JPS60251390A - Manufacture of heat pipe - Google Patents

Manufacture of heat pipe

Info

Publication number
JPS60251390A
JPS60251390A JP59107855A JP10785584A JPS60251390A JP S60251390 A JPS60251390 A JP S60251390A JP 59107855 A JP59107855 A JP 59107855A JP 10785584 A JP10785584 A JP 10785584A JP S60251390 A JPS60251390 A JP S60251390A
Authority
JP
Japan
Prior art keywords
envelope
powder
wick
fine
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59107855A
Other languages
Japanese (ja)
Inventor
Yoshiaki Hitotsubashi
一橋 義明
Takeshi Matsunaga
剛 松永
Osamu Katagiri
片桐 修
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Refrigeration Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Refrigeration Co filed Critical Matsushita Refrigeration Co
Priority to JP59107855A priority Critical patent/JPS60251390A/en
Publication of JPS60251390A publication Critical patent/JPS60251390A/en
Pending legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Powder Metallurgy (AREA)

Abstract

PURPOSE:To bond wick to an envelope strongly without changing the porosity of the wick by a method wherein the powder, which becomes the material of the wick, and binding powder are loaded into the envelope and the envelope is heated locally under being rotated. CONSTITUTION:The material powder 2, consisting of copper pieces having the grain size of 200 mesh or less, and the fine binding powder 3 of low melting solder having the grain size of 500 mesh substantially are mixed in the envelope 1 consisting of a copper tube. The envelope is rotated under being kept in horizontal. Then, a heater 4, located at the outside of the envelope 1, is moved from one end to the other end of the envelope 1 sequentially to heat and bond the powders. Thus, the outer peripheral portion of the material powder 2 is bonded to the inner wall of the envelope 1 by welding strongly through the fine bonding powder 3 under keeping uniform porosity of the wick.

Description

【発明の詳細な説明】 産業上の利用分野 本発明はヒートパイプの製造方法に関するものである。[Detailed description of the invention] Industrial applications The present invention relates to a method for manufacturing a heat pipe.

従来例の構成とその問題点 ヒートパイプとしては、熱伝導率の高い金属製のエンベ
ロープ内壁面に沿って多孔性のウィックを配し、内部に
熱媒体となる作業液体を封入し、パイプの両端を閉鎖し
て内部を減圧したものが一般である。
Conventional structure and its problems A heat pipe consists of a porous wick arranged along the inner wall of a metal envelope with high thermal conductivity, a working liquid serving as a heat medium sealed inside, and a heat pipe at both ends of the pipe. It is common that the tank is closed and the internal pressure is reduced.

そして、パイプの一端に熱が加わると作動液体は気化熱
によシ蒸発し、他端に移動して熱を放散して凝縮し、毛
細管作業によってウィック内を移動して元に戻り、再び
蒸発して熱の伝達を行う。
When heat is applied to one end of the pipe, the working liquid evaporates due to the heat of vaporization, moves to the other end, dissipates the heat and condenses, moves through the wick through capillary action, returns to its original state, and evaporates again. heat transfer.

以上の過程において、作動液体の蒸発の際の気化熱吸収
と凝縮の際の潜熱放出はエンベロープとウィックとを介
して行われる。従って、その伝熱効率はエンベロープと
ウィックとの接合の度合如何によって大きく左右される
ものである。
In the above process, vaporization heat absorption during evaporation of the working liquid and latent heat release during condensation are performed via the envelope and the wick. Therefore, the heat transfer efficiency is greatly influenced by the degree of bonding between the envelope and the wick.

従来、エンベロープとウィックの接合は、拡散接合法に
より、加熱炉内で拡散開始mJまで加熱して行っていた
。しかしこの方式の場合、パイプ全体を加熱する接合完
了迄に時間を要し、しかもバッチ式なって生産性が悪い
という問題点がある。
Conventionally, the envelope and the wick have been bonded by a diffusion bonding method by heating in a heating furnace to mJ at which diffusion starts. However, this method has the problem that it takes time to heat the entire pipe to complete joining, and that it is a batch method, which is poor in productivity.

また、ウィックの材料として金属粉体を用いた場合には
、接合温度迄加熱することにより、金属粉体の焼結が起
シ、収縮によって気孔率が変化したシ、エンベロープと
の剥離が起きたりして、安定した接合を得ることが難し
い。
In addition, when metal powder is used as the wick material, heating to the bonding temperature may cause sintering of the metal powder, change in porosity due to shrinkage, and peeling from the envelope. Therefore, it is difficult to obtain a stable bond.

