JPS6030149A - Push-up needle for pellet - Google Patents
Push-up needle for pelletInfo
- Publication number
- JPS6030149A JPS6030149A JP13881283A JP13881283A JPS6030149A JP S6030149 A JPS6030149 A JP S6030149A JP 13881283 A JP13881283 A JP 13881283A JP 13881283 A JP13881283 A JP 13881283A JP S6030149 A JPS6030149 A JP S6030149A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- needle
- semiconductor
- masking sheet
- diamond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明はペレット突上ニードルに係り、特に半導体組
立工程においてペレットボンディング装置に使用される
ペレット突上ニードルに関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a pellet ejection needle, and more particularly to a pellet ejection needle used in a pellet bonding apparatus in a semiconductor assembly process.
一般に、ペレットボンディング装置においては、第１図
に示すようなペレット突上ニードルが用いられる。すな
わち、マスキングシート１上に整列された半導体ペレッ
ト２をバキュームコレット３で吸着する際、この吸着を
容易にするため、すなわちペレット２のマスキングシー
ト１からの剥離を容易にするためペレット突上ニードル
３が用いられ、これによりマスキングシート１下より半
導体ペレット２を突き上げるものである。Generally, in a pellet bonding apparatus, a pellet projecting needle as shown in FIG. 1 is used. That is, when the semiconductor pellets 2 aligned on the masking sheet 1 are adsorbed by the vacuum collet 3, the pellet protruding needle 3 is used to facilitate this adsorption, that is, to facilitate the peeling of the pellets 2 from the masking sheet 1. is used to push up the semiconductor pellet 2 from below the masking sheet 1.
従来、上記ペレット突上ニードル４の材質としてンよ、
ｓ ｘｃ Ｈ＋ｚＬ タングステン、タンガロイ等が使
用されている。Conventionally, the material for the pellet thrusting needle 4 was
s xc H+zL Tungsten, Tungaloy, etc. are used.
しかしながら、この従来のペレット突上ニードル４は、
使用回数が多くなると摩耗し、先端部が平らになりやす
い。このため、半導体ペレット２のマスキングシート１
からの剥離が困難になり、半導体ペレット２の吸着ミス
になる。However, this conventional pellet thrusting needle 4
If used frequently, it will wear out and the tip will tend to become flat. For this reason, the masking sheet 1 of the semiconductor pellet 2
It becomes difficult to separate the semiconductor pellet 2 from the semiconductor pellet 2, resulting in a failure in adsorption of the semiconductor pellet 2.
また、マスキングシート片が半導体ペレット２の裏面に
付着することにより、製品の特性に悪影響を及ぼす。こ
れは、特に高速インデックスにおいて著しい。Furthermore, the masking sheet pieces adhere to the back surface of the semiconductor pellet 2, which adversely affects the characteristics of the product. This is especially true for high-speed indexes.
この発明は上記実情に鑑みてなされたもので、その目的
は、先端部の耐摩耗性を向上させ、半導体ペレットの吸
着を安定して行うことができ、かつ信頼性の高い製品が
得られるペレット突上ニードルを提供することにある。This invention was made in view of the above circumstances, and its purpose is to improve the abrasion resistance of the tip, to stably adsorb semiconductor pellets, and to obtain a highly reliable product. The purpose of the present invention is to provide a thrusting needle.
この発明は、半導体ペレットボンデイング装置における
マスキングシート上に整列された複数の半導体ペレット
を、バキュームコレラ）Ｋより順次吸着する際、この吸
着を容易にするため同半導体ペレットを同マスキングシ
ート下より突上げるペレット突上ニードルの少なくとも
その先端部をダイヤモンドにより形成するものである。This invention provides that when a plurality of semiconductor pellets arranged on a masking sheet in a semiconductor pellet bonding apparatus are sequentially adsorbed by a vacuum cholera K, the semiconductor pellets are pushed up from below the masking sheet in order to facilitate this adsorption. At least the tip of the pellet protruding needle is formed of diamond.
以下、図面を参照してこの発明の一実施例を説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第２図はこの発明に係るペレット突上ニードルの構成を
示すものである。このベレツ）Ｆ上ニードルＬユは例え
ば炭素工鋼ＳＫにより形成された本体１２の先端部にダ
イヤモンド１３を接着して構成されている。このダイヤ
モンド１３は先細であり、その先端形状は半球面となっ
ている。このダイヤモンド１３の形状の具体的な数値は
、例えば先端部の傾斜角θ−３０°以下、球半径Ｒ＝
０．０３ ｒＭ１以下、基端部の直径ｄ −０，２−以
下とする。FIG. 2 shows the structure of the pellet thrusting needle according to the present invention. The upper needle L is constructed by bonding a diamond 13 to the tip of a main body 12 made of carbon steel SK, for example. This diamond 13 is tapered, and its tip has a hemispherical shape. The specific numerical values of the shape of this diamond 13 are, for example, the inclination angle of the tip θ-30° or less, the radius of the sphere R =
0.03 rM1 or less, and the diameter of the proximal end d -0,2- or less.
