JPS6028391B2 - semiconductor package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor package, and particularly to a glass-ceramic package-type semiconductor package mounted with a semiconductor element that generates a large amount of heat, such as a high-output semiconductor element or a highly integrated semiconductor element.

As a flexible, airtight, and highly reliable package,
A glass ceramic package structure as shown in FIG. 3 is adopted. In other words, this semiconductor package is
A substrate 2 made of molybdenum (Mo), which has good thermal conductivity, is fixed on a heat sink 1 made of a metal with good thermal conductivity, such as copper (Cu), aluminum (N), etc., and a large amount of metal is placed in the center of the substrate 2. It is equipped with a semiconductor element 3 that generates heat. Further, a spacer 4 made of a rectangular frame-shaped ceramic plate is fixed to the upper surface of the substrate 2 with a glass layer 5 interposed therebetween. At this time, the semiconductor element 3 on the substrate 2 is surrounded by the spacer 4. Further, a lid body 6 made of a ceramic plate is fixed to the upper surface of the spacer 4 via a glass layer 7, and hermetically seals the semiconductor element 3. A metal lead 8 made of Kovar or the like is disposed between the base plate 4 and the lid 6, and the inner end of the wire 9 is fixed at one end to the electrode of the semiconductor element 3. There is. The other ends of the leads 8 protrude outward from the sealing portion formed by the spacer 4, the lid 6, and the substrate 2, forming external terminals (external electrodes). However, in such a structure, glass is used to seal the ceramic plate and metal, but glass is a fragile material.
Due to the residual thermal distortion during assembly due to the difference in the thermal cape tensile coefficient between the glass, ceramic plate, and metal plate, the seal part easily breaks when an external force (for example, an external force from a drop test) is applied to the seal part. .

Therefore, an object of the present invention is to provide a semiconductor package with a strong seal portion.

In order to achieve such an object, the present invention includes a substrate made of metal, a circuit element fixed on this substrate, and an insulator fixed to the upper surface of the substrate via glass so as to surround this circuit element. A material surfacer and this insulating material surfacer.
In the semiconductor package, a frame-shaped reinforcing plate made of an insulating material is arranged on the lower surface side of the substrate, and the reinforcing plate and the insulating spacer are connected to each other. A substrate is sandwiched and fixed with a glass layer interposed therebetween, and a steel joint frame or a steel joint beam is provided on the substrate, and a steel joint beam is fitted to the joint frame or iron joint beam. Alternatively, a steel recess is provided in the insulating substrate or reinforcing plate.The present invention will be described in detail below with reference to Examples.

FIG. 1 shows an embodiment of the semiconductor package of the present invention.

The figure shows a substrate 10 made of a molybdenum plate whose surface is nickel-plated. A heat sink 11 made of a metal with good thermal conductivity, such as copper or aluminum, is fixed to the center of the lower surface of the substrate 10 via a silver key. Further, in an area other than the area where the semiconductor element 12 is attached to the substrate 10, a steel hole 13 consisting of a rectangular hole is provided as shown in FIG. A smoother 14 and a reinforcing plate 15 made of ceramic frame plates are located above and below the peripheral portions of the substrates 1 and 0, respectively, and the substrate 10 is placed between the smoothing plate 14 and the reinforcing plate 15 with a low melting point glass 16 interposed therebetween. It is held in place by sandwiching it. Further, a steel abutment 17 having a rectangular cross section is provided on the surface of the reinforcing plate 15 facing the substrate 10. This saddle mating abutment 17 is provided corresponding to the drum hole 13 of the substrate 10, and the clearance between the two when they are mated is such that glass as a sealing material can enter, and the external force applied to the substrate 101 is 0.1~1. so that this drum abutment 17 receives it directly. It is designed to be similar to Cape Qi. Further, a semiconductor element 12 is fixed to the center of the substrate 10.

