JPS60261157A - セラミック端子板の気密接合方法 - Google Patents

セラミック端子板の気密接合方法

Info

Publication number
JPS60261157A
JPS60261157A JP59117123A JP11712384A JPS60261157A JP S60261157 A JPS60261157 A JP S60261157A JP 59117123 A JP59117123 A JP 59117123A JP 11712384 A JP11712384 A JP 11712384A JP S60261157 A JPS60261157 A JP S60261157A
Authority
JP
Japan
Prior art keywords
ceramic terminal
terminal plate
container
thermal expansion
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59117123A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0439776B2 (enrdf_load_stackoverflow
Inventor
Katsuhide Natori
名取　勝英
Kyoichiro Kono
河野　恭一郎
Tsutomu Iikawa
勤 飯川
Shigeki Okamoto
岡本　茂樹
Takeaki Sakai
酒井　武明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59117123A priority Critical patent/JPS60261157A/ja
Publication of JPS60261157A publication Critical patent/JPS60261157A/ja
Publication of JPH0439776B2 publication Critical patent/JPH0439776B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59117123A 1984-06-07 1984-06-07 セラミック端子板の気密接合方法 Granted JPS60261157A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59117123A JPS60261157A (ja) 1984-06-07 1984-06-07 セラミック端子板の気密接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59117123A JPS60261157A (ja) 1984-06-07 1984-06-07 セラミック端子板の気密接合方法

Publications (2)

Publication Number Publication Date
JPS60261157A true JPS60261157A (ja) 1985-12-24
JPH0439776B2 JPH0439776B2 (enrdf_load_stackoverflow) 1992-06-30

Family

ID=14703999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59117123A Granted JPS60261157A (ja) 1984-06-07 1984-06-07 セラミック端子板の気密接合方法

Country Status (1)

Country Link
JP (1) JPS60261157A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0439776B2 (enrdf_load_stackoverflow) 1992-06-30

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees