JPS60240764A - Electrically conductive composition - Google Patents

Electrically conductive composition

Info

Publication number
JPS60240764A
JPS60240764A JP9571484A JP9571484A JPS60240764A JP S60240764 A JPS60240764 A JP S60240764A JP 9571484 A JP9571484 A JP 9571484A JP 9571484 A JP9571484 A JP 9571484A JP S60240764 A JPS60240764 A JP S60240764A
Authority
JP
Japan
Prior art keywords
electrically conductive
compsn
electrical
chemical reaction
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9571484A
Other languages
Japanese (ja)
Inventor
Ryoichi Sado
佐渡 良一
Shiro Tanami
史郎 田波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SAN AROO KK
Sunarrow Co Ltd
Original Assignee
SAN AROO KK
Sunarrow Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SAN AROO KK, Sunarrow Co Ltd filed Critical SAN AROO KK
Priority to JP9571484A priority Critical patent/JPS60240764A/en
Publication of JPS60240764A publication Critical patent/JPS60240764A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE:To provide an electrically conductive compsn. which can secure electrical insulation and electrical conductivity with high reliability when terminals are bonded to each other through the compsn. under pressure, by incorporating an electrically conductive powder formed by a chemical reaction in an electrical insulating high-molecular adhesive material. CONSTITUTION:An electrically conductive compsn. consists of 100pts.vol. electrical insulating adhesive high-molecular material (A) (e.g. an adhesive composed of polyester, polyolefin, natural rubber or silicone rubber) and 0.001-10pts.vol. electrically conductive powder (B) formed by a chemical reaction (e.g. carbon black obtd. by combustion of oil, electrolytically reduced metal, TiO2 or SiC). Electronic circuit devices can be miniaturized and it is possible that a high-density terminal, particularly a connection of multi-electrode terminal arrangement (conductor width: 50mu, gap: 50mu, 100mu pitch) is lumped together, and electrical conductivity between opposing electrodes is 1OMEGA or below and electrical insulation resistance between adjoining terminals is 10''OMEGA at 250V. Hence, the compsn. is suitable for use in mounting devices for pattern processing or picture processing and multi-electrode IC can be connected in a lump.

Description

【発明の詳細な説明】 本発明は導電性組成物に関し、特にこのS電性組成物が
該組成物中の粉粒体粒径近傍の厚さのフィルムないし膜
に形成した時に、その厚み方向にのみ1Ω以下の導電性
となり、沿面方向に対しては電気絶縁性となり、例えば
50μ離れると250VでづQ11Ω以上となる如く異
方性導通構造を有するものに関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a conductive composition, and in particular, when this S conductive composition is formed into a film or film having a thickness close to the particle size of the powder or granules in the composition, It has an anisotropic conductive structure such that it has an electrical conductivity of 1Ω or less only at a distance of 1Ω or less, and is electrically insulative in the creeping direction, for example, at a distance of 50 μm, Q11Ω or more at 250V.

従来、機械的粉砕、油砕、水砕またはIIN霧法により
得た粉粒体を使用したもの、あるいはカーボンm紺を切
断して粉体状としたものを接着性能を有する電気絶縁性
高分子物質に配合してなる導電性組成物は、上下の導通
端子間に加圧接着によってフィルムないし膜状に形成さ
れて導通を得るものであるが、このものは温痩、湿度等
環境試験での耐久信頼性が極めて低く使用に耐え難いも
のであった。
Conventionally, electrically insulating polymers with adhesion properties are produced using powders obtained by mechanical pulverization, oil pulverization, water pulverization, or IIN atomization methods, or those obtained by cutting carbon m-dark blue into powder form. The conductive composition blended with the substance is formed into a film or membrane shape by pressure adhesion between the upper and lower conductive terminals to obtain conductivity, but this material does not pass environmental tests such as temperature and humidity. The durability and reliability were extremely low and it was difficult to withstand use.

本発明者らは上記の点に鑑み鋭意検討した結果、接着性
能を有する絶縁性高分子物質100容量部と化学的反応
により生成される導電性粉粒体o、ooi〜10容量部
とからなる導電性組成物を得て、これを上記導通端子間
に加圧接着させることによって導通と電気絶縁性を確保
することが最も信頼性の高いものであることを知得した
ものである。
The inventors of the present invention made extensive studies in view of the above points, and found that the composition consists of 100 parts by volume of an insulating polymeric material having adhesive properties and ~10 parts by volume of conductive powder or granules produced by chemical reaction. It has been learned that the most reliable method is to obtain a conductive composition and adhere it under pressure between the conductive terminals to ensure continuity and electrical insulation.

