JPS60237283A - Plasma treatment device - Google Patents
Plasma treatment deviceInfo
- Publication number
- JPS60237283A JPS60237283A JP9091984A JP9091984A JPS60237283A JP S60237283 A JPS60237283 A JP S60237283A JP 9091984 A JP9091984 A JP 9091984A JP 9091984 A JP9091984 A JP 9091984A JP S60237283 A JPS60237283 A JP S60237283A
- Authority
- JP
- Japan
- Prior art keywords
- solid particles
- trap
- purge gas
- stop valve
- reduced pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
- F04B37/06—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for evacuating by thermal means
- F04B37/08—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for evacuating by thermal means by condensing or freezing, e.g. cryogenic pumps
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利−用分野〕
本発明は、プラズマ処理装置に係り、特に冷却トラップ
を有する減圧排気系が設けられたプラズマ処理装置に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a plasma processing apparatus, and more particularly to a plasma processing apparatus equipped with a reduced pressure exhaust system having a cooling trap.
冷却トラップを有する減圧排気系が設けられたプラズマ
処理装置としては、例えば、特開昭56−77381号
公報に示されるように、プラズマを利用し減圧下で試料
をエツチング処理する処理室に冷却トラップを有する排
気系が設けられたものが知られている。As a plasma processing apparatus equipped with a reduced pressure exhaust system having a cooling trap, for example, as shown in JP-A-56-77381, a cooling trap is installed in a processing chamber that etches a sample under reduced pressure using plasma. It is known that the exhaust system is equipped with an exhaust system having the following characteristics.
この装置では、冷却トラップをヒーターにより加熱する
とともにパージガスとして加圧空気を冷却トラップ内に
吹き込み冷却トラップ外へ排出することで冷却トラップ
は再生されるが、しかし、冷却トラップ外へ排出される
パージガスに固形粒子が同伴される場合、このパージガ
スが通過する閉止弁のシール機能が固形粒子により阻害
されるという問題がある。In this device, the cooling trap is regenerated by heating the cooling trap with a heater and blowing pressurized air into the cooling trap as purge gas and discharging it outside the cooling trap. When solid particles are entrained, there is a problem that the sealing function of the shutoff valve through which the purge gas passes is obstructed by the solid particles.
本発明の目的は、冷却トラップ外へ排出されるパージガ
スに同伴される固形粒子を、このパージガスが通過する
閉止弁の前流側で捕集除去することで、該閉止弁のシー
ル機能を長期に亘り良好に維持できるプラズマ処理装置
を提供することにある。An object of the present invention is to collect and remove solid particles accompanying the purge gas discharged outside the cooling trap on the upstream side of the shut-off valve through which the purge gas passes, thereby prolonging the sealing function of the shut-off valve. An object of the present invention is to provide a plasma processing apparatus that can be maintained satisfactorily over a long period of time.
本発明は、プラズマを利用し減圧下で試料を処理する処
理室に設けられた減圧排気系のトラップと、該トラップ
に連結されたパージガス排出ラインに設けられた閉止弁
との間に固形粒子捕集器を設けたことを特徴とするもの
で、冷却トラップ外へ排出されるパージガスに同伴され
る固形粒子を、このパージガスが通過する閉止弁の前流
側で捕集除去しようとしたものである。The present invention provides solid particle capture between a trap of a vacuum exhaust system installed in a processing chamber that processes samples under reduced pressure using plasma and a shutoff valve installed in a purge gas exhaust line connected to the trap. This device is characterized by the installation of a collector, and attempts to collect and remove solid particles accompanying the purge gas discharged outside the cooling trap on the upstream side of the shutoff valve through which the purge gas passes. .
本発明の一実施例を第1図、第2図により説明する。 An embodiment of the present invention will be described with reference to FIGS. 1 and 2.
