JPS60248877A - 放電被覆加工装置 - Google Patents
放電被覆加工装置Info
- Publication number
- JPS60248877A JPS60248877A JP10554484A JP10554484A JPS60248877A JP S60248877 A JPS60248877 A JP S60248877A JP 10554484 A JP10554484 A JP 10554484A JP 10554484 A JP10554484 A JP 10554484A JP S60248877 A JPS60248877 A JP S60248877A
- Authority
- JP
- Japan
- Prior art keywords
- vibration
- mover
- coating material
- rotation
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 36
- 239000011248 coating agent Substances 0.000 title claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 22
- 238000003754 machining Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 3
- 239000011247 coating layer Substances 0.000 description 5
- 230000005284 excitation Effects 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10554484A JPS60248877A (ja) | 1984-05-24 | 1984-05-24 | 放電被覆加工装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10554484A JPS60248877A (ja) | 1984-05-24 | 1984-05-24 | 放電被覆加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60248877A true JPS60248877A (ja) | 1985-12-09 |
JPH0261551B2 JPH0261551B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-12-20 |
Family
ID=14410524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10554484A Granted JPS60248877A (ja) | 1984-05-24 | 1984-05-24 | 放電被覆加工装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60248877A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0230753A (ja) * | 1988-07-20 | 1990-02-01 | K S P:Kk | 電極材被覆マイクロ溶接装置 |
-
1984
- 1984-05-24 JP JP10554484A patent/JPS60248877A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0230753A (ja) * | 1988-07-20 | 1990-02-01 | K S P:Kk | 電極材被覆マイクロ溶接装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0261551B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-12-20 |
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