JPS60259469A - Thermal head - Google Patents

Thermal head

Info

Publication number
JPS60259469A
JPS60259469A JP11530184A JP11530184A JPS60259469A JP S60259469 A JPS60259469 A JP S60259469A JP 11530184 A JP11530184 A JP 11530184A JP 11530184 A JP11530184 A JP 11530184A JP S60259469 A JPS60259469 A JP S60259469A
Authority
JP
Japan
Prior art keywords
heating element
thermal head
layer
film
dot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11530184A
Other languages
Japanese (ja)
Inventor
Minoru Sato
稔 佐藤
Kyoji Shirakawa
白川 享志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP11530184A priority Critical patent/JPS60259469A/en
Publication of JPS60259469A publication Critical patent/JPS60259469A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335Structure of thermal heads

Landscapes

  • Electronic Switches (AREA)

Abstract

PURPOSE:To obtain a very stable thermal head whose resistance value is less changed with time by enabling a low resistance region to be produced by the self-heating of heating elements in the center of dots. CONSTITUTION:A thermal resistance layer 3 of a glass glaze is formed on an insulator base plate 2 of alumina ceramic material, and Ta2N film is formed by sputtering on the layer 3 to make up a heating element 4. A power feeder 5 consisting or Al film and Ni film is formed on the element 4 by vacuum vapor deposition. Photo-etching is then made in the order of the power feeder pattern and the heating element pattern to form the pattern of a thermal head. The resist is removed by plasma etching using O2 gas, the terminal portion is covered with a metal mask, and a wear-resistant layer 7 consisting of Ta2O5 and a heating element protective layer 6 consisting of SiO2 are formed by sputtering. As shown by line-B, annealing is made in such a way as tomake the resistance value of the dot center 4a of the heating element 4 lower than that of the dot peripheral portion 4b.

Description

【発明の詳細な説明】 「技術分野」 未発明は、感熱記録に用いられるサーマルヘッド′に閣
するものであり、さらに詳しくはサーマルへ、、、Kを
構成する発熱体の構造に関するものである。
[Detailed Description of the Invention] "Technical Field" The invention relates to a thermal head used for heat-sensitive recording, and more specifically relates to the structure of a heating element constituting a thermal head. .

「従来技術およびその問題点」 第2図に示すように、この種のサーマルヘッドlは、ア
ルミナセラミックス等からなる絶縁基板2とに、ガラス
グレーズ等からなる熱抵抗層3、Ta2N等からなる発
熱体4、^1等からなる給電体5 Sin、等からなる
発熱体の保護層6 、Ta、(]、、等からなる耐摩耗
層7が積層された構造となっている。そして、給電体5
を介して発熱体4に通電することにより、発熱体4が発
熱し、例えばインクリボンを介して記録紙にインクを溶
着させたりして印字がなされるようになっている。
"Prior art and its problems" As shown in Fig. 2, this type of thermal head l consists of an insulating substrate 2 made of alumina ceramics or the like, a heat resistance layer 3 made of glass glaze or the like, and a heat generating layer made of Ta2N or the like. It has a structure in which a power supply body 5 consisting of a body 4, ^1, etc., a protective layer 6 of a heat generating element consisting of Sin, etc., and a wear-resistant layer 7 consisting of Ta, (], etc. are laminated. 5
By energizing the heating element 4 through the ink, the heating element 4 generates heat, and printing is performed by, for example, welding ink to the recording paper via an ink ribbon.

ところで、発熱体4として用いられるTa2Nは、公知
のリアクティブスパッタリング法で形成されるが、サー
マルヘッドのステップストレステスト(SST)におい
て、発熱体4の特性を見ると第3図に嶺すように、発熱
体4に加える印加重力を大きくしていくと抵抗値の明ら
かな変曲点が存在し抵抗値はマイナス側に大きく変化し
つつ断線破壊にいたる基本的な特性を持っている。これ
は、スパッタリング等による成膜においては、一般に基
板温度が低いため、TL2Nの結晶の安定化度が低(、
嗅のストレスの大きい状態となっているためであり、発
熱ヘッドとして実用される発熱温度は、このTa2Nの
スパッタリング等による成膜時の基板温度よりも高いの
で、結晶の安定化が進み、抵抗値変化を起こすのである
By the way, the Ta2N used as the heating element 4 is formed by a known reactive sputtering method, but when looking at the characteristics of the heating element 4 in a step stress test (SST) of a thermal head, as shown in Figure 3. As the load applied to the heating element 4 is increased, there is a clear inflection point in the resistance value, and the resistance value changes greatly in the negative direction, which has a basic characteristic that leads to disconnection and failure. This is because the substrate temperature is generally low in film formation by sputtering, etc., so the degree of stabilization of the TL2N crystal is low (,
This is because the olfactory stress is high, and the temperature at which the heating head is used in practice is higher than the substrate temperature during film formation by Ta2N sputtering, etc., so the crystal becomes more stable and the resistance value increases. It brings about change.

