JPS60262613A - Resin molding device - Google Patents
Resin molding deviceInfo
- Publication number
- JPS60262613A JPS60262613A JP11895084A JP11895084A JPS60262613A JP S60262613 A JPS60262613 A JP S60262613A JP 11895084 A JP11895084 A JP 11895084A JP 11895084 A JP11895084 A JP 11895084A JP S60262613 A JPS60262613 A JP S60262613A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- resin
- plunger head
- pressure sensor
- resin molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/58—Details
- B29C45/586—Injection or transfer plungers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は半導体装置を樹脂封止する成形装置に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a molding apparatus for resin-sealing a semiconductor device.
従来この種の成形装置は第１図のように構成されている
。即ち第１図において、（１）は金型を型締する樹脂成
形用プレス、（２）は樹脂を注入、加圧するためのトラ
ンスファーシリンダ、（８）（４）は樹脂を成形するた
めにポット部、ランナ一部、ゲート部、キャビティ部を
構成した上金型及び下金型、（５）はと記トランスファ
ーシリンダ（２）のピストンロンド部（図示せず）に取
付けられ樹脂を直接注入、加圧するためのプランジャー
ヘッド、（６）はと記トランスファーシリンダ（２）が
樹脂を注入、加圧する際の圧力を示す圧力ゲージである
。Conventionally, this type of molding apparatus has been constructed as shown in FIG. That is, in Fig. 1, (1) is a resin molding press for clamping the mold, (2) is a transfer cylinder for injecting and pressurizing the resin, and (8) and (4) are pots for molding the resin. (5) is attached to the piston rond part (not shown) of the transfer cylinder (2) and is directly injected with resin; The plunger head (6) for pressurizing is a pressure gauge that indicates the pressure when the transfer cylinder (2) injects and pressurizes the resin.
次に第１図の留部を断面した第２図を用いて３その動作
を説明する。と金型（８）及び下金型（４）を閉じ型締
した状態でと金型（３）のチャンバーＣｌ０）内に樹脂
を入れ、トランスファーシリンダ（２）に取付けたプラ
ンジャーヘッド（５）により上記樹脂を注入する。Next, the operation will be explained using FIG. 2, which is a cross-section of the clasp shown in FIG. 1. With the mold (8) and lower mold (4) closed and clamped, resin is put into the chamber Cl0) of the mold (3), and the plunger head (5) is attached to the transfer cylinder (2). Inject the above resin.
このときトランスファーシリンダ（２）は油圧源等の駆
動により動作する。注入された樹脂は上金型（３）及び
下金型（４）の各々のチェイスブロック（Ｂ＆）（４ａ
）に形成されたポット部（４ｂＬ ランナ一部（４Ｃ）
、ゲ−ト部（４ｄ）等を経てキャビティ部（４θ）へ押
し込まれる。At this time, the transfer cylinder (2) is operated by a hydraulic power source or the like. The injected resin is applied to each chase block (B&) (4a) of the upper mold (3) and lower mold (4).
) formed in the pot part (4bL runner part (4C)
, the gate portion (4d), etc., and is pushed into the cavity portion (4θ).
以上のようにして注入された樹脂は、一定時間加圧され
半導体装置は樹脂成形される。なおこのとき、樹脂の注
入圧力及び加圧時の力は、圧力箪（６）に指示されるト
ランスファーシリンダ（２）の油圧等の圧力により換算
しめられる。The resin injected as described above is pressurized for a certain period of time, and the semiconductor device is molded with the resin. At this time, the injection pressure of the resin and the force at the time of pressurization are converted by the pressure such as the oil pressure of the transfer cylinder (2) indicated by the pressure cabinet (6).
従来の成形装置は以とのように構成されているので、樹
脂の注入圧力及び加圧時の力等はトランスファーシリン
ダ（２）を介し圧力ゲージ（６）による指示を換算して
めるため、実際の注入出力、加圧時等の力を認識するこ
とができなかった。また、トランスファニジリンダ（２
）自体の作動抵抗及びパツキン等の［耗等による作動油
の漏れ等によって、圧力計（６）に指示される圧力は実
際の樹脂の注入圧力及び加圧時の圧力と異なυ、成形条
件の一つである注入圧力等を決定しがたいなどの欠点が
あった。Conventional molding equipment is configured as shown below, and the resin injection pressure and pressurizing force are determined by converting the readings from the pressure gauge (6) via the transfer cylinder (2). It was not possible to recognize the actual injection output and force during pressurization. Also, transfanigilinda (2
) The pressure indicated by the pressure gauge (6) may differ from the actual resin injection pressure and pressure during pressurization due to the operating resistance of the seal itself and the leakage of hydraulic oil due to wear of the packing etc. One of the drawbacks was that it was difficult to determine the injection pressure, etc.
〔発明のｅ５要〕
この発明はと記のような従来のものの欠点を除失するた
めになされたもので、プランジャーヘッドに圧力センサ
を組み込むことにより、実際の注入圧力等を直置８識で
きる樹脂成形装Ｍを提供することを目的としている。[E5 essential points of the invention] This invention was made to eliminate the drawbacks of the conventional ones as described above.By incorporating a pressure sensor into the plunger head, it is possible to directly monitor the actual injection pressure, etc. The purpose is to provide a resin molding device M that can be used.
以下、この発明の一実施例を第３図について説明する。 An embodiment of the present invention will be described below with reference to FIG.
なお第８図はプランジャーヘッド部の断面を示している
。第８図において、（５）はプランジャーヘッド、（７
）はこのプランジャーヘッド（５）の先端にネジ（８）
で取付けられた圧力センサで、この圧力センサ（７）の
検出部（７＆）ｉｊプランジャーヘッド（５）の先端部
（５ａ）より突出して設けられている。（９）はこの圧
力センザ（７）で検出した圧力を電気信号に置き換え圧
力を表示する圧力変換器である。Note that FIG. 8 shows a cross section of the plunger head. In Figure 8, (5) is the plunger head, (7
) is a screw (8) at the tip of this plunger head (5).
The detection part (7&)ij of this pressure sensor (7) is provided to protrude from the tip (5a) of the plunger head (5). (9) is a pressure transducer that converts the pressure detected by this pressure sensor (7) into an electrical signal and displays the pressure.
以上のように構成されたプランジャーヘッド（５）及び
圧力センサ（γ）において、第２図同様、上金型（３）
及び下金型（４）を閉じ型締した状態で上金型（３）の
チャンバー（１０）内に樹脂を入れ、トランスファーシ
リンダ（２）に取付けたプランジャーヘッド（６）にニ
ジ樹脂を注入する。注入され念樹脂は上金型（８）及び
下金型（４）の各々のチェイスブロック（８ａ）（４ａ
）に形成されたポット部（４ｂ）、ランナ一部（４０）
、ゲート部（４ｄ）を経てキャビティ一部（４ｅ）に押
し込まれるところでこのとき、プランジャーヘッド（５
）の先端部（５ａ）に圧力センサ（ア）の検出部（７ａ
）が突出して設けられているため、樹脂の注入圧力及び
加圧の圧力等の検出が圧力変換器（９）を介して直接な
し得るものとなる。In the plunger head (5) and pressure sensor (γ) configured as above, the upper mold (3)
With the lower mold (4) closed and clamped, resin is poured into the chamber (10) of the upper mold (3), and the resin is injected into the plunger head (6) attached to the transfer cylinder (2). do. The injected resin is poured into the chase blocks (8a) (4a) of the upper mold (8) and lower mold (4), respectively.
) and a part of the runner (40) formed in the pot part (4b)
At this time, the plunger head (5) is pushed into the cavity part (4e) through the gate part (4d).
) The detection part (7a) of the pressure sensor (A) is attached to the tip (5a) of the pressure sensor (A).
) is provided in a protruding manner, so that resin injection pressure, pressurization pressure, etc. can be directly detected via the pressure transducer (9).
なお丘記実施例では、圧力センサ（７）の検出部（７き
）がプランジャーヘッド（５）の先端部（５ａ）より突
出して樹脂の圧力を直接検出するようにしてい乙が、あ
る部材を介して検出するようにしてもよい。In the embodiment described above, the detection part (7) of the pressure sensor (7) protrudes from the tip (5a) of the plunger head (5) to directly detect the pressure of the resin. Detection may also be performed via
以上のようにこの発明によれば、プランジャーヘッド（
５）に圧力センサ（ア）を組み込み、樹脂の注入圧力等
を圧力変換器（９）を介して検出するようにしたので、
成形条件としての樹脂の注入圧力、加圧時の力等より正
確なデータの提供が可能で、半導体装置の成形において
品質の向上に大いに役立つ効果がある。As described above, according to the present invention, the plunger head (
A pressure sensor (a) is incorporated in 5) to detect resin injection pressure, etc. via a pressure transducer (9).
It is possible to provide more accurate data on molding conditions such as resin injection pressure and pressure force, which is highly effective in improving the quality of semiconductor device molding.
第１図は従来の樹脂成形装置を示す正面図、第２図は第
１図の要部断面図、第８図は本発明の一実施例を示すプ
ランジャーヘッド部の断面図である。
図中、（１）は樹脂成形用プレス、（２）はトランスフ
ァーシリンダ、（８）はと金型、（４）は下金型、（５
）はプランジャーヘッド、（ア）は圧力センサ、（８）
は固定ネジ、（９）は圧力変換器である。
尚、図中同一符号は同−又は相当部分を示す。
代理人 大 岩 増 雄
第１図
σ
第２図
こ＼っ
ノ （
Ｊα ／ａ
第３１り１FIG. 1 is a front view showing a conventional resin molding apparatus, FIG. 2 is a sectional view of the main part of FIG. 1, and FIG. 8 is a sectional view of a plunger head portion showing an embodiment of the present invention. In the figure, (1) is a resin molding press, (2) is a transfer cylinder, (8) is a dovetail mold, (4) is a lower mold, (5)
) is the plunger head, (a) is the pressure sensor, (8)
is a fixing screw, and (9) is a pressure transducer. Note that the same reference numerals in the figures indicate the same or corresponding parts. Agent Masuo Oiwa Figure 1 σ Figure 2 Ko＼ノ (Jα /a 31st R1
Claims (3)
ャーヘッドによυ金型内に樹脂を注入、加圧するように
した樹脂成形装置において、丘記プランジャーヘッドの
先端部に、検出部が突出するように圧力センサを組み込
んだことを特徴とする樹脂成形装置。(1) In a resin molding device in which resin is injected into a υ mold and pressurized by a plunger head attached to a transfer cylinder, a detection part protrudes from the tip of the plunger head. A resin molding device characterized by incorporating a pressure sensor.
請求の範囲第１項記載の樹脂成形装置。(2) The resin molding apparatus according to claim 1, wherein a pressure transducer is connected to the pressure sensor.
されている特許請求の範囲第１項または第２項記載の樹
脂成形装置。(3) The resin molding apparatus according to claim 1 or 2, wherein the pressure sensor is fixed within the plunger head with a screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11895084A JPS60262613A (en) | 1984-06-08 | 1984-06-08 | Resin molding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11895084A JPS60262613A (en) | 1984-06-08 | 1984-06-08 | Resin molding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60262613A true JPS60262613A (en) | 1985-12-26 |
Family
ID=14749263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11895084A Pending JPS60262613A (en) | 1984-06-08 | 1984-06-08 | Resin molding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60262613A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01103417A (en) * | 1987-10-16 | 1989-04-20 | Fujitsu Ltd | Molding device for multi-plunger molding die |
-
1984
- 1984-06-08 JP JP11895084A patent/JPS60262613A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01103417A (en) * | 1987-10-16 | 1989-04-20 | Fujitsu Ltd | Molding device for multi-plunger molding die |
| JPH0747286B2 (en) * | 1987-10-16 | 1995-05-24 | 富士通株式会社 | Multi Plunger Mold Molding Equipment |
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