JPS60239049A - 熱伝導冷却モジユ−ル装置 - Google Patents

熱伝導冷却モジユ−ル装置

Info

Publication number
JPS60239049A
JPS60239049A JP9286884A JP9286884A JPS60239049A JP S60239049 A JPS60239049 A JP S60239049A JP 9286884 A JP9286884 A JP 9286884A JP 9286884 A JP9286884 A JP 9286884A JP S60239049 A JPS60239049 A JP S60239049A
Authority
JP
Japan
Prior art keywords
heat
housing
relay member
cooling module
heat conduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9286884A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0439782B2 (enrdf_load_stackoverflow
Inventor
Yasutoshi Kurihara
保敏 栗原
Tasao Soga
太佐男 曽我
Komei Yatsuno
八野　耕明
Kenji Miyata
健治 宮田
Masahiro Okamura
岡村　昌弘
Fumiyuki Kobayashi
小林　二三幸
Takahiro Oguro
崇弘 大黒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9286884A priority Critical patent/JPS60239049A/ja
Publication of JPS60239049A publication Critical patent/JPS60239049A/ja
Publication of JPH0439782B2 publication Critical patent/JPH0439782B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP9286884A 1984-05-11 1984-05-11 熱伝導冷却モジユ−ル装置 Granted JPS60239049A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9286884A JPS60239049A (ja) 1984-05-11 1984-05-11 熱伝導冷却モジユ−ル装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9286884A JPS60239049A (ja) 1984-05-11 1984-05-11 熱伝導冷却モジユ−ル装置

Publications (2)

Publication Number Publication Date
JPS60239049A true JPS60239049A (ja) 1985-11-27
JPH0439782B2 JPH0439782B2 (enrdf_load_stackoverflow) 1992-06-30

Family

ID=14066405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9286884A Granted JPS60239049A (ja) 1984-05-11 1984-05-11 熱伝導冷却モジユ−ル装置

Country Status (1)

Country Link
JP (1) JPS60239049A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63266857A (ja) * 1987-04-24 1988-11-02 Hitachi Ltd 電子部品
CN106057771A (zh) * 2015-04-06 2016-10-26 爱思开海力士有限公司 具有插座插头互连结构的半导体封装

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63266857A (ja) * 1987-04-24 1988-11-02 Hitachi Ltd 電子部品
CN106057771A (zh) * 2015-04-06 2016-10-26 爱思开海力士有限公司 具有插座插头互连结构的半导体封装
CN106057771B (zh) * 2015-04-06 2020-03-03 爱思开海力士有限公司 具有插座插头互连结构的半导体封装

Also Published As

Publication number Publication date
JPH0439782B2 (enrdf_load_stackoverflow) 1992-06-30

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