第1図で、プラズマを利用し減圧下で試料を処理する処
理室10には、減圧排気系加が設けられている。減圧排
気系加は、圧力調節弁21と、減圧排気装置、例えば、
油回転真空ポンプnと減圧排気ライン囚とで構成され、
冷却トラップ、例えば、液体窒素トラップ(以下、LN
、トラップと略)30を有している。処理室10の処理
ガス排出口と油回転真空ポンプnの吸入口とは、減圧排
気ライン幻で連結され、減圧排気ラインnには、圧力調
節弁4が設けられている。圧力調節弁乙の後流側の減圧
排気ライン乙には、LN2トラップ(資)が設けられ、
圧力調節弁4とLN2)ラップ(資)並びにLN、トラ
ップ(資)と油回転真空ポンプnとの間の減圧排気ライ
ン乙には、閉止弁列、25がそれぞれ設けられている。In FIG. 1, a processing chamber 10 in which a sample is processed under reduced pressure using plasma is provided with a reduced pressure exhaust system. The reduced pressure exhaust system is supplied with a pressure regulating valve 21 and a reduced pressure exhaust device, for example.
Consists of an oil rotary vacuum pump and a decompression exhaust line,
A cold trap, for example, a liquid nitrogen trap (hereinafter referred to as LN)
, trap) 30. The processing gas outlet of the processing chamber 10 and the suction port of the oil rotary vacuum pump n are connected by a reduced pressure exhaust line, and the reduced pressure exhaust line n is provided with a pressure regulating valve 4. An LN2 trap (capital) is installed in the decompression exhaust line B on the downstream side of the pressure regulating valve B.
A closing valve array 25 is provided in the decompression exhaust line B between the pressure regulating valve 4 and LN2) lap (equipment) and LN, trap (equipment) and the oil rotary vacuum pump n.
LN、トラップ別は、内槽31と、内槽31と気密に空
間nを形成する外槽おとで構成されている。The LN and trap are each composed of an inner tank 31 and an outer tank that airtightly forms a space n with the inner tank 31.
内槽31には、電源(図示省略)に接続されたヒーター
Uが設けられ、LN、供給源(図示省略)に連結され閉
止弁あが設けられたLN2供給ライン蕊が連結されてい
る。外槽おには、パージガス供給源(図示省略)に連結
され閉止弁37が設けられたパージガス供給ライン蕊が
空間部と連通して連結され、パージガス排出ライン9が
空間部と連通して連結されている。パージガス排気ライ
ン田には、閉止弁旬が設けられると共に、閉止弁旬の前
流側で固形流子捕集器、例えば、目詰りを生ぜず流路コ
ンダクタンスの経時変化がほとんど生じない固形粒子捕
集器、例えば、サイクロン父が設けられている。なお、
パージガス排出ライン(は、例えば、排ガス処理装置I
(以下、スクラバーと略)60に連結されている。The inner tank 31 is provided with a heater U connected to a power source (not shown), and connected to an LN2 supply line connected to an LN supply source (not shown) and provided with a shutoff valve. In the outer tank, a purge gas supply line 9 connected to a purge gas supply source (not shown) and provided with a shutoff valve 37 is connected in communication with the space, and a purge gas discharge line 9 is connected in communication with the space. ing. A shutoff valve is installed in the purge gas exhaust line, and a solid particle collector, for example, a solid particle collector that does not cause clogging and causes almost no change in flow path conductance over time, is installed on the upstream side of the shutoff valve. A collector, for example a cyclone father, is provided. In addition,
Purge gas discharge line (for example, exhaust gas treatment equipment I
(hereinafter abbreviated as scrubber) 60.
電源はOFF、閉止弁胛、40は閉、閉止弁あは開され
、内槽31にはLN、が供給され、これにより内槽31
はLN、温度に冷却される。一方、圧力調節弁ガ、閉止
弁ス、25を開し、油回転真空ポンプ4を作動させるこ
とで処理室10内は所定圧力に減圧排気される。その後
、処理室lOには、゛処理ガス供給装W(図示省略)よ
り処理ガスが所定流量で供給されるとともに、圧力調節
弁乙により処理室10内は所定の処理圧力に調節されて
維持される。この状態で処理ガスはグロー放電によりプ
ラズマ化され、このプラズマを利用して処理室10内の
試料(図示省略)はエツチング処理、成膜処理等所定処
理される。この処理期間中、処理室lOで生成した固形
粒子を同伴し処理室10から減圧排気ライン幻へ排出さ
れた処理ガスは、LN21−ラップ加の空間部に供給さ
れる。処理ガスの内、凝縮ガスは内槽31に凝縮吸着さ
れ処理ガスに同伴された固形粒子も内槽31に吸着され
る。また、残りの非凝縮ガスはLN、 トラップ(資)
を出た後に油回転真空ポンプ乙により排気される。凝縮
ガスと固形粒子の吸着によりLN、 )ラップ(資)の
吸着能力が低下した時点で、閉止弁24.25.35は
閉、油回転真空ポンプnの作動は停止−される。その後
、閉止弁を開しパー八
ジガス供給源からパージガス、例えば、窒素ガス(以下
、GN、と略)をLN2トラップ菊の空間部に供給し、
これにより空間32が大気圧になった時点で閉止弁旬を
開(。この状態で、電源なONL、ヒーターUを発熱さ
せることで内槽31は加温され、内槽31に吸着した凝
縮ガスと固形粒子とは、内槽31より空間部に遊離する
。第2図で、この遊離した凝縮性ガスと固形粒子とはG
N、と共にパージガス排出ライン39&経てサイクロン
団の直胴部51に対して接線方向に導入され、直胴部5
1内で旋回運動を与えられる。この際、固形粒子は直胴
部51の内壁に沿って落下し、凝縮ガスを含むON、は
直胴部51中央部から上昇流となりパージガス排出ライ
ンおに導入された後に閉止弁荀を介してスクラバωに供
給され、ここで処理される。一方、落下した固形粒子は
、固形物受具52にストックされる。The power is turned off, the shutoff valve 40 is closed, the shutoff valve is opened, and LN is supplied to the inner tank 31.
is cooled to LN, temperature. On the other hand, by opening the pressure control valve 25 and operating the oil rotary vacuum pump 4, the inside of the processing chamber 10 is evacuated to a predetermined pressure. Thereafter, processing gas is supplied to the processing chamber 10 at a predetermined flow rate from the processing gas supply device W (not shown), and the pressure inside the processing chamber 10 is regulated and maintained at a predetermined processing pressure by the pressure regulating valve B. Ru. In this state, the processing gas is turned into plasma by glow discharge, and using this plasma, the sample (not shown) in the processing chamber 10 is subjected to predetermined processing such as etching processing and film forming processing. During this processing period, the processing gas, which is discharged from the processing chamber 10 to the vacuum exhaust line along with the solid particles generated in the processing chamber 10, is supplied to the LN 21-wrap space. Among the processing gases, condensed gas is condensed and adsorbed in the inner tank 31 , and solid particles entrained in the processing gas are also adsorbed in the inner tank 31 . In addition, the remaining non-condensable gas is LN, trap (capital)
After exiting, it is evacuated by oil rotary vacuum pump B. When the adsorption capacity of the LN wrap (capital) decreases due to the adsorption of condensed gas and solid particles, the shutoff valves 24, 25, and 35 are closed, and the operation of the oil rotary vacuum pump n is stopped. After that, open the shutoff valve and supply purge gas, for example, nitrogen gas (hereinafter abbreviated as GN) from the par-8 gas supply source to the space of the LN2 trap chrysanthemum,
As a result, when the pressure in the space 32 reaches atmospheric pressure, the shutoff valve is opened. and solid particles are liberated from the inner tank 31 into the space.In Fig. 2, the liberated condensable gas and solid particles are
N is introduced along with the purge gas discharge line 39 in a tangential direction to the straight body part 51 of the cyclone group, and the straight body part 5
A turning motion is given within 1. At this time, the solid particles fall along the inner wall of the straight body part 51, and the ON gas containing condensed gas flows upward from the center of the straight body part 51 and is introduced into the purge gas discharge line through the shutoff valve. It is supplied to the scrubber ω and processed there. On the other hand, the fallen solid particles are stocked in the solid object receiver 52.