発明の目的 本発明は、上記従来の欠点をなくし連続部分加熱を利用
することによって、気孔率が均一で、かつ、エンベロー
プ内壁に確実に、微粉末接合粉体を接合させることを目
的とするものである。
Purpose of the Invention The object of the present invention is to eliminate the above-mentioned drawbacks of the conventional method and to use continuous partial heating to ensure that fine bonding powder has a uniform porosity and is bonded to the inner wall of the envelope. It is.

発明の構成 本発明は、上記目的を達成するために、ウィックの材料
となる材料粉体と接合用の微粉末接合粉体とを、予め所
定の割り合いに調合した上、エンベロープ内に入れ、回
転させながら、外部よシ順次加熱するものである。
Structure of the Invention In order to achieve the above-mentioned object, the present invention comprises mixing a material powder serving as a wick material and a fine bonding powder for bonding in a predetermined ratio in advance, and then placing the mixture in an envelope. It heats the outside in sequence while rotating.

実施例の説明 次に本発明の一実施例を第1図から第3図を参考に説明
する。1は鋼管から成るエンベロープで、その内部に、
200メツシユ以下の銅片から成る材料粉体2、及び、
500メソシュ程度の低融合ハンダの微粉末接合粉体3
として、同時混入している。そして、前記エンベロープ
1に、封入された材料粉体2及び微粉末接合粉体3が、
こぼれない程度に水平に保った上で、エンベロープ1を
円周方向に回転させる。そして、エンベロープ1の外方
に位置するヒーター4をエンベロープ1の一端よシ順次
他方に移動させて加熱溶着させる。
DESCRIPTION OF EMBODIMENTS Next, an embodiment of the present invention will be described with reference to FIGS. 1 to 3. 1 is an envelope made of steel pipe, inside which
Material powder 2 consisting of copper pieces of 200 meshes or less, and
Fine powder bonding powder of low fusion solder of about 500 mesosh 3
As such, they are mixed at the same time. Then, the material powder 2 and the fine bonded powder 3 enclosed in the envelope 1 are
Rotate the envelope 1 in the circumferential direction while keeping it horizontal to the extent that it does not spill. Then, the heater 4 located outside the envelope 1 is sequentially moved from one end of the envelope 1 to the other to heat and weld the envelope 1.

従って、エンベロープ1の内壁と材料粉体2の外周部が
微粉末接合粉体3により強力に溶接されて接合するもの
である。
Therefore, the inner wall of the envelope 1 and the outer periphery of the material powder 2 are strongly welded and joined by the fine bonding powder 3.

又、溶接の深さはエンベロープ1及び材料粉体2の表面
荒さ、洗浄度にもよるが、ヒータ4の熱容量及び移動速
度を加減する事により容易に、かつ、必要に応じて調整
することができる。
Furthermore, the welding depth depends on the surface roughness and cleanliness of the envelope 1 and material powder 2, but can be easily adjusted as necessary by adjusting the heat capacity and moving speed of the heater 4. can.

発明の効果 本発明は上記実施例より明らかなように、ウィックとな
る微粉末接合体と材料粉体とを同時にエンベロープ内に
混入し、エンベロープを回転させ、かつ部分加熱を行う
ことにより、微粉末接合粉体の気孔率を変化させること
なく、微粉末接合粉体をエンベロープに強力に接合する
ことができ、しかも接合作業は瞬時に行えるばかりでな
く連続的に行うことができるので生産性が大巾に向上す
る。
Effects of the Invention As is clear from the above embodiments, the present invention produces fine powder by simultaneously mixing a fine powder bonded body to become a wick and material powder into an envelope, rotating the envelope, and performing partial heating. The fine bonded powder can be strongly bonded to the envelope without changing the porosity of the bonded powder, and the bonding work can be done not only instantaneously but also continuously, resulting in high productivity. Improving dramatically.