このため、サーマルヘッド′の製造においては、発熱体
4が形成された基板2を拡散炉内等で加熱して全面アニ
ーリングが行なわれるが成膜工程が分断され生産能率が
低下する問題点があった。また、成膜温度を高温化(5
00’C!〜8QO’C)することによってアニーリン
グ効果を得ることも考えられるが、この方法では真空装
置の耐熱性等の制限があり十分なアニーリング効果を得
ることは難しいう この結果、第4図に示すように、通電時の発熱温度はド
ツト中央部4aでは高く、ドツト周辺部4bでは低くな
る。それと共に抵抗値の経時変化が大きく、記録品質を
変化させる一因となっている。
For this reason, in manufacturing the thermal head', the substrate 2 on which the heating element 4 is formed is heated in a diffusion furnace or the like to perform annealing over the entire surface, but there is a problem that the film forming process is divided and production efficiency is reduced. Ta. In addition, the film formation temperature was increased (5
00'C! Although it is possible to obtain an annealing effect by using 8QO'C), it is difficult to obtain a sufficient annealing effect with this method due to limitations such as the heat resistance of the vacuum equipment.As a result, as shown in Figure 4, In addition, the temperature generated during energization is high at the dot center 4a and low at the dot periphery 4b. At the same time, the resistance value changes significantly over time, which is one of the causes of changes in recording quality.

「発明の目的」 、j ″′発明の1的は・発熱体の自己発熱′″161
6低抵 杭禦域をドツト中央部に生じさせるようにして
抵抗値の経時変化が少なく、極めて安定なサーマルへ・
リド′を提供することにある。
``Object of the invention'', j ``One object of the invention is self-heating of the heating element'' 161
6. Low resistance By creating a pile area in the center of the dot, there is little change in resistance value over time, resulting in extremely stable thermal.
The goal is to provide lido.

1発用のS敗」 本発明のすiマルヘッドは、絶縁基板上に発熱体、給電
体、保護層および耐摩耗層が積層されており、発熱体に
自己発熱による低抵抗領域が形成されている。
The S-type head of the present invention has a heating element, a power supply, a protective layer, and a wear-resistant layer laminated on an insulating substrate, and a low resistance region due to self-heating is formed in the heating element. There is.

本発明によるサーマルへ・7ド゛は、構造的には第2r
Aに示した従来のものと同様である。
The thermal 7 door according to the present invention is structurally the 2nd door.
This is the same as the conventional one shown in A.

tfj2図において、スバ・、タリングにより形成した
後の発熱体4の抵抗値は、ドツト部全領域で均一とみて
よい。したがって、通電開始時には全領域に均一に電波
が流れ、均一に発熱する。しかし、通電パワーおよび時
間を太き?していくと、第1図巾へ線で示すように、ド
ツト中央部4aが高温度となり、Ta2Nの結晶状態が
変化して抵抗値が急速に低下を起こし、ドツト周辺部4
bと比べてドツト周辺部4aの抵抗値が低くなる。この
ように、ドツト周辺部4aが適度に抵抗値が低くなるよ
うに所定の電力と時間で通電を行ない調整する。
In the tfj2 diagram, the resistance value of the heating element 4 after being formed by svar-cutting can be considered to be uniform over the entire dot area. Therefore, at the start of energization, radio waves flow uniformly over the entire area, and heat is generated uniformly. But what about the energizing power and time? As the temperature increases, as shown by the line in FIG.
The resistance value of the dot peripheral portion 4a is lower than that of dot b. In this way, the dot peripheral portion 4a is energized and adjusted for a predetermined amount of time so that the resistance value is appropriately low.

なお、この際にスクリーニングの効果も得られ、サーマ
ルヘッド゛の信頼性が高まる。
Incidentally, at this time, a screening effect is also obtained, and the reliability of the thermal head is increased.

そして、このような抵抗値分布をもった発熱体4を用い
てサーマルヘッドを構成することにより、第1図中B線
で示すように、ドツト領域の温度分布は、ドツト中央部
4aに比べてドツト周辺部4bが高温になり、ドツト中
央部で鋭いピーク温度をもつことがなくなり平担化され
る。また、抵抗変化が実際に使用する電力範囲内では極
めて少なくなり、発熱効率および感熱紙の発色効率が良
好で長期に亙って印字品質が安定したものとなる。
By configuring the thermal head using the heating element 4 having such a resistance value distribution, the temperature distribution in the dot region is made smaller than that in the dot center portion 4a, as shown by line B in FIG. The temperature around the dot 4b becomes high, and the dot center no longer has a sharp peak temperature, but is flattened. Further, the resistance change is extremely small within the power range actually used, and the heat generation efficiency and coloring efficiency of the thermal paper are good, and the printing quality is stable over a long period of time.

