JPH09312313A - Method of mounting chip with bumps - Google Patents
Method of mounting chip with bumpsInfo
- Publication number
- JPH09312313A JPH09312313A JP8129540A JP12954096A JPH09312313A JP H09312313 A JPH09312313 A JP H09312313A JP 8129540 A JP8129540 A JP 8129540A JP 12954096 A JP12954096 A JP 12954096A JP H09312313 A JPH09312313 A JP H09312313A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- paste
- mounting
- bumps
- viscosity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/118—Post-treatment of the bump connector
- H01L2224/1182—Applying permanent coating, e.g. in-situ coating
- H01L2224/11822—Applying permanent coating, e.g. in-situ coating by dipping, e.g. in a solder bath
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81009—Pre-treatment of the bump connector or the bonding area
- H01L2224/8101—Cleaning the bump connector, e.g. oxide removal step, desmearing
- H01L2224/81011—Chemical cleaning, e.g. etching, flux
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、チップの下面に形
成されたバンプに、フラックス又は接着剤などのペース
トを転写し、チップを基板に搭載するバンプ付チップの
搭載方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bump mounting chip mounting method for transferring a paste such as flux or an adhesive onto bumps formed on the lower surface of the chip to mount the chip on a substrate.
【０００２】[0002]
【従来の技術】基板にチップを接合する工法の一つとし
て、チップの下面にバンプを形成しておき、このバンプ
にペーストを転写して基板に搭載するプロセスを含むも
のがある。2. Description of the Related Art As one of the methods for joining a chip to a substrate, there is one including a process of forming a bump on the lower surface of the chip, transferring a paste to the bump, and mounting the paste on the substrate.
【０００３】このような転写を行う際、ペーストの粘度
によっては、種々の問題が発生する。まずペーストの粘
度が高すぎる場合について図４を参照しながら説明す
る。When performing such transfer, various problems occur depending on the viscosity of the paste. First, the case where the viscosity of the paste is too high will be described with reference to FIG.
【０００４】図４において、１はペースト２をためた水
平な容器、３はチップであってその下面にはバンプ４が
下向きに突設されている。５はチップ３を保持して移載
する移載ヘッドである。In FIG. 4, reference numeral 1 is a horizontal container in which the paste 2 is stored, 3 is a chip, and a bump 4 is provided downwardly on the lower surface of the chip. Reference numeral 5 denotes a transfer head that holds and transfers the chip 3.
【０００５】さてバンプ４にペースト２を転写する過程
では、まず図４（ａ）に示すように、移載ヘッド５を移
動してバンプ４を容器１内のペースト２上に位置させ
る。次に、図４（ｂ）に示すように、移載ヘッド５を下
降させ、バンプの下部をペースト２に接触させる。そし
て、図４（ｃ）に示すように、移載ヘッド５を上昇さ
せ、図４（ｃ）の破線で示すようにバンプ４を容器１の
上方へ到来させる。しかしながら、ペースト２の粘度が
高すぎると、移載ヘッド５を上昇させる際、移載ヘッド
５の保持力がペースト２の粘着力に負けて、図４（ｃ）
の実線で示すように、チップ３が移載ヘッド５から外れ
て容器１内にとどまってしまうことがある。これでは、
チップ３を移載できなくなってしまい、転写ミスとな
る。In the process of transferring the paste 2 to the bumps 4, first, as shown in FIG. 4A, the transfer head 5 is moved to position the bumps 4 on the paste 2 in the container 1. Next, as shown in FIG. 4B, the transfer head 5 is lowered to bring the lower part of the bump into contact with the paste 2. Then, as shown in FIG. 4 (c), the transfer head 5 is raised and the bumps 4 are made to reach above the container 1 as shown by the broken line in FIG. 4 (c). However, when the viscosity of the paste 2 is too high, when the transfer head 5 is raised, the holding force of the transfer head 5 loses the adhesive force of the paste 2 and the paste 2 shown in FIG.
As indicated by the solid line, the chip 3 may come off the transfer head 5 and remain in the container 1. With this,
The chip 3 cannot be transferred, resulting in a transfer error.
【０００６】次に、ペースト２の粘度が低すぎる場合の
問題を説明する。ペースト２の粘度を下げておくと、次
のようにチップ３を基板６に搭載した後に問題を生じや
すい。Next, the problem when the viscosity of the paste 2 is too low will be described. If the viscosity of the paste 2 is lowered, a problem is likely to occur after the chip 3 is mounted on the substrate 6 as follows.
【０００７】即ち、図５（ａ）に示すように、バンプ４
にペースト２を転写後、移載ヘッド５を基板６上へ移動
させ、次に移載ヘッド５を下降させて、図５（ｂ）の破
線で示すように、バンプ４が基板６の回路パターン７上
に載るように、チップ３を移載する。That is, as shown in FIG.
After transferring the paste 2 onto the substrate 6, the transfer head 5 is moved onto the substrate 6, and then the transfer head 5 is lowered to form the circuit pattern of the bump 4 on the substrate 6 as shown by the broken line in FIG. The chip 3 is transferred so as to be mounted on the chip 7.
【０００８】しかし、この後、例えば基板６を次のステ
ーションへ搬送するような場合、チップ３に慣性力（矢
印Ｎ１）が作用することがある。ここで、バンプ４は、
ペースト２の粘着力のみによって回路パターン７に保持
されており、ペースト２の粘度が低すぎると、ペースト
２の粘着力が慣性力に負けて、図５（ｂ）の実線で示す
ように、チップ３が位置ズレを生じてしまうことがあ
る。この位置ズレを生じると、次工程が円滑に行えなく
なってしまう。However, after this, for example, when the substrate 6 is conveyed to the next station, inertial force (arrow N1) may act on the chip 3. Here, the bump 4 is
The paste is held on the circuit pattern 7 only by the adhesive force of the paste 2, and when the viscosity of the paste 2 is too low, the adhesive force of the paste 2 loses inertial force, and as shown by the solid line in FIG. 3 may cause positional deviation. If this displacement occurs, the next process cannot be performed smoothly.
【０００９】[0009]
【発明が解決しようとする課題】以上説明したように、
従来のバンプ付チップの搭載方法では、転写ミスを生じ
やすいという問題点があった。As described above,
The conventional method of mounting a chip with bumps has a problem that a transfer error is likely to occur.
【００１０】そこで本発明は、転写ミス及びチップ搭載
ミスを抑制できるバンプ付チップの搭載方法を提供する
ことを目的とする。It is therefore an object of the present invention to provide a bumped chip mounting method capable of suppressing transfer errors and chip mounting errors.
【００１１】[0011]
【課題を解決するための手段】本発明のバンプ付チップ
の搭載方法は、バンプにペーストを転写する際にペース
トの粘度を相対的に下げ、チップを基板に搭載する際に
ペーストの粘度を相対的に上げるようにしたものであ
る。The method of mounting a chip with bumps according to the present invention relatively lowers the viscosity of the paste when transferring the paste to the bumps, and relatively lowers the viscosity of the paste when mounting the chip on a substrate. It was designed to be raised.
【００１２】[0012]
【発明の実施の形態】請求項１記載のバンプ付チップの
搭載方法は、少なくともバンプにペーストを転写する際
ペーストの粘度を低下させているから、チップを保持す
る保持力がペーストの粘着力に負けてチップを落下させ
るミスを抑制できる。According to the method of mounting a chip with bumps according to claim 1, since the viscosity of the paste is reduced at least when the paste is transferred to the bump, the holding force for holding the chip is the adhesive force of the paste. You can suppress the mistake of losing and dropping the chip.
