JPS60258965A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS60258965A JPS60258965A JP59114562A JP11456284A JPS60258965A JP S60258965 A JPS60258965 A JP S60258965A JP 59114562 A JP59114562 A JP 59114562A JP 11456284 A JP11456284 A JP 11456284A JP S60258965 A JPS60258965 A JP S60258965A
- Authority
- JP
- Japan
- Prior art keywords
- film
- polycrystalline silicon
- layer
- oxide film
- polycrystalline
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10P32/1414—
-
- H10D64/0113—
-
- H10P32/171—
Landscapes
- Bipolar Transistors (AREA)
- Weting (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59114562A JPS60258965A (ja) | 1984-06-06 | 1984-06-06 | 半導体装置の製造方法 |
| US06/741,525 US4640721A (en) | 1984-06-06 | 1985-06-05 | Method of forming bipolar transistors with graft base regions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59114562A JPS60258965A (ja) | 1984-06-06 | 1984-06-06 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60258965A true JPS60258965A (ja) | 1985-12-20 |
| JPH0570931B2 JPH0570931B2 (cg-RX-API-DMAC10.html) | 1993-10-06 |
Family
ID=14640915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59114562A Granted JPS60258965A (ja) | 1984-06-06 | 1984-06-06 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60258965A (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0629472A (ja) * | 1992-04-03 | 1994-02-04 | Toshiba Corp | 半導体装置およびその製造方法 |
-
1984
- 1984-06-06 JP JP59114562A patent/JPS60258965A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0629472A (ja) * | 1992-04-03 | 1994-02-04 | Toshiba Corp | 半導体装置およびその製造方法 |
| US5597757A (en) * | 1992-04-03 | 1997-01-28 | Kabushiki Kaisha Toshiba | Method of manufacturing a semiconductor device including bipolar and MOS transistors |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0570931B2 (cg-RX-API-DMAC10.html) | 1993-10-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5857902B2 (ja) | 狭いマスク開孔の形成方法 | |
| EP0076106B1 (en) | Method for producing a bipolar transistor | |
| EP0076147A2 (en) | Method of producing a semiconductor device comprising an isolation region | |
| JPS60258965A (ja) | 半導体装置の製造方法 | |
| JPH0243336B2 (cg-RX-API-DMAC10.html) | ||
| JPS5912020B2 (ja) | 半導体装置の製造方法 | |
| JPS6220711B2 (cg-RX-API-DMAC10.html) | ||
| JPS60258964A (ja) | 半導体装置の製造方法 | |
| JPS6115579B2 (cg-RX-API-DMAC10.html) | ||
| JP2707536B2 (ja) | 半導体装置の製造方法 | |
| JPS6134255B2 (cg-RX-API-DMAC10.html) | ||
| JPS6128231B2 (cg-RX-API-DMAC10.html) | ||
| JPH0247853B2 (cg-RX-API-DMAC10.html) | ||
| JP2594697B2 (ja) | 半導体装置の製造方法 | |
| JPH0126186B2 (cg-RX-API-DMAC10.html) | ||
| JPS59134868A (ja) | 半導体装置の製造方法 | |
| JPH0227813B2 (cg-RX-API-DMAC10.html) | ||
| JPH0616510B2 (ja) | 半導体装置の製造方法 | |
| JPS6145392B2 (cg-RX-API-DMAC10.html) | ||
| JPS60249364A (ja) | 半導体装置の製造方法 | |
| JPH0140502B2 (cg-RX-API-DMAC10.html) | ||
| JPS6115589B2 (cg-RX-API-DMAC10.html) | ||
| JPS6150343A (ja) | 半導体素子の分離法 | |
| JPH01123471A (ja) | 半導体装置の製造方法 | |
| JPS61147575A (ja) | 半導体装置の製造方法 |