Furthermore, a lead 18 made of metal and extending inside and outside the spacer 14 is fixed to the upper surface of the spacer 14 via a low-melting glass 19. And these leads 1
The inner end of the semiconductor element 8 and an unillustrated electrode of the semiconductor element 12 are connected by a wire 20 . Further, a lid body 22 made of a ceramic plate is fixed to the upper surface of the spacer 14 (lead 18) with a low melting point glass 21 interposed therebetween. According to such an embodiment, when an impact force is applied to the heat sink 11 during a drop test, the substrate 10 is moved between the base plate 14 and the reinforcement plate 15.
An external force is applied to move within the low melting point glass 16 between the two. Since the low melting point glass 16 is a brittle material,
In the conventional case, cracks immediately occur in the low melting point glass 16, and it breaks and peels off, but in this embodiment, the iron alloy holes provided in the substrate 101 are used. Since the mating protrusions 17 provided on the reinforcing plate 15 are iron-coupled with 13, the external force is almost directly applied to these mating protrusions 19. Therefore, a large force (breaking force) is not generated in the low melting point glass 16, and no breakage or cracking occurs in the low melting point glass 16 unlike in the conventional case. Note that the present invention is not limited to the above embodiments.

As for the low melting point glass, if you use lead acid based low melting point glass which has a coefficient of thermal expansion similar to that of alumina ceramic plates and molybdenum plates, residual thermal strain during assembly due to differences in external thermal expansion (thermal contraction) can be reduced. It can be made smaller and the strength of the package can be further improved. Further, the substrate may be made of a metal other than molybdenum, such as copal, 42 alloy, or fernico, which has a coefficient of thermal expansion similar to that of ceramic.
Further, the board 101 may be provided with mating abutments, and the base plate 14 or the reinforcing plate 15 may be provided with a matching hole or a mating hole, and the board's mating abutment may be made to be mated with these.

Furthermore, instead of the general dowel holes in the substrate 11, iron joints or slits may be provided. However, it is necessary to appropriately select the positions of these joining holes so that they do not interfere with hermetic sealing. As described above, according to the semiconductor package of the present invention, even if a glass material is used at the joint between the ceramic plate and the metal, the structure is such that no large force is directly applied to the glass material.
External forces normally applied during handling of semiconductor packages, such as heat shrinkage during assembly and impact force during drop tests, will not cause the seal to break or crack.

Therefore, not only can the assembly process be improved, but also a highly reliable semiconductor package can be provided.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view of a semiconductor package according to an embodiment of the present invention, FIG. 2 is a plan view of a substrate,
FIG. 3 is a sectional view of a conventional semiconductor package.

1... ... Heat sink, 2 ... Board, 3
...Semiconductor element, 4... Subaru, 5...
... Glass layer, 6 ... Lid body, 7 ... Glass layer, 8 ... Lead, 9. ．．・．． ．．・Wire, 1
0... Board, 11... Heat sink, 12
... Semiconductor element, 13 ... Gland fitting hole, 1
4...Subesa, 15...Reinforcement plate, 16.
...low melting point glass, 17 ... corps abutment,
18...Reed, 19. ．． ...Low melting point glass, 20...Wire, 21...Low melting point glass, 22... Lid body.

younger brother diagram longevity diagram 3 drawings

Claims (1)

[Claims] 1. A substrate made of metal, a semiconductor circuit element fixed on this substrate, an insulating spacer fixed to the upper surface of the substrate via glass so as to surround this circuit element, and the insulating spacer In a semiconductor package having a lid fixed to an upper surface for airtight sealing, a frame-shaped reinforcing plate made of an insulating material is arranged on the lower surface side of the substrate, and a frame-shaped reinforcing plate made of an insulating material is disposed between the reinforcing plate and the insulating spacer. At the same time, the substrate is sandwiched and fixed in a sandwich shape through a glass layer.
A fitting depression or a fitting protrusion is provided on the substrate, and a fitting protrusion or a fitting depression that fits into the fitting depression or the fitting protrusion is provided on the insulating spacer or reinforcing plate. A semiconductor package characterized by: