JPS602956A - Manufacture of photomask - Google Patents

Abstract

PURPOSE:To repair defect parts of a mask pattern easily and securely by forming metallic deposited layers at the defect parts by laser light irradiation. CONSTITUTION:For example, the mask pattern 12 which is formed on the surface of a transparent glass substrate 11 and contains metal such as Cr has defects such as pinholes 13a and 13b and a pattern absent part 14. This photomask is formed by forming a film 15 of material containing metallic material Cr on the surface. Then, the pinholes 13a and 13b are irradiated with laser light as shown by arrows 16a and 16b to form Cr deposited layers 17a and 17b in the pinholes 13a and 13b by thermal decomposition, chemical reaction, photochemical reaction, etc. which are thus charged and repaired. The pattern absent part 14 is irradiated with scanning laser light within a range shown by arrows 18a and 18b to form a Cr deposited layer 19 on the substrate 11 corresponding to the part 14. Then, the film 15 is removed by solvent or etching, etc., lastly.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a photomask in which defects such as pinholes are repaired.

When creating a photomask for use in a semiconductor manufacturing process, defects such as pinholes may occur in mask pattern portions that block light transmission. Unless such defects are repaired, the photomask cannot function as a photomask, and various repair techniques have been considered for this purpose. For example, in what is known as the rephoto method, Photomask A? A photoresist film is formed on the turns, the defective parts of the two turns of the mask are exposed to light, and after development, metal is deposited again on the defective parts. However, such a method requires a lot of time and effort since it involves repeating the process of creating a photomask again.

This invention was made in view of the above points, and even when a defect such as a pinhole exists in a photomask, the defect such as a pinhole can be easily and reliably repaired. It is an object of the present invention to provide a method for manufacturing a photomask that can greatly improve photomask manufacturing efficiency.

That is, the method for manufacturing a photomask according to the present invention includes:
A film made of a material containing gold chips corresponding to the arm turn material is formed on the mask main turn having defects, and the defective part is irradiated with radar light through this film to form a metal precipitated layer on the defective part. It is intended to cause the formation of

An embodiment of the present invention will be described below based on the drawings. FIG. 1 shows a photomask with defects, in which a mask pattern 12 containing a gold pigment such as Cr is formed on the surface of a transparent glass substrate 1. It is assumed that defects due to pinholes 13a and 13b exist. Further, it is assumed that there is a part 14 where there is no turn as shown by the broken line.

To repair a photomask with such defects,
First, as shown in FIG. 2, a coating 15 is applied to the surface of the glass substrate 1, which corresponds to the mask pattern 12, with a material containing the same metal Cr as the mask lean material.
form.

Then, as shown by arrows 16a and 16b, pinhole 1
A laser beam is irradiated to the parts 3a and 13b, and one hole 13a and 13 is formed by thermal decomposition, chemical reaction, photochemical reaction, etc.
Cr deposited in b fdjJ7&.

17b, and these pinholes 13a, 13b
Fill in and make corrections.

In addition, pattern punching is performed by scanning and irradiating the radar light in the range of the portion 14, that is, in the range of arrows 18h and 18b.
A Cr precipitation layer 19 is formed thereon. And finally, coating 1
By removing 5 using bath additives, etching, etc.
As shown in FIG. 3, a photomask is completed in which the defective portions have been repaired and the pattern punched portions have been added.

In the above embodiment, the mask pattern 12 is placed on the glass substrate 11.
The coating 16 was formed of a material containing Cr, but
As shown in FIG. 4, the same surface (coating 21 made of a material containing Cr is formed on the surface of a separate glass substrate 20) is placed on the surface of the mask pattern 12 on the glass substrate 11. It may be arranged so that they are in contact with each other. And glass substrate 20
By sequentially irradiating the Rede light from the back side in the same manner as in the previous example, and by applying the Rede light to the surface, the Or precipitated layer 17 was formed.
A, 17b and 19 can be repaired. In this way, if the glass substrate 2o is removed after irradiation with Radical light, the coating 21 is also separated from the photomask portion, and the coating removal operation of the previous embodiment becomes unnecessary.

As the material for fJ115.degree. 2 used in the above-mentioned embodiments, a polymeric material containing a metal such as Cr, a resist, etc., which correspond to the mask pattern material as described above, may be used.

As described above, according to the present invention, defective portions on a photomask can be easily repaired, and the production efficiency when manufacturing a photomask can be sufficiently increased.

[Brief explanation of the drawing]

1 to 3 are diagrams for explaining a photomask repair process according to one embodiment of the present invention, and FIG. 4 is a diagram for explaining another embodiment of the present invention. 1. Glass substrate, 12. Masks and turns,
14...Mask removal is partial, 15.21...Coating, 1
7J1 # J 7b, J! p-Cr precipitated layer. Figure 1 Figure 2

Claims (1)

[Claims] means for forming a mask pattern on a transparent substrate; means for forming a film of a material containing a metal corresponding to the turn material on the four turns of the mask; 1. A method for manufacturing a photomask, comprising means for irradiating an existing defective portion with a laser beam, and forming a metal deposited layer on the defective portion by irradiating the laser beam with the laser beam.