第３図は上記ペレット突上ニードル１１の使用状態を示
すものである。すなわち、マスキングシート１上に整列
された複数の半導体ペレット２をバキュームコレット３
で順次吸着するもので、その吸着の際、上記ペレット突
上ニードル１１でマスキングシートＩを突き破ることに
より、半導体へＬ／ノットの吸着を容易にするものであ
る。FIG. 3 shows how the pellet thrusting needle 11 is used. That is, a plurality of semiconductor pellets 2 arranged on a masking sheet 1 are transferred to a vacuum collet 3.
During the suction, the pellet protrusion needle 11 breaks through the masking sheet I, thereby facilitating the suction of L/knots onto the semiconductor.
上記ペレット突上ニードル１１は、その先端部が硬度の
高いダイヤモンド１３で形成されているため、耐摩耗性
が同上し、平坦になることはない。従って、半導体ペレ
ット２の突上げを安定して行うことができ、バキューム
コレット３による吸着ミスがなくなり、良好なボンディ
ングが達成される。また、マスキングシート１を完全に
突き破ることができるため、半導体ペレット２の裏面に
マスキングシート片が付着するようなことがなく、製品
の特性に悪影勧を及ぼすこともない。Since the tip of the pellet projection needle 11 is made of hard diamond 13, it has the same wear resistance and does not become flat. Therefore, the semiconductor pellet 2 can be pushed up stably, there will be no suction errors caused by the vacuum collet 3, and good bonding can be achieved. Further, since the masking sheet 1 can be completely penetrated, there is no possibility that pieces of the masking sheet will adhere to the back surface of the semiconductor pellet 2, and the characteristics of the product will not be adversely affected.
以上のようにこの発明のペレット突上ニードルによれば
、先端部の耐摩耗性が向上するので、半導体ペレットの
突上げを安定して行うことができ、バキュームペレット
による吸着が安定化し、信頼性の高い製品が得られる。As described above, according to the pellet thrusting needle of the present invention, the abrasion resistance of the tip part is improved, so that semiconductor pellets can be stably thrusted, and the suction by the vacuum pellet is stabilized, resulting in improved reliability. A product with high quality can be obtained.
第１図は従来のペレット突上ニードルの使用方法を示す
構成図、第２図はこの発明の一実施例に係るペレット突
上ニードルを示す側面図、第３図は第２図のペレット突
上ニードルの使用方法を示す構成図である。
１・・−マスキングシート、２・・−半ｓ体ベレット、
３・・・バキュームコレット、１１・・・ペレット突上
ニードル、１２・・・本体、１３・・・ダイヤモンド。FIG. 1 is a block diagram showing how to use a conventional pellet ejection needle, FIG. 2 is a side view showing a pellet ejection needle according to an embodiment of the present invention, and FIG. 3 is a pellet ejection needle of FIG. 2. FIG. 2 is a configuration diagram showing how to use the needle. 1...-Masking sheet, 2...-Half-S body beret,
3... Vacuum collet, 11... Pellet protruding needle, 12... Main body, 13... Diamond.
Claims (1)
ート上に整列された複数の半導体ペレットをバキューム
コレットにより順次吸着する際、この吸着を容易にする
ため同半導体ペレットを同マスキングシート下より突上
げるペレット突上ニードルにおいて、少なくともその先
端部をダイヤモンドにより形成したことを特徴とするペ
レット突上ニードル。When a plurality of semiconductor pellets arranged on a masking sheet in a semiconductor pellet bonding apparatus are sequentially adsorbed by a vacuum collet, at least A pellet protruding needle characterized in that its tip is made of diamond.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13881283A JPS6030149A (en) | 1983-07-29 | 1983-07-29 | Push-up needle for pellet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13881283A JPS6030149A (en) | 1983-07-29 | 1983-07-29 | Push-up needle for pellet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6030149A true JPS6030149A (en) | 1985-02-15 |
Family
ID=15230814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13881283A Pending JPS6030149A (en) | 1983-07-29 | 1983-07-29 | Push-up needle for pellet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6030149A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0438054U (en) * | 1990-07-30 | 1992-03-31 | ||
| CN105742210A (en) * | 2014-12-26 | 2016-07-06 | 立德微精密私人有限公司 | Die pushing device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5753637B2 (en) * | 1981-10-12 | 1982-11-13 |
-
1983
- 1983-07-29 JP JP13881283A patent/JPS6030149A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5753637B2 (en) * | 1981-10-12 | 1982-11-13 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0438054U (en) * | 1990-07-30 | 1992-03-31 | ||
| CN105742210A (en) * | 2014-12-26 | 2016-07-06 | 立德微精密私人有限公司 | Die pushing device |
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