なお、第1図中、C線は発色温度を示す。Note that in FIG. 1, line C indicates the coloring temperature.

さらに、上記のように通電アニールを行なうことにより
、第5図に示すように、例えばパルス幅t m5ec、
パルス周期5 m5ec、印加時間10分間、0.1 
w/5tepの条件でステップストレステスト(SST
)を行なった際、通電アニールで印加した電力までは抵
抗値の変動が無く、フラットなものとなる極めて安定な
結果を得ることができる。なお、第5図中、DI!は通
電アニール前の結果、E錦を士通雷7こ−117港の鈷
I#か云す−「発明の実施例」 第2図に示すような層構造をなすサーマルヘッド゛を製
造した。すなわち、アルミナセラミックスからなる絶縁
基板2上にガラスグレーズからなる熱抵抗層3を形成し
、この熱抵抗層3上にTa2Nをスパッタリングによっ
て0,05〜0.2 gmの厚みで形成して発熱体4と
した。次に、i p、mの厚みのA1膜および約0.5
用−の厚みのNi膜からなる給電体5を真空へ着により
形成した。そして、給電体パターン、発熱体パターンの
順でフォトエツチングを行ないサーマルヘッド゛のパタ
ーンを形成したう次に、0.ガスを用いたプラズマアッ
シングでレジストを除去し、端子部をメタルマスクで覆
った後、約2舊■厚みの5i07嗅よりなる発熱体保護
層8および約5 gmの厚みのTa205膜よりなる耐
摩耗層7をスパッタリングにより形成した。
Furthermore, by performing current annealing as described above, as shown in FIG. 5, for example, the pulse width t m5ec,
Pulse period 5 m5ec, application time 10 minutes, 0.1
Step stress test (SST) under the condition of w/5tep
), it is possible to obtain extremely stable results in which the resistance value does not change and is flat up to the power applied during energization annealing. In addition, in Figure 5, DI! Embodiments of the Invention A thermal head having a layered structure as shown in FIG. 2 was manufactured. That is, a heat resistance layer 3 made of glass glaze is formed on an insulating substrate 2 made of alumina ceramics, and Ta2N is formed on this heat resistance layer 3 by sputtering to a thickness of 0.05 to 0.2 gm to form a heating element. It was set as 4. Next, an A1 film with a thickness of i p, m and about 0.5
A power supply body 5 made of a Ni film having a thickness of about 100 mL was formed by vacuum deposition. Then, photoetching is performed in the order of the power supply pattern and the heating element pattern to form the pattern of the thermal head. After removing the resist by plasma ashing using gas and covering the terminals with a metal mask, a heating element protective layer 8 made of a 5i07 film with a thickness of about 2 cm and an abrasion resistant film made of a Ta205 film with a thickness of about 5 gm are applied. Layer 7 was formed by sputtering.

こうして製造されたサーマルヘッドに1.5W/DOT
の印加電力で0.5時間通電加熱して、第1図中B線で
示すように、発熱体4のドツト中央部4aの抵抗値をド
゛、)周辺部4bの抵抗値よりも下げるようにアニーリ
ングを行なった。
The thermal head manufactured in this way has a power of 1.5W/DOT.
The heating element 4 is electrically heated for 0.5 hours with an applied power of 0.5 hours, so that the resistance value of the dot center part 4a of the heating element 4 is lower than the resistance value of the peripheral part 4b of the heating element 4, as shown by the line B in FIG. Annealing was performed.

このサーマルへ・ソド゛は ドツトのほぼ全域に亙って
均一な温度分布が得られ、印字に際し画像の連続性等も
良好に表現することができた。また、使用中、発熱体4
の抵抗値の経時変化が少なぐ、ステ・・ノブストレステ
スト(SST)においては1.5W/DOTの印加重力
までは抵抗値の変動゛がない極めて優れた集的安定性を
示した。
With this thermal printing method, a uniform temperature distribution was obtained over almost the entire area of the dot, and good continuity of the image could be expressed during printing. Also, during use, the heating element 4
In the Ste-Knob Stress Test (SST), it showed extremely excellent collective stability with no change in resistance value up to an applied load of 1.5 W/DOT.