【００１３】請求項２記載のバンプ付チップの搭載方法
は、チップを基板に搭載する際にペーストの粘度を増加
させているから、チップは基板に搭載された後強い粘着
力で基板に接着され、チップの位置ズレを抑制できる。In the mounting method of the bumped chip according to the second aspect, since the viscosity of the paste is increased when mounting the chip on the substrate, the chip is mounted on the substrate and then adhered to the substrate with a strong adhesive force. It is possible to suppress the positional deviation of the chip.
【００１４】次に図面を参照しながら、本発明の実施の
形態を説明する。なお図中、従来の構成を示す図４、図
５と同様の構成要素については同一符号を付すことによ
り説明を省略する。Next, an embodiment of the present invention will be described with reference to the drawings. In the figure, the same components as those in FIGS. 4 and 5 showing the conventional configuration are designated by the same reference numerals and the description thereof will be omitted.
【００１５】図１に示すように、本発明のバンプ付チッ
プの搭載方法は、図示していないチップ供給部からチッ
プ３を移載ヘッド５でピックアップするステップと、次
に移載ヘッド５を容器１へ移動させて容器１内のペース
ト２をバンプ４に転写するステップと、次にペースト２
を付けたチップ３を基板６に搭載するステップとを備え
る。As shown in FIG. 1, the method of mounting a chip with bumps according to the present invention comprises a step of picking up the chip 3 with a transfer head 5 from a chip supply section (not shown), and then the transfer head 5 in a container. 1 to transfer the paste 2 in the container 1 to the bumps 4, and then paste 2
Mounting the attached chip 3 on the substrate 6.
【００１６】（実施の形態１）本形態では、図２に示す
ように、移載ヘッド５にヒータ８を設け、このヒータ８
の設定温度を変えることで、ペースト２の粘度を変化さ
せることとしている。(Embodiment 1) In this embodiment, as shown in FIG. 2, a heater 8 is provided on the transfer head 5, and the heater 8 is provided.
The viscosity of the paste 2 is changed by changing the set temperature of.
【００１７】ここで、チップ３が移載ヘッド５に保持さ
れているとき、ヒータ８による熱は、チップ３を介して
バンプ４へ伝わり、バンプ４は所定の温度に加熱され
る。Here, when the chip 3 is held by the transfer head 5, the heat from the heater 8 is transferred to the bump 4 through the chip 3 and the bump 4 is heated to a predetermined temperature.
【００１８】さてペースト２としてフラックスを用いる
場合、フラックスは、ブチルセロソルブ，ブチルカルビ
トールなどの溶剤を含む。そして、図２（ａ）に示すよ
うに、ペースト２の転写を行う際ヒータ８の設定温度を
低くしてバンプ４の温度を、溶剤が飛ばない温度（例え
ば４０°Ｃ程度）にしておく。すると、転写時にペース
ト２中には十分な溶剤が残っているから、ペースト２の
粘度は低い状態となり、図４に示したようなチップ３の
落下による転写ミスを防止できる。When a flux is used as the paste 2, the flux contains a solvent such as butyl cellosolve and butyl carbitol. Then, as shown in FIG. 2A, when the paste 2 is transferred, the set temperature of the heater 8 is lowered and the temperature of the bump 4 is set to a temperature at which the solvent does not fly (for example, about 40 ° C.). Then, since sufficient solvent remains in the paste 2 at the time of transfer, the viscosity of the paste 2 becomes low, and the transfer error due to the drop of the chip 3 as shown in FIG. 4 can be prevented.
【００１９】そして、図２（ｂ）に示すように、搭載を
行う前に、ヒータ８の設定温度を上げバンプ４を溶剤が
飛ぶ温度（例えば、１５０°Ｃ程度）まで加熱する。す
ると、バンプ４に付着したペースト２中の溶剤の量が減
ってこのペースト２の粘度が高くなる。したがって、チ
ップ３の搭載後、チップ３は強い粘着力で基板６に接着
していることになり、位置ズレ等を防止することができ
る。Then, as shown in FIG. 2B, before mounting, the set temperature of the heater 8 is raised to heat the bump 4 to a temperature at which the solvent flies (for example, about 150 ° C.). Then, the amount of the solvent in the paste 2 attached to the bumps 4 decreases, and the viscosity of the paste 2 increases. Therefore, after mounting the chip 3, the chip 3 is adhered to the substrate 6 with a strong adhesive force, and thus it is possible to prevent the positional deviation and the like.
