JPS60256209A - チツプ形圧電共振子 - Google Patents
チツプ形圧電共振子Info
- Publication number
- JPS60256209A JPS60256209A JP11341284A JP11341284A JPS60256209A JP S60256209 A JPS60256209 A JP S60256209A JP 11341284 A JP11341284 A JP 11341284A JP 11341284 A JP11341284 A JP 11341284A JP S60256209 A JPS60256209 A JP S60256209A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric element
- cylindrical body
- conductive
- projections
- cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001105 regulatory effect Effects 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 238000003780 insertion Methods 0.000 abstract description 4
- 230000037431 insertion Effects 0.000 abstract description 4
- 239000004033 plastic Substances 0.000 abstract description 2
- 239000000919 ceramic Substances 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 8
- 238000004806 packaging method and process Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11341284A JPS60256209A (ja) | 1984-06-01 | 1984-06-01 | チツプ形圧電共振子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11341284A JPS60256209A (ja) | 1984-06-01 | 1984-06-01 | チツプ形圧電共振子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60256209A true JPS60256209A (ja) | 1985-12-17 |
| JPH0574963B2 JPH0574963B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-10-19 |
Family
ID=14611609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11341284A Granted JPS60256209A (ja) | 1984-06-01 | 1984-06-01 | チツプ形圧電共振子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60256209A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1984
- 1984-06-01 JP JP11341284A patent/JPS60256209A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0574963B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-10-19 |