JPS5456364A - Semicondutor package - Google Patents

Semicondutor package

Info

Publication number
JPS5456364A
JPS5456364A JP12237177A JP12237177A JPS5456364A JP S5456364 A JPS5456364 A JP S5456364A JP 12237177 A JP12237177 A JP 12237177A JP 12237177 A JP12237177 A JP 12237177A JP S5456364 A JPS5456364 A JP S5456364A
Authority
JP
Japan
Prior art keywords
substrate
reinforcing plate
spacer
fitting
insulator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12237177A
Other languages
Japanese (ja)
Other versions
JPS6028391B2 (en
Inventor
Masao Sekihashi
Michiaki Furukawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12237177A priority Critical patent/JPS6028391B2/en
Publication of JPS5456364A publication Critical patent/JPS5456364A/en
Publication of JPS6028391B2 publication Critical patent/JPS6028391B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To prevent the occurrence of breaking and cracking and achieve the improvement in reliability by disposing a frame form reinforcing plate formed of an insulator on the bottom side of a substrate and holding the substrate between the reinforcing plate and spacer by way of a glass layer in a semiconductor package of glass ceramic package type.
CONSTITUTION: A substrate 10 formed by a metal, a semiconductor circuit element 12 fixed on the substrate 10 and an insulator spacer 14 which has fixed the top of the substrate 10 so as to surround said element 12 by low melting point glass 21 are provided and further a cover body 22 to be hermetically sealed to the to P of the spacer 14 is provided. A frame form reinforcing plate 15 formed by an insulator is disposed to the bottom face side of the substrate 10 of the semiconductor package of this constitution. The substrate 10 is held in sandwich form between this reinforcing plate 15 and the spacer 14 by way of the layer formed by low melting point glass 16, 21, and is thereby fixed. Fitting recesses or fitting projections 17 are provided to the substrate 10 and the fitting projections or fitting recesses fitting to said fitting projections 17 are provided to the reinforcing plate 15
COPYRIGHT: (C)1979,JPO&Japio
JP12237177A 1977-10-14 1977-10-14 semiconductor package Expired JPS6028391B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12237177A JPS6028391B2 (en) 1977-10-14 1977-10-14 semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12237177A JPS6028391B2 (en) 1977-10-14 1977-10-14 semiconductor package

Publications (2)

Publication Number Publication Date
JPS5456364A true JPS5456364A (en) 1979-05-07
JPS6028391B2 JPS6028391B2 (en) 1985-07-04

Family

ID=14834186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12237177A Expired JPS6028391B2 (en) 1977-10-14 1977-10-14 semiconductor package

Country Status (1)

Country Link
JP (1) JPS6028391B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758927A (en) * 1987-01-21 1988-07-19 Tektronix, Inc. Method of mounting a substrate structure to a circuit board
US5223741A (en) * 1989-09-01 1993-06-29 Tactical Fabs, Inc. Package for an integrated circuit structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758927A (en) * 1987-01-21 1988-07-19 Tektronix, Inc. Method of mounting a substrate structure to a circuit board
US5223741A (en) * 1989-09-01 1993-06-29 Tactical Fabs, Inc. Package for an integrated circuit structure

Also Published As

Publication number Publication date
JPS6028391B2 (en) 1985-07-04

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