JPS5951537A - Bonding method and bonding tool - Google Patents

Bonding method and bonding tool

Info

Publication number
JPS5951537A
JPS5951537A JP57162575A JP16257582A JPS5951537A JP S5951537 A JPS5951537 A JP S5951537A JP 57162575 A JP57162575 A JP 57162575A JP 16257582 A JP16257582 A JP 16257582A JP S5951537 A JPS5951537 A JP S5951537A
Authority
JP
Japan
Prior art keywords
bonding
hole
pressure setting
metal ball
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57162575A
Other languages
Japanese (ja)
Inventor
Nobuhaya Takebashi
信逸 竹橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57162575A priority Critical patent/JPS5951537A/en
Publication of JPS5951537A publication Critical patent/JPS5951537A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To eliminate the displacement of a metal ball by bonding through the process that the metal ball is attracted by a pressure setting surface during a first bonding by forming a through hole to be bored to the pressure setting surface of bonding tool in such a structure as assuring vacuum attraction and inactive gas injection. CONSTITUTION:A fine hole 2 for supplying a fine metal lead is provided along the axis of pressure setting surface of a bonding tool 1 and is connected to an apparatus for vacuum attraction and inactive gas injection. After a metal ball 7 is formed by fire flame or ignitor to a metal fine lead 6 supplied from the through hole 2 formed to the pressure setting surface, it is vacuum attracted from the through hole and thereby a metal ball 7 is attracted by the pressure setting surface 5. After the bonding is carried out to the first connecting surface 8 under this condition, inactive gas is injected, a metal fine lead 6 is smoothly supplied dependant on the movement of bonding tool 1. Next, pressure setting and bonding are carried out to the second connecting surface 9 and a metal fine lead 6 is cut.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は半導体装置等の組立に用いられるボンディング
方法とそれに用いるボンディングツールに関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a bonding method used for assembling semiconductor devices and the like, and a bonding tool used therefor.

従来例の構成とその間順点 従来のボンディングツールは、先端に圧着面の軸に泊っ
た貫通孔のみ設けてあり、ボンディング時この貫通孔よ
り供給される金属細線が摩擦により損傷、切断する可能
性があり、良好なボンディング及び高速ボンディングに
刹して問題があった。Conventional configuration and related points Conventional bonding tools have only a through hole at the tip that is aligned with the axis of the crimping surface, and there is a possibility that the thin metal wire supplied through this through hole during bonding may be damaged or cut due to friction. However, there were problems with good bonding and high-speed bonding.

発明の目的 本発明の目的は、第１ポンディジグ時、金属球を圧着面
に吸着させ金属球のボンディングズレを無くすと共に、
さらにツール移動時供給される金属細線の摩擦に」：る
損傷、切断を防止し、良好なボンディング、及び高速ボ
ンディングを可能とすることを目的とする。OBJECTS OF THE INVENTION An object of the present invention is to adsorb the metal balls to the crimping surface during the first pounding jig, eliminate bonding displacement of the metal balls, and
Furthermore, the purpose is to prevent damage and breakage due to friction of the thin metal wire supplied when the tool is moved, and to enable good bonding and high-speed bonding.

発明の構成　一 本発明は、ボンディングツール圧着面に設けられた貫−
通孔を、真空吸引、不活性ガスを噴出出来る構造にする
ことにより、高信頼性な高速ボンディングをｏＪ能とし
たボンディングツールと前記貫通孔に金属球を吸着し第
１ボンデイングを行う工程、のち前記貫通孔より不活性
ガスを噴出し第２ボンデイングと行う工程によるボンデ
ィング方法である。Structure of the Invention One aspect of the present invention is to provide a through-hole provided on a bonding tool crimping surface.
A step of adsorbing a metal ball to the through hole and performing first bonding using a bonding tool that enables highly reliable high-speed bonding by making the through hole structure capable of vacuum suction and blowing out inert gas; This bonding method includes a second bonding process in which an inert gas is ejected from the through hole.

