polyester film having a thickness of about 50 ffm or less. Section 19 sheet materials. f2g Sheet material 0 of claim 181 family 19 or claim 1120 comprising a conductive layer between the flexible support and the adhesive layer (2) comprising a number of conductive layers in the form of narrow parallel conductive stripes; The sheet material according to claim 21, in which the 0 (to) 4111 support is disposed in the adhesive layer only on the conductive strip 21. (To) The outward direction of the trapping area is such that at least a part of the outward direction above the space between the conductive stripes is higher than the other part of the surface.
23. A horizontal sheet material according to claim 22 or 23, which is formed so as to taper downward. (e) The adhesive layer is a thermal adhesive having a probe tack of at least 75 II at temperatures of 40° C. or higher.
Sheet material of any one item up to part gL. (to) At least one polymerizable adhesive layer or insulating layer contains 1s't or more of an acrylic polymer, and (υ) an acrylic ester monomer is present in one or more of the adhesive layers. At least 150 ml of acrylic polymer St.
- given, (2) the Tgt or weight average temperature of the one or more acrylic polymers is 110° from 0 to 80°C9, and (3) the adhesive layer is (&) the probe tack value is less than 75 gf at 20°C; and wherein the adhesive layer adheres satisfactorily to a clean substrate upon contact at any temperature within the range of 50° C. A sheet material according to any one of Item 1. @ The adhesive layer contains one or more monomers of an acrylic copolymer, of which up to 50 mol S is 7-dilute acid,
At least one copolymerizable monomer selected from methacrylic acid, itaconic acid, maleic acid, maleic anhydride, acids of the above acids, acrylonitrile, methacrylonitrile, and vinyl-2-pyrrolidone. , the sheet material of claim 22. - the acrylic cough ester monomer has 1 on its alkyl group;
alkyl acrylates having from 1 to 8 graft atoms, alkyl methacrylates having from 1 to 8 graft atoms in the alkyl group, bornyl acrylate, bornyl methacrylate, 2-7 dinoxy ether acrylate;
2-phenoxymethyl acrylate, itaconic acid mono-
and di-methyl and ethyl esters, and maleic acid mono- and di-methyl and ethyl esters. The sheet material of claim 826JJS827 or claim 28, characterized in that at least one of styrene, vinyl acetate, and vinyl chloride constitutes up to 5 moles of total monomer. - a thin layer of electrically insulating material is disposed on said single layer of electrically conductive element, said layer of insulating material being tack-free or poorly tack-free at room temperature and in the tests described herein. A patent having an electrical resistance through the layer to the conductive element of at least 1 megohm, which softens to an adhesive and flowable state when heated to an elevated temperature, and then becomes rigid and substantially non-flowing when cooled to room temperature. Claims WA No. 15
Sheet material according to any one of items 1 to 24. 61) A sheet material according to any one of claims 1 and 2 to 14, wherein the conductive adhesive contains the same monomeric component as the electrically insulating layer. Any one of claims 181 to 29, wherein the outer case of the adhesive layer has a contour such that the 5 liter portion is at least 10 mm thicker than the other portion of the surface.
Section sheet material. (to) When heated to high temperatures, it softens to an adhesive state and then hardens to a firm and substantially non-tIL dynamic state at room temperature.
i a sheet material suitable for forming electrical connections adhered to a substrate comprising an adhesive layer as shown and a monolayer of discrete, separated electrically conductive elements dispersed in the adhesive layer; At least one surface portion of the layer has a greater volume of adhesive material than other portions of the layer and is recessed lower than the other portions of the surface, thereby providing a greater volume of adhesive material relative to the substrate. When the layer is heated and pressurized, the adhesive material can be displaced into the recessed areas and conductive [2] lAt-substrate and v! A sheet material characterized by being electrically associated with i-contact. - A sheet material according to claim 33.1, wherein the average thickness of the adhesive layer in at least the non-recessed areas is greater than the average thickness of the conductive elements in these areas. (to) Claim 63 or 64, wherein the conductive element has an average thickness greater than the average thickness of the complete adhesive layer.
Sheet materials listed in Section. (to) A sheet material OCD adhesive according to any one of claims 66 to 35, wherein the conductive IL elements are on average separated by a distance equal to at least 4 average diameters of the elements. A sheet material according to any one of claims 36 to 36 comprising a flexible support on which the layer is carried, the support having a thickness of about 50 micrometers or less. The sheet material according to claim 67 which is a polyester film O (to) The sheet material according to claim 8 comprising a conductive layer between the flexible support and the adhesive layer sheet material. - Sheet material according to claim 59, comprising a plurality of conductive layers in the form of narrow parallel conductive stripes. Sheet material according to claim 40, in which the conductive shrapnel is disposed in the adhesive layer only on the conductive stripes (6) At least one of the outer surfaces overlies the spaces between the conductive stripes A sheet material according to claim 40 or claim 41, wherein the portion is recessed below the other portion of the surface and is useful as an adhesive and on both surfaces opposite the adhesive layer. A sheet material according to any one of claims 66 to 66 suitable for forming an adhesive layer on. - The sheet material according to claim 8, wherein the surface of the adhesive layer opposite the one surface having the recessed skin portion is releasably laminated to a release backing paper. - A sheet material according to claim 66 or claim 34, wherein the adhesive layer is a heat-adhesive adhesive exhibiting a Nord tack value of at least 75 I at temperatures of 40 DEG C. or higher. - the adhesive layer contains 111 or more acrylic monomers, and (1) the acrylic ester monomer is the ia of the adhesive layer;
(2) provide at least 50 moles of an acrylic polymer having an acrylic polymer of 1111 or more;
(3) The adhesive layer has a tackiness value of 75 gf at (IL) 20°C.
