JPS5456364A - Semicondutor package - Google Patents
Semicondutor packageInfo
- Publication number
- JPS5456364A JPS5456364A JP12237177A JP12237177A JPS5456364A JP S5456364 A JPS5456364 A JP S5456364A JP 12237177 A JP12237177 A JP 12237177A JP 12237177 A JP12237177 A JP 12237177A JP S5456364 A JPS5456364 A JP S5456364A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- reinforcing plate
- spacer
- fitting
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To prevent the occurrence of breaking and cracking and achieve the improvement in reliability by disposing a frame form reinforcing plate formed of an insulator on the bottom side of a substrate and holding the substrate between the reinforcing plate and spacer by way of a glass layer in a semiconductor package of glass ceramic package type.
CONSTITUTION: A substrate 10 formed by a metal, a semiconductor circuit element 12 fixed on the substrate 10 and an insulator spacer 14 which has fixed the top of the substrate 10 so as to surround said element 12 by low melting point glass 21 are provided and further a cover body 22 to be hermetically sealed to the to P of the spacer 14 is provided. A frame form reinforcing plate 15 formed by an insulator is disposed to the bottom face side of the substrate 10 of the semiconductor package of this constitution. The substrate 10 is held in sandwich form between this reinforcing plate 15 and the spacer 14 by way of the layer formed by low melting point glass 16, 21, and is thereby fixed. Fitting recesses or fitting projections 17 are provided to the substrate 10 and the fitting projections or fitting recesses fitting to said fitting projections 17 are provided to the reinforcing plate 15
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12237177A JPS6028391B2 (en) | 1977-10-14 | 1977-10-14 | semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12237177A JPS6028391B2 (en) | 1977-10-14 | 1977-10-14 | semiconductor package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5456364A true JPS5456364A (en) | 1979-05-07 |
JPS6028391B2 JPS6028391B2 (en) | 1985-07-04 |
Family
ID=14834186
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12237177A Expired JPS6028391B2 (en) | 1977-10-14 | 1977-10-14 | semiconductor package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6028391B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4758927A (en) * | 1987-01-21 | 1988-07-19 | Tektronix, Inc. | Method of mounting a substrate structure to a circuit board |
US5223741A (en) * | 1989-09-01 | 1993-06-29 | Tactical Fabs, Inc. | Package for an integrated circuit structure |
-
1977
- 1977-10-14 JP JP12237177A patent/JPS6028391B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4758927A (en) * | 1987-01-21 | 1988-07-19 | Tektronix, Inc. | Method of mounting a substrate structure to a circuit board |
US5223741A (en) * | 1989-09-01 | 1993-06-29 | Tactical Fabs, Inc. | Package for an integrated circuit structure |
Also Published As
Publication number | Publication date |
---|---|
JPS6028391B2 (en) | 1985-07-04 |
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