以下、本発明の構成について詳述する。Hereinafter, the configuration of the present invention will be explained in detail.

接着性能を有する電気絶縁性高分子物質は、常態で液状
、粘稠状、固体状である従来公知の次のような接着剤が
使用される。即ち、感圧接着剤。
As the electrically insulating polymer substance having adhesive properties, the following conventionally known adhesives which are normally liquid, viscous, or solid are used. Namely, pressure sensitive adhesives.

ホットメルト接着剤、他の溶剤で液状、粘稠状とされた
接着剤、紫外線や放射線照射によって硬化接着能を有す
る接着剤、熱硬化性樹脂からなる接着剤9反応硬化型接
着剤であって公知の電気絶縁性合成樹脂、天然樹脂組成
物、電気絶縁性の天然ゴム、合成ゴム組成物で接着性能
を有するものが含まれる。そして成分的にはポリエステ
ル、ポリエーテル、ポリアミド、ポリオレフィン、ポリ
ハロゲン化ビニル、アクリロニトリル−ブタジェン−ス
チレン樹脂、アクリロニトリル−スチレン樹脂、ポリウ
レタン、ポリスチレン、ポリアクリル酸エステル等の単
成分、共重合成分、或は混合成分からなる接着剤、天然
ゴム、クロロプレン、ニトリルゴム、アクリルゴム、ス
ルフォン酸ゴム。
Hot-melt adhesives, adhesives made liquid or viscous with other solvents, adhesives that have adhesive properties that harden when irradiated with ultraviolet rays or radiation, adhesives made of thermosetting resins, and reaction-curing adhesives. Known electrically insulating synthetic resins, natural resin compositions, electrically insulating natural rubbers, and synthetic rubber compositions that have adhesive properties are included. Components include single components such as polyester, polyether, polyamide, polyolefin, polyvinyl halide, acrylonitrile-butadiene-styrene resin, acrylonitrile-styrene resin, polyurethane, polystyrene, polyacrylic acid ester, copolymer components, Adhesives consisting of mixed components, natural rubber, chloroprene, nitrile rubber, acrylic rubber, sulfonic acid rubber.

ウレタンゴム、シリコンゴム等の単成分、共重合成分、
混合成分からなる接着剤、その他エポキシ樹脂、ポリシ
アヌレート樹脂2石炭酸樹脂、ジアリルフタレート樹脂
、フタル酸エステル樹脂等の単成分、共重合成分、混合
成分からなる接着剤等が含まれる。
Single components such as urethane rubber and silicone rubber, copolymer components,
Adhesives made of mixed components, and adhesives made of single components, copolymerized components, and mixed components such as epoxy resins, polycyanurate resins, dicarboxylic acid resins, diallyl phthalate resins, and phthalate ester resins are included.

一方、化学的反応により生成される導電性粉粒体とは、
オイルを燃焼・半燃焼して分解反応で得1 られるカー
ボンブラック、該カーボンブラックをさらに高温で焼成
しグラファイト化したカーボンブラック、アセチレンよ
り脱水素して得られるアセチレンブラック、環元金属粉
例えばカルボニル化合物から得られたカルボニルニッケ
ル、白金ブラック、電解環元金属、銅、銀、ニッケル、
鉄その他金属化合物例えば酸化錫、酸化インジウム。
On the other hand, conductive powder produced by chemical reaction is
Carbon black obtained by decomposition reaction by burning or semi-combusting oil, carbon black obtained by firing the carbon black at a higher temperature and turning it into graphite, acetylene black obtained by dehydrogenating acetylene, ring element metal powder, e.g. carbonyl compound carbonyl nickel, platinum black, electrolytic ring metals, copper, silver, nickel,
Iron and other metal compounds such as tin oxide and indium oxide.