【００２０】（実施の形態２）本形態は、第１の実施の
形態に対して、ペースト２の加熱要領を変更している。
即ち、図３（ａ）に示すように、移載ヘッド５にヒータ
を設けるのではなく、ペースト２をためる容器１をヒー
タ９で温めている。このとき、ペースト２の温度は溶剤
が飛ばない温度（例えば４０°Ｃ程度）としておく。(Embodiment 2) In this embodiment, the heating procedure of the paste 2 is changed from that of the first embodiment.
That is, as shown in FIG. 3A, the transfer head 5 is not provided with a heater, but the container 1 for accumulating the paste 2 is heated by the heater 9. At this time, the temperature of the paste 2 is set to a temperature at which the solvent does not fly (for example, about 40 ° C.).
【００２１】また図３（ｂ）に示すように、搭載時に、
基板６を保持するステージ１０をヒータ１１で加熱し、
その結果、回路パターン７が溶剤が飛ぶ温度（例えば１
５０°Ｃ程度）にしておく。こうすれば、搭載時にバン
プ４に付着したペースト２が回路パターン７により溶剤
が飛ぶ温度まで加熱される。Further, as shown in FIG. 3 (b), when mounted,
The stage 11 holding the substrate 6 is heated by the heater 11,
As a result, the temperature at which the circuit pattern 7 flies the solvent (for example, 1
About 50 ° C). By doing so, the paste 2 attached to the bumps 4 during mounting is heated by the circuit pattern 7 to a temperature at which the solvent flies.
【００２２】第２の実施の形態における作用効果は、第
１の実施の形態と同様である。即ち、転写時にはペース
ト２中に溶剤が十分含まれており粘度が低いので、チッ
プ３の落下を防止できるし、搭載後には溶剤が飛んで増
粘したペースト２によって位置ズレを回避できる。The function and effect of the second embodiment are the same as those of the first embodiment. That is, since the paste 2 contains a sufficient amount of solvent and has a low viscosity at the time of transfer, it is possible to prevent the chip 3 from dropping, and it is possible to avoid positional deviation by the paste 2 that has been thickened by the solvent flying after mounting.
【００２３】[0023]
【発明の効果】本発明のバンプ付チップの搭載方法は、
バンプにペーストを転写する際にペーストの粘度を相対
的に下げ、チップを基板に搭載する際にペーストの粘度
を相対的に上げるようにしたので、転写時のチップの落
下と搭載後のチップの位置ズレを抑制して、一層確実に
ペーストの転写とチップの搭載を行うことができる。The mounting method of the bumped chip of the present invention is as follows.
The viscosity of the paste is relatively lowered when the paste is transferred to the bumps, and the viscosity of the paste is relatively increased when the chip is mounted on the substrate. It is possible to suppress the positional deviation and more reliably transfer the paste and mount the chip.
【図１】本発明の一実施の形態におけるバンプ付チップ
の搭載方法のフローチャートFIG. 1 is a flowchart of a method for mounting a chip with bumps according to an embodiment of the present invention.
【図２】（ａ）本発明の第１の実施の形態におけるバン
プ付チップの搭載方法の工程説明図 （ｂ）本発明の第１の実施の形態におけるバンプ付チッ
プの搭載方法の工程説明図FIG. 2A is a process explanatory view of a bumped chip mounting method according to the first embodiment of the present invention. FIG. 2B is a process explanatory diagram of a bumped chip mounting method according to the first embodiment of the present invention.