実施例の説明 本発明の実施例を図面を用いて説明する。第１図は本発
明の一実施例のギンディングソールの構成を示したもの
であり、ギンディングソール１の圧着面の軸に沿って金
属細線供給用貫通孔２が設けてあり、さらに、金属細線
供給用貫通孔２と真空吸引、不活性ガス噴出を行なう装
置３と通じる貫通孔４を設ける。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows the structure of a binding sole according to an embodiment of the present invention, in which a through hole 2 for supplying thin metal wires is provided along the axis of the crimping surface of the binding sole 1, and A through hole 4 is provided which communicates with a thin wire supply through hole 2 and a device 3 for performing vacuum suction and inert gas jetting.

第２図は本実施例のボンディングツールを用いたボンデ
ィング方法を示したものである。同図人において、ボン
ディングツール１の圧着面６に設けられた貫通孔２から
導出した金属細線６に、火災又は点火栓によって金属球
子を形成したのち貫通孔２より矢印ａのごとく真空吸引
を行なう。これにより、金属球７は圧着面５に吸着され
る。同図Ｂは、以上の状態で、第１接続而８にボッディ
ングを行なった状態である。こうしたのち、貫通孔２よ
り矢印すのごとく不活性ガスを噴出させる。FIG. 2 shows a bonding method using the bonding tool of this embodiment. In the figure, a metal ball is formed on a thin metal wire 6 led out from a through hole 2 provided in a crimp surface 6 of a bonding tool 1 by fire or a spark plug, and then vacuum suction is applied from the through hole 2 as shown by arrow a. Let's do it. As a result, the metal ball 7 is attracted to the pressure bonding surface 5. Figure B shows a state in which the first connection 8 has been subjected to bodding in the above state. After this, inert gas is jetted out from the through hole 2 in the direction of the arrow.

そして、この状態でギンディングソール１を第２接続而
９上に第２１Ｘｊ　Ｃのごとく移動させる。この時、貫
通孔２より不活性ガスを噴出しているため、ギンディン
グソール１移動に共なう金属細線６の供給が円滑に行な
われる。Then, in this state, the binding sole 1 is moved onto the second connection point 9 as shown in the 21st XjC. At this time, since inert gas is ejected from the through hole 2, the thin metal wire 6 is smoothly supplied as the binding sole 1 moves.

次にボンディングツール１を第２接続而９に圧着、ボン
ディングを行い、第２接続面９かも金属細線６を切断す
る。同図りは不活性ガスにて貫通孔２より導出した金属
細線１ｏの状態を示したものである。この状態では、以
然として貫通孔２より不活１（Ｌ：、ガスが噴出した状
態であり、それによって金属細線１０の導出が容易とな
る。次に同図Ｅに示すとおり、貫通孔２より導出した金
属細線１ｏに火災又ｋ１点火栓によって、金属球７を形
成させ次間ボンディングに備える。Next, the bonding tool 1 is crimped and bonded to the second connection surface 9, and the thin metal wire 6 is also cut on the second connection surface 9. The figure shows the state of the thin metal wire 1o led out from the through hole 2 using an inert gas. In this state, the inert 1 (L) gas is naturally blown out from the through hole 2, which makes it easy to lead out the thin metal wire 10.Next, as shown in FIG. A metal ball 7 is formed on the thin metal wire 1o led out by a fire or a k1 spark plug in preparation for inter-bonding.

なお、以上の実施例では、真空吸引と不活性ガスの噴出
の両力を行ったが、いずれか一方のみを用いても３しい
、１ 発明の効果 以」二のように、本発明は、金属球を真空吸引で圧着面
の貫通孔に吸着することにより、前記金属球が圧着面か
らズレることかなく確実なボッディングが可能となる。In the above embodiments, both vacuum suction and inert gas jetting were performed, but it is also possible to use only one of them.As described in 1. Effects of the Invention and 2. By adhering the metal ball to the through hole of the crimp surface by vacuum suction, reliable bodding can be performed without the metal ball shifting from the crimp surface.

