JPS60258943A - Heat dissipating device - Google Patents

Abstract

PURPOSE:To obtain the titled device of low cost and easy in management such as maintenance and in handling by eliminating a waste of membes by a method wherein this device is so constructed as to have a heat conduction member produced by integral formation by connecting a plurality of heat conduction plates corresponding to each of a plurality of electronic components with wires. CONSTITUTION:Heat conduction plates 11-13 are provided by corresponding to each of three electronic components, and plates 11, 12 and 12, 13 are each connected with fine wires 10 and 10' into an integral body; then, this product is used as a heat conduction member. Adoption of such a structure markedly facilitates component management in the factory, the management of maintenance components during the service section, and the like because of the need of members of the minimum number and because of trouble taken only for a piece in handling.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a heat radiating device, and more particularly to a heat radiating device that radiates heat from a plurality of electronic components that generate heat.

[Prior art]

Conventionally, various means have been known for dissipating heat from electronic components that generate heat.

FIG. 1 shows a heat dissipation means used for a plurality of semiconductors mounted on a printed circuit board.

In the figure, the symbols 1 to 6 are semiconductors, respectively.
A heat dissipating member 8, which is mounted on a printed circuit board 9 and made of metal or the like, with a heat conductive member attached to the back side, is placed in pressure contact with the upper surfaces of the semiconductors 1 to B.

This heat conductive member is made of a material such as silicone rubber that has good heat conductivity and is highly contractible, and its shape is, for example, a quadrilateral as shown in Figures 1 (B) and (C). It has a flat plate shape and is arranged to cover the entire printed circuit board.

In such a structure, since the heat conductive member 4 is also used in a portion not in contact with the semiconductors 1 to 3, there is an extremely large amount of waste, resulting in high cost.

Therefore, as shown in FIG. 1(b), an attempt was made to provide a structure in which the same number of heat conductive members 5 to 7 as semiconductors 1 to 3 are provided and heat is radiated in correspondence with each other.

However, in this case, there are the same number of heat conductive members as there are electronic components that generate heat, resulting in a disadvantage that management such as maintenance becomes troublesome.

〔the purpose〕

The present invention was made in order to eliminate the above-mentioned conventional drawbacks, and an object of the present invention is to provide a heat dissipation device that is inexpensive and easy to manage and handle.

〔Example〕

Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.

FIG. 2 illustrates a heat conductive member applied to the present invention, and here, a case will be described using as an example a case where heat is radiated from electronic components of three sizes similar to those shown in FIG. 1.

That is, in this embodiment, heat conductive plates 11 to 13 are provided corresponding to each of the three electronic components, and thin wires 10 and 10' are connected between these heat conductive plates 11, 12, and 12, respectively. The connected and integrated parts are used as heat conductive members.

If such a structure is adopted, only a minimum number of parts are required, and the labor required for handling only one piece, making it extremely easy to manage parts in the factory and maintenance parts in the service department. 3) Become.

〔effect〕

As is clear from the above description, according to the present invention, a structure is adopted in which a heat conductive member is integrated by connecting a plurality of heat conductive plates corresponding to a plurality of electronic components with wires. Therefore, it is possible to obtain a heat dissipation device that is inexpensive, has no wasted parts, and is easy to manage and handle, such as maintenance.

[Brief explanation of drawings]

Figures 1 (A) to (■) explain the conventional structure.
) is a plan view of the printed circuit board, FIG. Fig. 2 is a plan view illustrating one embodiment of a heat conductive member applied to the present invention.1-3...Semiconductor 4-7...Heat conductive member 8...-
Heat dissipation member 9...Printed circuit board 10.10'...Wire rod 11-13...-Heat conductive plate patent applicant Canon Corporation 9)! −

Claims (1)

[Claims] In a heat dissipation device that dissipates heat from a plurality of electronic components that generate heat, a heat conduction member is a device in which a plurality of heat conduction plates are provided corresponding to each of the electronic components, and each heat conduction plate is connected with a wire rod to be integrated. A heat dissipation device characterized by being used as a heat dissipation device.