窒化チタン、炭化ケイ素等をいう。本発明において化学
的反応により生成される粉粒体を使用することとしたの
は、従来の機械的粉砕により得られる粉粒体が一般にポ
アソン分布に近い状態で、その分布の巾が大きいのに比
べ、化学的反応により生成される粉粒体はその粒子形状
が安定しており、その分布の巾も小さく数μ和以上ない
し1μ像以下のものが得られ、かつ粒子の小さいものが
得易いためである。特にアセチレンブラックやグラファ
イト化したカーボンブラックは数10mμ以下でハイバ
ルキー性と柔軟弾力性を有し、加圧接着に対し極めて具
合がよい。カルボニルニッケル粒子数μm以下のものは
、粒子径に対するその表面あらさが直径方向では柔軟弾
力性に富み、極めて具合がよい。要するに粒径が小さく
なると、小さい応力で弾性変形する割合が大ぎくなるこ
とを意味する。従って上記粉粒体の粒径は小さい方がよ
く、好ましくは30μm以下であることが望ましく、よ
り好ましくは10μm以下で、更に好ましくは5μ頼以
下がよく、この粒子径の如何が配合割合にも影曽してく
る。粒子径が大きくなると、粒径分布の巾が大きくなり
、フィルムや膜の厚みもそれだけ大きくなり、熱や渇痕
の影響を受けて厚み方向の寸法の動きを大きくすること
となり、また膜やフィルムの厚みに達しない、すなわち
導通に関与しない粒子が多く存在することは、隣接導通
路間の電気客足を大きくするだけである。このように、
配合割合は粒子径によっても異なるが、本発明ではその
配合比を接着性能を有する電気絶縁性高分子物質100
容四部に対し、化学的反応により生成された導電性粉粒
体0.001〜10容量部とする。
Refers to titanium nitride, silicon carbide, etc. The reason for using powder and granules produced by chemical reactions in the present invention is that powders and granules obtained by conventional mechanical grinding generally have a Poisson distribution, and the width of the distribution is large. In comparison, powders and granules produced by chemical reactions have stable particle shapes, have a small distribution width, and can be obtained from a sum of several microns or more to less than 1 micron, and are easy to obtain with small particles. It's for a reason. In particular, acetylene black and graphitized carbon black have a size of several tens of microns or less and have high bulkiness and flexibility, and are extremely suitable for pressure bonding. Carbonyl nickel particles having a diameter of several micrometers or less are very suitable because their surface roughness is flexible and elastic in the diameter direction relative to the particle diameter. In other words, the smaller the particle size, the greater the rate of elastic deformation caused by small stress. Therefore, it is better for the particle size of the above-mentioned powder to be small, preferably 30 μm or less, more preferably 10 μm or less, even more preferably 5 μm or less, and the particle size depends on the blending ratio. It's a shadow. As the particle size becomes larger, the width of the particle size distribution becomes larger, and the thickness of the film or membrane increases accordingly, which increases the dimensional movement in the thickness direction due to the influence of heat or drought marks. The presence of many particles that do not reach the thickness of , that is, do not participate in conduction, only increases the electrical traffic between adjacent conductive paths. in this way,
The blending ratio varies depending on the particle size, but in the present invention, the blending ratio is 100% of the electrically insulating polymer material with adhesive performance.
The amount of conductive powder produced by chemical reaction is 0.001 to 10 parts by volume per 4 parts of the volume.

化学的反応により生成された導電性粉粒体が0.001
容量部より少なくなると導通密疫が小さくなり、小さい
導体端子の高密度配列での使用が不可能となる。
Conductive powder produced by chemical reaction is 0.001
If it is smaller than the capacitance portion, the conduction density becomes small, making it impossible to use small conductor terminals in a high-density arrangement.

また10容惧部を超えると、隣接導体端子間を小さくと
れなくなるという欠点を有し、隣接導通路との電気的絶
縁性の維持が困難となる。
Moreover, if the diameter exceeds 10, there is a drawback that the distance between adjacent conductor terminals cannot be made small, and it becomes difficult to maintain electrical insulation from adjacent conductive paths.

従って化学的反応により生成された導電性粉粒体は0.
002〜5容量部の範囲が実用上好ましく、より好まし
くは0.005〜3容量部である。
Therefore, the conductive powder produced by chemical reaction is 0.
Practically preferred range is 0.002 to 5 parts by volume, more preferably 0.005 to 3 parts by volume.