less than (a) a Proso tack value of at least 75 gf over a range of at least 50°C, this value being substantially constant after 30 days at 40°C, and a new value of at least 25 gf at -(0)65°C; %, and the adhesive layer adheres satisfactorily to a clean substrate upon contact at any temperature within the range of 50°C. Sheet material〇1η The adhesive layer contains one or more monomeric acrylic layer polymers, up to 50 moles of which are acrylic acid, methacrylic acid, itaconic acid, !leic acid, !leic acid anhydride. , the sheet of claim 46, which is at least 4181 copolymerizable monomers selected from the group consisting of and of the acid, acrylonitrile, methacrylonitrile, and N-vinyl-2-pyrrolidone. Materials: - alkyl acrylates in which the acrylic ester monomer has from 1 to 8 carbon X atoms in its alkyl group;
Alkyl methacrylates having from 1 to 8 carbon atoms in the alkyl group, acrylic bornyl, bornyl methacrylate, acrylic & 2-7 dynoxyethyl, 2-phenoxymethyl acrylate, mono- and di-methyl itaconic acid and ethyl esters, and from maleic seven-no and di-methyl and ether esters! Sheet material of Section 1846 or Section 47. The sheet material of claim 46, 47 or 48'sA, characterized in that at least one of styrene, vinyl acetate and vinyl chloride is present in an amount of up to 5 moles in total.

Claims (1)

Claims: (+) a substrate comprising a polymeric layer having dispersed therein a monolayer of discrete, discrete electrically conductive elements substantially the same as or thicker than the thickness of the IIE polymeric layer; In sheet materials suitable for forming bonded electrical connections, a thin layer of electrically insulating material is disposed on said single layer of electrically conductive elements, said layer of insulating material being tack-free or poorly tack-free at room temperature. ,
In the tests described herein, the electrical resistance through the layer to the conductive element is at least 1 megohm, softens to an adhesive and flowable state when heated to high temperatures,
The sheet material then assumes a strong and substantially non-flowing state upon cooling to room temperature, which allows the sheet material to be easily handled, yet at room temperature the conductive bond is pressed and heated against the substrate. A sheet material suitable for bonding an electrical connection to a substrate, characterized in that it is capable of forming a bonded connection in which the conductive elements extend through the insulating layer to the substrate and the electrical connection. 2. The sheet material of claim 1, comprising: (2) at least one conductive layer underlying said single layer of conductive elements. (3) a sheet material suitable for forming electrical connections adhered to a substrate, comprising a conductive adhesive layer carried on an insulating web, wherein the adhesive layer is substantially the same in thickness as the adhesive layer; a thicker, non-conductive heat-activated adhesive material having discrete, discrete electrically conductive elements dispersed therein and a thin electrically insulating layer disposed over said single layer of electrically conductive elements, said insulating layer being tack-free at room temperature. or poor adhesion, having an electrical resistance value of at least 1 megohm through the layer to the conductive element in the tests described herein, which softens to an adhesive and flowable state when heated to high temperatures and then cooled to room temperature. It then assumes a strong and substantially illiquid state1.
This allows the sheet material to be easily handled,
and a substrate characterized in that it does not contain an electrically conductive adhesive at room temperature, but can be pressed and heated against the substrate to form a bonded electrical connection in which the electrically conductive elements extend through the insulating layer to the substrate. sheet material suitable for the manufacture of electrical connections adhered to a sheet material (4) further comprising at least one electrically conductive layer supported on an insulating web, the adhesive layer being in contact with the electrically conductive layer [7]; , the sheet material according to claim 3. (5) The sheet material of claim 4, wherein there are multiple conductive layers covering a limited portion of the insulating web. 6. The sheet material of claim 5, wherein said plurality of conductive layers comprises narrow parallel elongated conductive stripes. (7) The sheet material of claim 5, wherein the conductive adhesive layer extends only over the plurality of conductive layers. (8) The sheet material of claim 5, wherein conductive elements are arranged only on the conductive layer. (9) The conductive adhesive is spread over an insulating web covering both the conductive layer and the space between the layers.
Section sheet material. Claim 7, wherein the insulating material extends over an insulating web covering both the conductive layer and the space between the layers.
Sheet material according to paragraph 8 or paragraph 9. aυ, the conductive adhesive is placed only on the conductive layer stripes,
The outer surface of the conductive adhesive is raised above the outer surface of the tape between the conductive stripes, and the electrically insulating material is spread over the entire web and the adhesive-covered conductive stripes and the unstretched conductive strips between the stripes are raised. 7. A sheet material as claimed in claim 6 in a layer of substantially constant thickness that follows the contour of the part. 0, different adhesive materials are arranged between the conductive layers,
- Sheet material according to claim 7. (13. The outer surface of the insulating layer is contoured with a portion located above the conductive layer and higher than the portion between the layers,
A sheet material according to any one of claims 5 to 12. (14, the conductive elements have an average thickness that is greater than the average thickness of the polymeric or adhesive layer [7, and substantially the upper edge of each element lies on the outer surface of the polymeric or adhesive layer surrounding the element) 051, which softens to an adhesive state when heated to high temperatures and then hardens at room temperature to form a strong and In a sheet material suitable for forming electrical connections adhered to a substrate which exhibits a substantially non-flowing state and which comprises a monolayer of discrete and separated conductive elements dispersed in an adhesive layer, has an average thickness greater than the average thickness of the adhesive layer, and substantially each element has a top edge higher than at least a portion of the outer surface of the adhesive layer surrounding the element. Sheet material suitable for forming electrical connections.
16. The sheet material of claim 15, wherein the sheet material is between 0% and 90%. 071. The sheet material of claim 15 or 16, wherein the conductive elements are on average separated by a distance equal to at least the average diameter of the elements. Group a The conductive elements have an average thickness of 100 micrometers or less, and the adhesive layer has an average thickness of 90 micrometers or less, according to claim 15 or 16. sheet material. 0. Any one of claims 15 to 18, including a flexible support on which an adhesive layer is supported.
Section sheet material. Claim 1, wherein the support is a polyester film with a thickness of about 50 micrometers or less.
Section 9 sheet materials. Ql) A sheet material according to claim 19 or 20, comprising an electrically conductive layer between the flexible support and the adhesive layer. 22. The sheet material of claim 21, comprising: (2) a number of conductive layers in the form of narrow parallel conductive stripes. (c) The sheet material of claim 22, wherein the conductive elements are disposed in the adhesive layer only on the conductive stripes. +p, t+, the outer surface of the adhesive layer is formed in such a way that at least a part of the outer surface above the space between the conductive striazos is recessed below the other part of the surface. Sheet materials of paragraph or paragraph 23. (c) Any one of claims 1 to 24, wherein the adhesive layer is a thermoadhesive adhesive exhibiting a Sollode tack value of at least 759 at a temperature of 40°C or higher. Section sheet material.伽), at least 411 polymerizable adhesive layers or insulating layers contain one or more acrylic polymers, and (1) the acrylic ester monomer is present in one or more of the adhesive layers; (2) T of the one or more acrylic polymers;
gt or weight average Tg is from 110°C to 80°C, and (3) the adhesive layer has a tack value of less than 75 gf at 20°C; (c) a shear value of at least 25 minutes at 65°C; 25. A sheet material according to any one of claims 1 to 24 which adheres well to a clean substrate upon contact at any temperature within the range of 0.degree. The adhesive layer contains one or more acrylic polymer monomers, up to 50 mol% of which are acrylic acid, methacrylic acid, itaconic acid, maleic acid, maleic anhydride, ami-P of the above acids, Sheet material 0 (c) of claim 26, which is at least one copolymerizable monomer selected from acrylonitrile, methacrylonitrile, and N-vinyl-2-pyrrolidone; alkyl acrylates having from 1 to 8 carbon atoms in the alkyl group, alkyl methacrylates having from 1 to 8 envy atoms in the alkyl group, bornyl acrylate, methacrylate 2-phenoxy-ethyl acrylate, 2-phenoxymethyl acrylate, mono- and di-methyl and ethyl esters of itaconic acid, and mono- and di-methyl and ethyl esters of maleic acid. Range 26th or 27th
Section sheet material. 29. A sheet material according to claim 26, 27 or 28, characterized in that at least one of styrene, vinyl acetate and vinyl chloride constitutes up to 5 mole % of the total monomers. (to) a thin layer of electrically insulating material is disposed on the single layer of electrically conductive element, and the layer of insulating material is tack-free or poorly tack-free at room temperature; has an electrical resistance through the layer to the conductive element of at least 1 megohm in a test conducted at high temperatures, softens to an adhesive and flowable state when heated to an elevated temperature, and then assumes a rigid, substantially non-flowing state when cooled to room temperature. , claim 1
Sheet material according to any one of items 5 to 24. @11. The sheet material according to any one of claims 2 to 14, wherein the conductive adhesive contains the same monomeric components as the electrically insulating layer. 29. A sheet material according to any one of claims 1 to 29, wherein the outer surface of the adhesive layer has a contour such that a portion of the surface is at least 10% more rounded than the rest of the surface. .