「発明の効果」 υ上説明したように、本発明によれば、発熱体に自己発
熱による低抵抗領域が形成されているので、ドツトの全
領域に亙ってほぼ均一な発熱温度が得られ、良好な印字
がなされると共に、使用時に発熱体の抵抗値の経時変化
が少なく、かつ、優れた*!&的安定性が得られる。
"Effects of the Invention" υAs explained above, according to the present invention, a low resistance region due to self-heating is formed in the heating element, so a substantially uniform heating temperature can be obtained over the entire area of the dot. In addition to good printing, there is little change in the resistance value of the heating element over time during use, and it is excellent *! & stability can be obtained.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明によるサーマルヘッドの発熱部′ の温
度分布を示す図表、第2図はサーールヘ・ドの一般的な
構造を示す断面図、第3図は従来のサーマルヘッドのス
テップストレステスト(SST)の結果を示す図表、第
4図は従来のサーマルヘッド゛の発熱部の温度分布を示
す図表、第5図は本発明によるサーマルヘッドのステッ
プストレステスト(SST)の結果を示す図表である。 1閾由、【はサーマルヘッド゛、2は絶縁炉板、3は熱
抵抗層、4は発熱体、4aはドツト中央部、4bはドツ
ト周辺部、5は給電体、6は保護層、7は耐摩耗層であ
る。 第J’+11 第2冒1 第3図 第4図
Fig. 1 is a chart showing the temperature distribution of the heat generating part of the thermal head according to the present invention, Fig. 2 is a sectional view showing the general structure of the thermal head, and Fig. 3 is a step stress test of the conventional thermal head. Figure 4 is a diagram showing the temperature distribution of the heat generating part of a conventional thermal head; Figure 5 is a diagram showing the results of a step stress test (SST) of the thermal head according to the present invention. . 1 threshold, [is a thermal head, 2 is an insulated furnace plate, 3 is a thermal resistance layer, 4 is a heating element, 4a is a dot center, 4b is a dot periphery, 5 is a power supply body, 6 is a protective layer, 7 is the wear-resistant layer. J'+11 2nd adventure 1 Figure 3 Figure 4

Claims (1)

【特許請求の範囲】[Claims] 絶縁基板りに発熱体、給電体、保護層および耐摩耗層が
積層され、給電体を介して発熱体に通電し発熱させて感
熱記録紙に所望の記録像を形成するサーマルヘッド゛に
おいて、前記発熱体に自己発弧による低抵抗領域が形成
されていることを特徴とするサーマルへ・・、ド“。
In a thermal head, a heating element, a power supply, a protective layer and an abrasion resistant layer are laminated on an insulating substrate, and the heating element is energized through the power supply to generate heat to form a desired recorded image on thermal recording paper. Thermal is characterized by a low resistance region formed in the heating element due to self-ignition.
JP11530184A 1984-06-05 1984-06-05 Thermal head Pending JPS60259469A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11530184A JPS60259469A (en) 1984-06-05 1984-06-05 Thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11530184A JPS60259469A (en) 1984-06-05 1984-06-05 Thermal head

Publications (1)

Publication Number Publication Date
JPS60259469A true JPS60259469A (en) 1985-12-21

Family

ID=14659243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11530184A Pending JPS60259469A (en) 1984-06-05 1984-06-05 Thermal head

Country Status (1)

Country Link
JP (1) JPS60259469A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000069635A1 (en) * 1999-05-13 2000-11-23 Casio Computer Co., Ltd. Heating resistor and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000069635A1 (en) * 1999-05-13 2000-11-23 Casio Computer Co., Ltd. Heating resistor and manufacturing method thereof

Similar Documents

Publication Publication Date Title
JPS60259469A (en) Thermal head
JPH0312551B2 (en)
JPS62151359A (en) Thermal head
JPH05131666A (en) Method for manufacture of thermal head
KR100243427B1 (en) Manufacturing method of thermal head
JP3074625B2 (en) Thermal print head and method of manufacturing the same
JPS62158062A (en) Thermal head and production thereof
JP2825209B2 (en) Manufacturing method of thin film thermal head
JP3262388B2 (en) Manufacturing method of thermal printer head
JPS6045595B2 (en) Method of manufacturing thermal head
KR920008402B1 (en) Manufacturing method of thermal print head device
JPH0839855A (en) Thermal head and production thereof
JPH0557938A (en) Manufacture of thermal head
JPH0782921B2 (en) Method of manufacturing thermal head
JPS5872477A (en) Heat-sensitive recording head
JPH05169701A (en) Manufacture of thermal head
JPS62111766A (en) Thermal head
JPH05318793A (en) Thermal head and production thereof
JPH05147248A (en) Thermal head and preparation thereof
JPS5836474A (en) Thermal head
JPH01112702A (en) Thermal head
JPH07309025A (en) Thermal head
JP2000052585A (en) Thermal head and its manufacture
JPS62202759A (en) Production of exothermic resistance element
JPH0550630A (en) Thermal head and manufacture thereof