従来の導体粉末の中で、カーボン繊維を切断した粉体は
、繊維の太さや長さの分布の巾は小さいが、繊維径に対
する長さが大ぎくなり、長さ方向に圧力が分散すること
によって、接着による均等な接触が困難となり、導体粉
粒分布の巾が大きく、かつ粒子径の大きい粉粒体での効
果と同様の結果となり、信頼性に乏しい。
Among conventional conductor powders, powder obtained by cutting carbon fibers has a small distribution of fiber thickness and length, but the length relative to the fiber diameter is large, causing pressure to be dispersed in the length direction. This makes it difficult to make uniform contact by adhesion, resulting in results similar to those obtained with powder particles having a large conductor particle distribution width and large particle size, resulting in poor reliability.

尚、本発明の組成物は、溶剤等によって使用し易い粘度
に調製することもできるがその際、分散剤、安定剤、増
粘剤、防錆剤等を必要に応じて添加してもよい。
In addition, the composition of the present invention can be adjusted to a viscosity that is easy to use by using a solvent, etc., and in this case, a dispersant, a stabilizer, a thickener, a rust preventive, etc. may be added as necessary. .

以上の説明から判るように、本発明の導電性組成物は電
子回路装置の小型化のための高密度端子配列、特に導体
中50μm1間隙50μ鋤で100μmピッチの多極端
子配列の接続を一括処理することが可能となり、対向導
体間は10以下の導電性となり、隣接端子間は250v
で1011Ω以上の電気絶縁性となるので、図形処理や
映像処身用の実装に具合よく、また多極ICを一括接続
することも可能となり、各種デス・プレーの端子処理或
は高密度の電気・電子回路のための設計、企画に極めて
有用である。これらの接続は回路端子間に加圧して必要
により加熱して或は紫外線照射等してフィルム状、膜状
に固定されるが、本発明に係る組成物は従来公知のフィ
ルムコネクター、エラスチックコネクターの表面に塗布
しても使用できる。又従来公知のビンコネクターや圧接
タイプの端子表面に塗布してセット後、固着する等して
使用づ−ると、従来コネクターの信頼性を大いに向上さ
せることができる。さらに本発明に係る組成物は、スク
リーン印刷、捺染、D−ルコート等の手段で必要箇所に
塗布するか離型紙の表面に塗布し、これを裁断して使用
するようにしてもよい。
As can be seen from the above description, the conductive composition of the present invention can be used to collectively connect high-density terminal arrays for downsizing electronic circuit devices, particularly multi-pole terminal arrays with a pitch of 100 μm and a spacing of 50 μm in the conductor. The conductivity between opposing conductors is 10 or less, and the conductivity between adjacent terminals is 250V.
Since it has an electrical insulation property of 1011Ω or more, it is suitable for mounting for graphic processing and image processing, and it is also possible to connect multi-pole ICs at once, making it suitable for terminal processing of various displays and high-density electrical - Extremely useful for designing and planning electronic circuits. These connections are fixed in the form of a film or membrane by applying pressure between circuit terminals and heating if necessary, or by irradiating ultraviolet rays. It can also be used by applying it to the surface. Furthermore, if it is used by applying it to the surface of a conventionally known pin connector or pressure contact type terminal, setting it, and then fixing it, the reliability of the conventional connector can be greatly improved. Furthermore, the composition according to the present invention may be applied to necessary locations by means such as screen printing, textile printing, D-lecoating, or the like, or may be applied to the surface of a release paper, and then cut and used.

特約出願人 ザンアロー株式会社Special Applicant: Zan Arrow Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] 接着性能を有する電気絶縁性高分子物質100容量部と
化学的反応により生成された導電性粉粒体0001〜1
0容旧部とからなる導電性組成物。
Conductive powder 0001-1 produced by chemical reaction with 100 parts by volume of an electrically insulating polymeric substance having adhesive properties
A conductive composition consisting of 0 volume old part.
JP9571484A 1984-05-15 1984-05-15 Electrically conductive composition Pending JPS60240764A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9571484A JPS60240764A (en) 1984-05-15 1984-05-15 Electrically conductive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9571484A JPS60240764A (en) 1984-05-15 1984-05-15 Electrically conductive composition

Publications (1)

Publication Number Publication Date
JPS60240764A true JPS60240764A (en) 1985-11-29

Family

ID=14145152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9571484A Pending JPS60240764A (en) 1984-05-15 1984-05-15 Electrically conductive composition

Country Status (1)

Country Link
JP (1) JPS60240764A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5750706A (en) * 1980-09-11 1982-03-25 Mitsubishi Metal Corp Conductive coating powder

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5750706A (en) * 1980-09-11 1982-03-25 Mitsubishi Metal Corp Conductive coating powder

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