また、得られたヒートパイプは非常に高い伝熱効率を有
することができる。
Moreover, the obtained heat pipe can have very high heat transfer efficiency.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例におけるヒートパイプの断面
図、第2図は加熱時に於けるエンベロープ内部分断面図
、第3図は同第1図の一部拡大断面図である。 1・・・・・・エンベロープ、2・・・・・・微粉末接
合粉体、3・・・・・・接合粉体、4・・・・・・ヒー
ター、6・・・・・・溶融部分・ 代理人の氏名 弁理士 中 尾 敏 男 ほか1名第1
図 第3図
FIG. 1 is a sectional view of a heat pipe according to an embodiment of the present invention, FIG. 2 is a partial sectional view of the inside of an envelope during heating, and FIG. 3 is a partially enlarged sectional view of FIG. 1. 1... Envelope, 2... Fine bonded powder, 3... Bonded powder, 4... Heater, 6... Melting Part/Name of agent Patent attorney Toshio Nakao and 1 other person 1st
Figure 3

Claims (1)

【特許請求の範囲】 エンベロープ内の所定の空間に、材料粉体と、この材料
粉体を前記エンベロープ内に溶着させウィックとなる微
粉末接合粉体とを混入し、このエンベロープを回転させ
ながら順次加熱することにより、エンベロープと微粉末
接合粉体とを浴接す塀 ることを特徴とするヒートパイプの勢造方法。
[Claims] In a predetermined space within an envelope, a material powder and a fine bonded powder that is made by welding the material powder into the envelope and become a wick are mixed, and the material is mixed in a predetermined space while rotating the envelope. A method for forming a heat pipe, which is characterized in that an envelope and a fine bonded powder are brought into bath contact by heating.
JP59107855A 1984-05-28 1984-05-28 Manufacture of heat pipe Pending JPS60251390A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59107855A JPS60251390A (en) 1984-05-28 1984-05-28 Manufacture of heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59107855A JPS60251390A (en) 1984-05-28 1984-05-28 Manufacture of heat pipe

Publications (1)

Publication Number Publication Date
JPS60251390A true JPS60251390A (en) 1985-12-12

Family

ID=14469768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59107855A Pending JPS60251390A (en) 1984-05-28 1984-05-28 Manufacture of heat pipe

Country Status (1)

Country Link
JP (1) JPS60251390A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002044639A1 (en) * 2000-11-30 2002-06-06 Khpt Co., Ltd Sintered wick structure heat pipe with parallel pipe holes and manufature method thereof
EP1296373A3 (en) * 2001-08-28 2006-10-04 Advanced Materials Technologies, Pte Ltd. Advanced microelectronic heat dissipation package and method for its manufacture
FR2886721A1 (en) * 2005-06-01 2006-12-08 Metal Process Sarl Heat pipe tube manufacturing method for e.g. heat conductor block, involves distributing, in tube, sintered metallic powder in shape of half-moon, where height of half-moon is variable along longitudinal axis of heat pipe
WO2009131786A2 (en) * 2008-04-24 2009-10-29 3M Innovative Properties Company Porous structured thermal transfer article
CN110686541A (en) * 2018-07-04 2020-01-14 广州力及热管理科技有限公司 Method for manufacturing capillary structure
CN113245550A (en) * 2020-02-12 2021-08-13 米巴烧结奥地利有限公司 Method for manufacturing heat pipe

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002044639A1 (en) * 2000-11-30 2002-06-06 Khpt Co., Ltd Sintered wick structure heat pipe with parallel pipe holes and manufature method thereof
EP1296373A3 (en) * 2001-08-28 2006-10-04 Advanced Materials Technologies, Pte Ltd. Advanced microelectronic heat dissipation package and method for its manufacture
FR2886721A1 (en) * 2005-06-01 2006-12-08 Metal Process Sarl Heat pipe tube manufacturing method for e.g. heat conductor block, involves distributing, in tube, sintered metallic powder in shape of half-moon, where height of half-moon is variable along longitudinal axis of heat pipe
WO2009131786A2 (en) * 2008-04-24 2009-10-29 3M Innovative Properties Company Porous structured thermal transfer article
WO2009131786A3 (en) * 2008-04-24 2010-12-09 3M Innovative Properties Company Porous structured thermal transfer article
CN110686541A (en) * 2018-07-04 2020-01-14 广州力及热管理科技有限公司 Method for manufacturing capillary structure
CN113245550A (en) * 2020-02-12 2021-08-13 米巴烧结奥地利有限公司 Method for manufacturing heat pipe
AT523427A4 (en) * 2020-02-12 2021-08-15 Miba Sinter Austria Gmbh Process for the production of a heat pipe
AT523427B1 (en) * 2020-02-12 2021-08-15 Miba Sinter Austria Gmbh Process for the production of a heat pipe
US11536517B2 (en) 2020-02-12 2022-12-27 Miba Sinter Austria Gmbh Method for producing a heat pipe

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