【図３】（ａ）本発明の第２の実施の形態におけるバン
プ付チップの搭載方法の工程説明図 （ｂ）本発明の第２の実施の形態におけるバンプ付チッ
プの搭載方法の工程説明図FIG. 3A is a process explanatory diagram of a bumped chip mounting method according to a second embodiment of the present invention. FIG. 3B is a process explanatory diagram of a bumped chip mounting method according to a second embodiment of the present invention.
【図４】（ａ）従来のバンプ付チップの搭載方法の工程
説明図 （ｂ）従来のバンプ付チップの搭載方法の工程説明図 （ｃ）従来のバンプ付チップの搭載方法の工程説明図4A is a process explanatory diagram of a conventional bumped chip mounting method; FIG. 4B is a process explanatory diagram of a conventional bumped chip mounting method; FIG. 4C is a process explanatory diagram of a conventional bumped chip mounting method.
【図５】（ａ）従来のバンプ付チップの搭載方法の工程
説明図 （ｂ）従来のバンプ付チップの搭載方法の工程説明図5A is a process explanatory diagram of a conventional bumped chip mounting method. FIG. 5B is a conventional process explanatory diagram of a bumped chip mounting method.
２ ペースト ３ チップ ４ バンプ ６ 基板 2 paste 3 chip 4 bump 6 substrate
Claims (6)
面に突設されたバンプにペーストを転写して、前記チッ
プを基板に搭載するバンプ付チップの搭載方法であっ
て、少なくとも前記バンプにペーストを転写する際前記
ペーストの粘度を低下させることを特徴とするバンプ付
チップの搭載方法。1. A method of mounting a chip with bumps, wherein a chip is picked up, the paste is transferred to bumps provided on the lower surface of the chip, and the chip is mounted on a substrate. A method of mounting a chip with bumps, characterized in that the viscosity of the paste is reduced during transfer.
面に突設されたバンプにペーストを転写して、前記チッ
プを基板に搭載するバンプ付チップの搭載方法であっ
て、少なくとも前記チップを基板に搭載する際に前記ペ
ーストの粘度を増加させることを特徴とするバンプ付チ
ップの搭載方法。2. A bump mounting chip mounting method for picking up a chip, transferring a paste to a bump provided on a lower surface of the chip, and mounting the chip on a substrate, wherein at least the chip is mounted on a substrate. A method for mounting a chip with bumps, wherein the viscosity of the paste is increased when mounting.
面に突設されたバンプにペーストを転写して、前記チッ
プを基板に搭載するバンプ付チップの搭載方法であっ
て、前記バンプにペーストを転写する際における前記ペ
ーストの粘度は、前記チップを基板に搭載する際におけ
る前記ペーストの粘度よりも小さいことを特徴とするバ
ンプ付チップの搭載方法。3. A method of mounting a chip with bumps, wherein a chip is picked up, the paste is transferred to bumps provided on the lower surface of the chip, and the chip is mounted on a substrate, wherein the paste is transferred to the bumps. The method of mounting a chip with bumps, wherein the viscosity of the paste at the time of performing is smaller than the viscosity of the paste at the time of mounting the chip on a substrate.
温度により、粘度が調整されることを特徴とする請求項
１から３記載のバンプ付チップの搭載方法。4. The method of mounting a chip with bumps according to claim 1, wherein the paste has a viscosity adjusted by the temperature at which the paste is heated.
に設けられたヒータにより行われることを特徴とする請
求項１から４記載のバンプ付チップの搭載方法。5. The method for mounting a chip with bumps according to claim 1, wherein the heating is performed by a heater provided in a transfer head that holds the chip.
するヒータによって行われることを特徴とする請求項１
から４記載のバンプ付チップの搭載方法。6. The heating is performed by a heater that directly or indirectly heats the substrate.
