JPS6029288U - Semiconductor device testing equipment - Google Patents
Semiconductor device testing equipmentInfo
- Publication number
- JPS6029288U JPS6029288U JP12039883U JP12039883U JPS6029288U JP S6029288 U JPS6029288 U JP S6029288U JP 12039883 U JP12039883 U JP 12039883U JP 12039883 U JP12039883 U JP 12039883U JP S6029288 U JPS6029288 U JP S6029288U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- testing equipment
- device testing
- hot air
- constant temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来の高温電圧印加試験装置の概略を示す断
面図、第２、図ａおよびｂはその試験装置′内゛°設置
す６半導体素±取付例Ｉｎ（”ｔＬ示す斜視図である。
第３図は本考案省−実施例の概略を示す断面図、第４図
ａおよびｂはこの一実施例に 〜よる試験装置内に取り
付けた半導体素子に熱風を吹付ける方向をそれぞれ示す
斜視図である。第５ 図は本考案の一実施例と従
来装置との放熱性能比較したグラフである。
１・・・・・・供試半導体素子ζ２・・・・・・恒温槽
、３・・・・・・電圧印加電源、４・・・・・・熱風発
生機構、５・・・・・・熱風 ５吹出口、６・・・
・・・気体補給口。−ｒ−Ｔかｍ
乙ｆ１コ」Figure 1 is a cross-sectional view schematically showing a conventional high-temperature voltage application test equipment, and Figures 2 and 2 are perspective views showing an example of mounting six semiconductor devices installed in the test equipment. Figure 3 is a cross-sectional view schematically showing an embodiment of the present invention, and Figures 4a and 4b respectively show the directions in which hot air is blown onto a semiconductor device installed in a test apparatus according to this embodiment. It is a perspective view. Fig. 5 is a graph comparing the heat dissipation performance of an embodiment of the present invention and a conventional device. 1... Semiconductor element under test ζ2... Constant temperature chamber, 3 ...Voltage application power supply, 4...Hot air generation mechanism, 5...Hot air 5 outlet, 6...
...Gas supply port. -r-T or m otsu f1ko.”
Claims (1)
る恒温槽、及び該半導体素子へ高温の気体を吹きつける
機構とを備えたことを特徴とす多、 半導体素子試
験装置。 ′ 。1. A semiconductor device testing device comprising: a mechanism for applying voltage to a semiconductor device; a constant temperature bath for placing the semiconductor device; and a mechanism for blowing high temperature gas onto the semiconductor device. ′.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12039883U JPS6029288U (en) | 1983-08-02 | 1983-08-02 | Semiconductor device testing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12039883U JPS6029288U (en) | 1983-08-02 | 1983-08-02 | Semiconductor device testing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6029288U true JPS6029288U (en) | 1985-02-27 |
Family
ID=30275956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12039883U Pending JPS6029288U (en) | 1983-08-02 | 1983-08-02 | Semiconductor device testing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6029288U (en) |
-
1983
- 1983-08-02 JP JP12039883U patent/JPS6029288U/en active Pending
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