又、前記の状態にて第１ボンデイングを行なったのち前
記貫通孔より不活性ガスを噴出した状態で、ギンディン
グソールを第２ボツデイング地点へ移動する際、円滑に
金属細線が供給され、摩擦による損傷、切断が防止出来
、信頼性の高い高速ボッディングがｒｉＪ能となる。In addition, when the bonding sole is moved to the second bonding point with inert gas being blown out from the through hole after the first bonding is performed in the above-mentioned state, the thin metal wire is smoothly supplied, and the metal wire is smoothly supplied. Damage and cutting can be prevented, and highly reliable high-speed bodding becomes the RIJ function.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例によるギンディングソールの
概略断面図、第２図（Ａ、）〜（Ｅ、）は前記ボンディ
ングノール゛を用いたボンディング方法を示す工程断面
図である。 １・・・・・・ボンディングツール、２・・・・・・貫
通孔、５・・・・・・圧着面、６・・・・・・金属細線
、７・・・・・・金属球。 代理人の氏名　弁理士　中　尾　敏　男　ほか１名第　
１　図FIG. 1 is a schematic sectional view of a binding sole according to an embodiment of the present invention, and FIGS. 2(A) to 2(E) are process sectional views showing a bonding method using the bonding knoll. DESCRIPTION OF SYMBOLS 1...Bonding tool, 2...Through hole, 5...Crimping surface, 6...Thin metal wire, 7...Metal ball. Name of agent: Patent attorney Toshio Nakao and 1 other person
1 figure

Claims (3)

【特許請求の範囲】[Claims] （１）ボンディングツール圧着面に金属細線先端に形成
された金属球を真空吸引にて吸着し、第１デンデイング
を行なう工程、しかるのち、第２ボンデイングを行なう
工程を備えたボンディング方法。(1) A bonding method comprising the steps of sucking a metal ball formed at the tip of a thin metal wire onto the bonding tool crimping surface by vacuum suction, performing a first dending, and then performing a second bonding. （２）ボンディングツール圧着面に金属細線の金属球を
形成して第１ボ／デイングを行う工程、しかるのちガス
を前記圧着面より噴出させ第２ポンデイ／グを行う工程
を備えたボンディング方法。(2) A bonding method comprising the steps of forming a metal ball made of a thin metal wire on the bonding surface of a bonding tool and performing a first bonding process, and then performing a second bonding process by ejecting gas from the bonding surface. （３）圧着面から軸に沿った金属細線供給用貫通孔に連
結された真空吸引機構又はガスを噴出する機構を設けた
ボンディングツール。(3) A bonding tool provided with a vacuum suction mechanism or a mechanism for ejecting gas connected to a thin metal wire supply through hole extending from the crimping surface along the axis.
JP57162575A 1982-09-17 1982-09-17 Bonding method and bonding tool Pending JPS5951537A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57162575A JPS5951537A (en) 1982-09-17 1982-09-17 Bonding method and bonding tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57162575A JPS5951537A (en) 1982-09-17 1982-09-17 Bonding method and bonding tool

Publications (1)

Publication Number Publication Date
JPS5951537A true JPS5951537A (en) 1984-03-26

Family

ID=15757189

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57162575A Pending JPS5951537A (en) 1982-09-17 1982-09-17 Bonding method and bonding tool

Country Status (1)

Country Link
JP (1) JPS5951537A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012109479A (en) * 2010-11-19 2012-06-07 Toshiba Mitsubishi-Electric Industrial System Corp Lead wire feeder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012109479A (en) * 2010-11-19 2012-06-07 Toshiba Mitsubishi-Electric Industrial System Corp Lead wire feeder

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