CN105742210A - Die pushing device - Google Patents
Die pushing device Download PDFInfo
- Publication number
- CN105742210A CN105742210A CN201510992298.3A CN201510992298A CN105742210A CN 105742210 A CN105742210 A CN 105742210A CN 201510992298 A CN201510992298 A CN 201510992298A CN 105742210 A CN105742210 A CN 105742210A
- Authority
- CN
- China
- Prior art keywords
- shank
- blind hole
- utensil
- crystal grain
- utensil according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a tool applied to a die transport device. The tool comprises a handle part (7). One end of the handle part (7) is connected with a force application tool (6), and the other end of the handle part (7) is provided with a blind hole (8). The tool further comprises at least one elongated member (12). One end of the elongated member (12) is connected with the blind hole (8), and the tail part (13) of the other end of the elongated member (12) extends out of the end portion of the handle part (7). During usage, the tail part (13) presses a die (3) to fix the die on the device just in place. The invention also discloses a method for manufacturing the device.
Description
Technical field
The present invention relates to a kind of utensil for crystal grain conveying arrangement, more specifically, relate to a kind of pressing crystal grain in use and by the utensil of crystal grain fix in position on the apparatus.
Background technology
Along with people are growing to the demand miniaturization of electronic installation, the crystal grain as the requisite ingredient of this device is made into less size.Nowadays, thickness is that the crystal grain of 0.22mm is customary.Due to more relatively thin than the crystal grain in past, this crystal grain is during transportation more vulnerable to damage.Analyze it can be seen that about the power of 45N can make the die break of described thickness from what research worker was made.It is designed for pressing crystal grain in the past and crystal grain utensil of fix in position on crystal grain conveying arrangement is no longer able to meet the harmless transport of relatively thin crystal grain.
JP1985-030149A discloses a kind of for pushing pin on granule.Inventor attempts improving wearability, stablizes suction and by one end that diamond end is connected to push pin on this strengthens the reliability of product by vacuum chuck.When vacuum chuck picks up multiple semiconductor grain of alignment on masking sheet continuously, above push pin and make masking sheet break and granule is pushed up.On the main body formed by diamond end and carbon steel SK of pushing pin form, diamond end is bonded in the nose of main body.Therefore, the nose of wearability acquisition raising and main body will not be flattened.Granule pushes away on stably, it is to avoid suction error, and obtains preferably crystal grain bonding.
Existing utensil have the drawback that power is concentrated on on the downside of crystal grain a bit.This often during transportation more specifically, when crystal grain is moved on to another from wafer, makes die break.
Summary of the invention
According to the present invention, a kind of for the utensil of crystal grain conveying arrangement in can overcome described shortcoming and realize improve, described utensil includes: shank, and its one end is connectable to force application means, and its other end has blind hole；And at least one slender member, its one end is connected in this blind hole, and the end of the other end reaches outside the end of this shank；Wherein, in use, this end presses crystal grain and by crystal grain fix in position on device.
Preferably, this end is taper.
Advantageously, the rear end of this slender member has rounding end or circular or rectangular cross section flat distal end.
Preferably, this shank is made by metal or hard engineering plastics.
Advantageously, this slender member is by metal or plastic production.
Preferably, the Shore D hardness of these plastics is between 50 and 120.
Preferably, the cross-sectional area of the distal part of this shank is more than the cross-sectional area of the remainder of this shank.
The present invention also provides for a kind of method for making this utensil, and described method comprises the steps: to make this shank by grinding technics；Distal end portion at this shank makes blind hole；At least one slender member is made by grinding technics；One end of this component is rounded or flattens；And this component is connected in blind hole.
Accompanying drawing explanation
The present invention it is more fully described by way of example, in accompanying drawing referring now to accompanying drawing:
Fig. 1 is the schematic diagram of the utensil according to the present invention, and the end of this utensil presses crystal grain and by crystal grain fix in position on crystal grain conveying arrangement；
Fig. 2 is the axonometric chart of a kind of form of the shank according to the present invention of this utensil；
Fig. 3 is the another form of axonometric chart of this shank；
Fig. 4 is the top view of any described shank；
Fig. 5 is the axonometric chart of a kind of form of the slender member according to the present invention of this utensil, and the slender member of this form has the end of taper, rounding；
Fig. 6 is the another form of top view of this component, and the component of this form has the flat distal end of circular cross section；
Fig. 7 is the another form of top view of this component, and the component of this form has the flat distal end of square cross-section；
Fig. 8 is the another form of top view of this component, and the component of this form has the flat distal end of rectangular cross section；
Fig. 9 is the axonometric chart of a kind of form of this utensil；
Figure 10 is the another form of axonometric chart of this utensil；
Figure 11 is the top view of a kind of form of this utensil；And
Figure 12 is the another form of top view of this utensil.
Detailed description of the invention
As shown in fig. 1, this crystal grain conveying arrangement has chuck 1, and chuck 1 is connected to the bottom of shank 2, and crystal grain conveying arrangement utilizes pull of vacuum to pick up crystal grain 3 from wafer 4.Just before pickup crystal grain 3, it is connected to the slender member 5 being arranged at the force application means 6 below this device and crystal grain 3 is pushed up so that crystal grain 3 peels off and fix in position on chuck 1 from wafer 4.
