JPS6024268A - Preliminary soldering device - Google Patents

Abstract

PURPOSE:To stick stably a substantial amt. of preliminary solder by supplying every prescribed number of the spherical solder loaded in a holder to supply section, supplying a spherical solder in a supply section to a terminal section of parts and heating said section thereby melt-sticking the same. CONSTITUTION:A shaft j-1 is lifted by the rotation of a gear k-1 to tilt a holder (g) contg. spherical solder (f) to supply a prescribed number of the solder to a supply section (h) in a horizontal state. The gear k-1 is then rotated to tilt the holder (g) in the opposite direction. A gear k-2 is thereafter rotated to lift and tilt the section (h) by means of a shaft j-2 to supply correctly the spherical solder (f) to the terminals (a) of a leadless chip carrier (e). Th carrier (e) is further heated to the m.p. of the solder or above by a heater (m) over the parts holding section (l) so that the spherical solder (f) is heated to melt simultaneously with the supply. The melt-sticking is thus accomplished in a fixed time. Such operation is repeated successively and the preliminary soldering is stably accomplished.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for assembling electronic equipment, and particularly to an apparatus for pre-soldering parts.

Conventionally, in the process of manufacturing electronic devices by mounting and soldering electronic components on wiring boards, terminal parts of components or mounting boards have been used as a means of improving solder connectivity between components and wiring boards and increasing reliability. A method of preliminarily melting solder has been used.

This method is a particularly important control factor in surface connection soldering in which the lead wires are not inserted into through holes etc., in order to ensure the amount of solder and the eye/knot shape.
The currently used methods of supplying solder paste by screen printing or dipping into molten solder, etc.
There was a drawback that it was difficult to secure a sufficient amount and obtain stability of the amount.

The present invention solves the above-mentioned drawbacks by supplying spherical solder to the terminal portion at a constant rate, heating and melting it, and uses a pre-soldering device that can secure and stabilize the amount of solder at the same time. This is what we provide.

The present invention comprises a holder for loading spherical solder, a supply section provided with a groove so that one to several solder balls are supplied from the holder to each terminal, a drive section for controlling the inclination of these solder balls, and a mounting section. It consists of a heating part that heats the board, and by tilting the holder, the spherical solder loaded on the holder is supplied to the supply part by turning one to several solder balls per terminal part. The solder is supplied to the terminal portion of the mounting board and then heated from below to fuse the solder to the component or the terminal portion of the mounting board.

Embodiments of the present invention will be described below with reference to the drawings.

Figures 1 and 2 are a plan view and a side view showing a leadless chip carrier, which is an example of a component to which preliminary soldering is performed by the soldering apparatus of the present invention.

The leadless chip carrier e shown in these figures has substantially rectangular solder terminals a provided around the four circumferences of a main body C made of ceramic. Here, b is a long terminal for direction identification. Further, d is the vagina of the leadless chip carrier, which is made of metal or ceramic and is bonded by welding, soldering, or glass frit.

2 to 4 are side views showing different operating states of an embodiment of the pre-soldering apparatus of the present invention, and FIG. 5 is a plan view of the state shown in FIG. 3.

In these figures, the apparatus of the present invention includes a holder g loaded with spherical solder f, and one to several solder terminals a and identification terminals of a leadless chip carrier e to which solder is to be fused from the holder g. A supply section is provided with grooves r corresponding to each terminal so as to supply solder balls f at a time, and the holder g.
and one end of the supply section, respectively) j-1,
j-2, gears -1 and k-2, and a drive section that controls the inclination of these, and a heater m provided on the lower surface of the component holding section l that holds the leadless chip Yariya e on the upper surface. and a heating section that heats the carrier e.

The supply section is made of a metal such as stainless steel to which solder does not adhere, and care has been taken to prevent the molten spherical solder f from being deformed or reduced.

Next, the present invention configured as described above will be explained with reference to the above-mentioned figures.

Figure 2 shows the operation of supplying spherical solder from the holder to the supply section, in which the holder g is tilted toward the 1-component holding section l by the shirt j-1 pushed up by the gear by -1 rotation. The loaded spherical solder f is placed in the component holding part l.
move it to the side. At this time, the supply section is horizontal due to the shirt (j-2) pushed down by the gear (-2 rotation), and receives the spherical solder f that has moved from the adjacent holder g. At this time, the number of spherical solder f is limited by the width of the groove r in the supply part and the nine small protrusions n provided at the bottom.
It is determined as follows.

FIG. 3 shows a supply section h [supplied predetermined amount of spherical solder f
This figure shows the operation of supplying the chip to the terminal a or the terminal of the leadless chip carrier e. and properly supply a predetermined amount of spherical solder f onto the terminals a and terminals of the leadless chip carrier e. FIG. 5 shows this state. The leadless chip carrier e is heated above the melting point of the solder by a heater m on the component holding part l, and the spherical solder f starts to be heated and melted at the same time as it is supplied, and the fusion is completed in a certain period of time. Complete.

Figure 4 shows the release operation of the supply part after welding to the terminal, and when the melting is completed and a complete pre-solder p is formed on the terminal a or the terminal plate, the supply part is removed from the gear. -1, k-2
to operate the shafts j-1 and j-2, and
By restoring the state to the same state as shown in the figure, the supply section is detached from the leadless chip carrier e, and the preliminary soldering is completed.

At this time, the next operation is to supply new spherical solder f from the holder g to the supply section, take out the leadless chip carrier q on which preliminary soldering has been completed, and supply a new leadless chip carrier e. This allows for continuous pre-soldering.

As explained above, the present invention has the effect of stably forming a sufficient amount of preliminary solder by supplying a certain amount of spherical solder to the terminal using a supply mechanism and then heating and melting the solder.

[Brief explanation of drawings]

Figure 1 (4), @ is a plan view and side view showing a leadless chip carrier which is an example of a component to be pre-soldered by the soldering device of the present invention, and Figures 2 to 4 are the pre-soldered parts of the present invention. Figure #I5, which is a side view showing different operating states of one embodiment of the apparatus, is a plan view of the state shown in Figure 3 above. a...Solder material terminal b...Identification terminal C...Leadless chip carrier body d...Leadless chip carrier lid e...Leadless chip carrier f...Spherical solder g... Holder h...supply part j-t, j-z...-1, k-2 on the shaft
...Gear l...Component holding part m...Heater n...
・Small protrusion p...Preliminary solder q...Leadless chip carrier with pre-soldering completed Applicant NEC Corporation

Claims (1)

[Claims] A holder for loading spherical solder, and a core holder for each terminal of the component or mounting board to which the solder is to be fused.
~Comprised of a supply section provided with a groove so that solder balls are supplied one by one, a drive section that controls the inclination of these solder balls, and a heating section that heats the above-mentioned component or mounting board, the above-mentioned drive section By tilting the holder, the spherical solder loaded on the holder is delivered to the supply section at one point per terminal.
~ Rotate and feed several balls, and then tilt the feeding section one more time,
The heating unit is configured to supply the solder balls to the terminal portions of the component or the mounting board, and the heating unit heats the component or the mounting board to which the solder balls are supplied from below to apply solder to these terminal portions. A pre-d soldering device characterized in that it is configured to fuse.