The mounting method of the bumped chip according to 4 above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12954096A JP3309709B2 (en) | 1996-05-24 | 1996-05-24 | Mounting method of chip with bump |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12954096A JP3309709B2 (en) | 1996-05-24 | 1996-05-24 | Mounting method of chip with bump |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09312313A true JPH09312313A (en) | 1997-12-02 |
| JP3309709B2 JP3309709B2 (en) | 2002-07-29 |
Family
ID=15012059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12954096A Expired - Fee Related JP3309709B2 (en) | 1996-05-24 | 1996-05-24 | Mounting method of chip with bump |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3309709B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1461823A1 (en) * | 2001-02-27 | 2004-09-29 | Chippac, Inc. | Apparatus and process for precise encapsulation of flip chip interconnects |
| JP2010098156A (en) * | 2008-10-17 | 2010-04-30 | Seiko Epson Corp | Semiconductor device, method of manufacturing semiconductor device, electronic device |
| JP2015220353A (en) * | 2014-05-19 | 2015-12-07 | 富士通株式会社 | Electronic component fitting method and solder paste transfer method, and electronic component fitting apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6000626B2 (en) | 2012-05-01 | 2016-10-05 | 新光電気工業株式会社 | Electronic device manufacturing method and electronic component mounting apparatus |
-
1996
- 1996-05-24 JP JP12954096A patent/JP3309709B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1461823A1 (en) * | 2001-02-27 | 2004-09-29 | Chippac, Inc. | Apparatus and process for precise encapsulation of flip chip interconnects |
| EP1461823A4 (en) * | 2001-02-27 | 2009-09-23 | Chippac Inc | Apparatus and process for precise encapsulation of flip chip interconnects |
| JP2010098156A (en) * | 2008-10-17 | 2010-04-30 | Seiko Epson Corp | Semiconductor device, method of manufacturing semiconductor device, electronic device |
| JP2015220353A (en) * | 2014-05-19 | 2015-12-07 | 富士通株式会社 | Electronic component fitting method and solder paste transfer method, and electronic component fitting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3309709B2 (en) | 2002-07-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0992682A (en) | Soldering method and soldering device | |
| TW201521142A (en) | System and method for positioning a semiconductor chip with a bond head, thermal bonding system and method | |
| JPH09312313A (en) | Method of mounting chip with bumps | |
| JP2003078242A (en) | Method of partially soldering printed board | |
| US7691662B2 (en) | Optical module producing method and apparatus | |
| JP3266414B2 (en) | Solder supply method | |
| JP2006032446A (en) | Mounting method for semiconductor component, and mounting device | |
| JPH0621636A (en) | Soldering of electronic circuit part to board | |
| JP3063390B2 (en) | Soldering equipment for terminals | |
| JPH08340174A (en) | Forming method of solder electrode | |
| JPH08130363A (en) | Bond used for preliminarily fastening electronic part and soldering method of electronic part | |
| JP2001358454A (en) | Soldering method and device | |
| US7824111B2 (en) | Optical module | |
| JP2001068847A (en) | Method and device for mounting electronic component | |
| JP3010821B2 (en) | Chip mounting method | |
| JPH05259631A (en) | Surface mounting of printed wiring board | |
| JP2001168510A (en) | Method of mounting electronic parts | |
| JP3166752B2 (en) | Bare chip mounting system | |
| JP2019096709A (en) | Manufacturing method of component mounting board | |
| JPH11214569A (en) | Method and device for forming bump | |
| JPH04356353A (en) | Vapor reflow device | |
| JP2001085834A (en) | Reflow soldering method and component-mounting system using the same | |
| JPH01227491A (en) | Method of packaging electronic components | |
| JPH05283452A (en) | Manufacture of semiconductor device | |
| JP2002026510A (en) | Device and method for mounting electronic parts |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090524 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100524 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110524 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110524 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120524 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120524 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130524 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130524 Year of fee payment: 11 |
|
| LAPS | Cancellation because of no payment of annual fees |