As shown in Figure 2, shank 7 is cylindrical cross section over the whole length.One end of shank 7 is connectable to force application means 6, and the other end of shank 7 has blind hole 8.For the top view in hole 8, referring to Fig. 4.The diameter of shank 7 can be 0.7mm.
As shown in Figure 3, the cross-sectional area of an end 10 of the shank 9 of this form is more than the cross-sectional area of the remainder of shank 9.The end of major part 10 has blind hole 11.For the top view in hole 11, referring to Fig. 4.
Referring to Fig. 5, one end of slender member 12 is attached to blind hole 8(or 11) in, and the end 13 of the other end is taper rounding.The diameter of component 12 can be 0.2mm.The rear end of component is alternatively circular 14(as shown in Figure 6), square 15(as shown in Figure 7) or rectangle 16(is as shown in Figure 8) flat distal end of section.
As shown in Figure 9, this utensil includes cylindrical shank 7, and cylindrical shank 7 has blind hole 8 in its one end, and is connected to three slender members 12a, 12b, 12c in blind hole 8.
As shown in Figure 10, another form of this utensil includes shank 9, and the cross-sectional area of the distal part 10 of shank 9 is more than the cross-sectional area of the remainder of shank 9.The end of major part 10 has blind hole 11, and is connected to three slender members 12d, 12e, 12f in blind hole 11.
Referring to Figure 11 and Figure 12, the quantity of slender member is different with the difference of the form of this utensil.Utensil in Figure 11 has three components 12a, 12b, 12c, and the utensil in Figure 12 has four components 12g, 12h, 12i, 12j.These member cloth are set to and make the power being applied to the downside of crystal grain 3 not be concentrated on a bit.On the contrary, power is evenly distributed on the whole area of downside.
Shank and slender member are made by metal or hard engineering plastics.The Shore D hardness of plastics can be 85.
Method for making this utensil starts from the first step being made shank by grinding technics (such as Switzerland grinds).It is followed by making the second step of blind hole in one end of shank, being made the 3rd step of at least one slender member by grinding technics (such as centreless grinding).The method rounds with the end by one end of component or the 4th step flattened and the 5th EOS being connected in blind hole by component (one or more).
Claims (8)
1. the utensil for crystal grain conveying arrangement, it is characterised in that including:
Shank (7), its one end is connectable to force application means (6), and its other end has blind hole (8)；And
At least one slender member (12), its one end is connected in described blind hole (8), and the end of the other end (13) reaches outside the end of described shank (7)；
Wherein, in use, described end (13) presses described crystal grain (3) and by its fix in position on such devices.
2. utensil according to claim 1, it is characterised in that described end (13) is taper.
3. utensil according to claim 1 and 2, it is characterised in that the rear end of described slender member has rounding end (13) or the flat distal end of circular (14) or rectangle (15 or 16) section.
4. utensil according to any one of claim 1 to 3, it is characterised in that described shank (7) is made by metal or hard engineering plastics.
5. utensil according to any one of claim 1 to 4, it is characterised in that described slender member (12) is by metal or plastic production.
6. the utensil according to claim 4 or 5, it is characterised in that the Shore D hardness of described plastics is between 50 and 120.
7. utensil according to any one of claim 1 to 6, it is characterised in that the cross-sectional area of the distal part (10) of described shank (9) is more than the cross-sectional area of the remainder of described shank (9).
8. the method for making the utensil according to any one of claim 1 to 7, it is characterised in that comprise the steps:
Described shank (7) is made by grinding technics；
Described blind hole (8) is made in the end in the distally of described shank (7)；
At least one slender member (12) is made by grinding technics；
The end (13) of one end of described component is rounded or flattens；And
Described component (12) is connected in described blind hole (8).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI2014704017 | 2014-12-26 | ||
| MYPI2014704017 | 2014-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105742210A true CN105742210A (en) | 2016-07-06 |
Family
ID=56296353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510992298.3A Pending CN105742210A (en) | 2014-12-26 | 2015-12-24 | Die pushing device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105742210A (en) |
| TW (1) | TW201635415A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6030149A (en) * | 1983-07-29 | 1985-02-15 | Toshiba Corp | Push-up needle for pellet |
| US20060166466A1 (en) * | 2005-01-21 | 2006-07-27 | Hiroshi Maki | Semiconductor manufacturing method of die-pick-up from wafer |
| CN202549811U (en) * | 2011-09-09 | 2012-11-21 | 苏州均华精密机械有限公司 | Ejector pin cover structure |
| CN103579061A (en) * | 2012-07-23 | 2014-02-12 | 乌里亚特股份有限公司 | Die pick-up control method, die pick-up device using the same, and die bonder including the same |
-
2015
- 2015-12-22 TW TW104143313A patent/TW201635415A/en unknown
- 2015-12-24 CN CN201510992298.3A patent/CN105742210A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6030149A (en) * | 1983-07-29 | 1985-02-15 | Toshiba Corp | Push-up needle for pellet |
| US20060166466A1 (en) * | 2005-01-21 | 2006-07-27 | Hiroshi Maki | Semiconductor manufacturing method of die-pick-up from wafer |
| CN202549811U (en) * | 2011-09-09 | 2012-11-21 | 苏州均华精密机械有限公司 | Ejector pin cover structure |
| CN103579061A (en) * | 2012-07-23 | 2014-02-12 | 乌里亚特股份有限公司 | Die pick-up control method, die pick-up device using the same, and die bonder including the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201635415A (en) | 2016-10-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160706 |