なお、固形物受具52に固形粒子70が所定量ストック
された時点で、固形物受具52は取外されて清掃される
。Note that, when a predetermined amount of solid particles 70 are stocked in the solid object receiver 52, the solid object receiver 52 is removed and cleaned.
本実施例のようなプラズマ処理装置では、LN2トラッ
プ外へ排出されるOH2に同伴される固形粒子を、パー
ジガス排出ラインに設けた閉止弁の前流側でサイクロン
により捕集除去できるので、該閉止弁のシール機能が固
形粒子により阻害されることがなく、該閉止弁のシール
機能を長期に亘り良好に維持することができる。In the plasma processing apparatus of this embodiment, the solid particles accompanying the OH2 discharged outside the LN2 trap can be collected and removed by the cyclone on the upstream side of the shutoff valve provided in the purge gas discharge line. The sealing function of the valve is not inhibited by solid particles, and the sealing function of the shutoff valve can be maintained satisfactorily over a long period of time.
本発明は、以上説明したように、プラズマを利用して減
圧下で試料を処理する処理室に設けられた減圧排気系の
冷却トラップと、該トラップに連結されたパージガス排
出ラインに設けられた閉止弁との間に固形粒子捕果器を
設けたことで、冷却トラップ外へ排出されるパージガス
に同伴される固形粒子を、パージガス排出ラインに設け
られた閉止弁の前流側で捕集除去できるので、該閉止弁
のシール機能が固形粒子により阻害されることがなく、
該閉止弁のシール機能を長期に亘り良好に維持できると
いう効果がある。As explained above, the present invention provides a cooling trap of a vacuum exhaust system provided in a processing chamber that processes a sample under reduced pressure using plasma, and a shutoff trap provided in a purge gas exhaust line connected to the trap. By installing a solid particle trap between the cooling trap and the valve, solid particles accompanying the purge gas discharged outside the cooling trap can be collected and removed on the upstream side of the shutoff valve installed in the purge gas discharge line. Therefore, the sealing function of the shutoff valve is not inhibited by solid particles.
This has the effect that the sealing function of the shutoff valve can be maintained well over a long period of time.
第1図は、本発明によるプラズマ処理装置の一実施例を
示す排気系の系統図、第2図は、第1図のサイクロンの
縦断面図である。
10・・・・・・処理室、加・・・・・・排気系、菊・
・・・・・LN、l−ラップ、(・・・・・・パージガ
ス排出ライン、旬・・・・・・閉止弁、関・・・・・・
サイクロン
代理人 弁理士 高 橋 明 失
業1図
3I=2■FIG. 1 is a system diagram of an exhaust system showing an embodiment of a plasma processing apparatus according to the present invention, and FIG. 2 is a longitudinal sectional view of the cyclone shown in FIG. 1. 10...Processing chamber, heating...exhaust system, chrysanthemum...
...LN, l-lap, (...Purge gas discharge line, Shutoff valve, Seki...
Cyclone agent Patent attorney Akira Takahashi Unemployment 1 Figure 3I=2■
Claims (1)
に、冷却トラップを有する減圧排気系が設けられた装置
において、前記冷却トラップと。 該トラップに連結されたパージガス排出ラインに設けら
れた閉止弁との間に固形粒子捕集器を設けたことを特徴
とするプラズマ処理装置。[Scope of Claims] 1. In an apparatus in which a processing chamber for processing a sample under reduced pressure using plasma is provided with a reduced pressure exhaust system having a cooling trap, the cooling trap. A plasma processing apparatus characterized in that a solid particle collector is provided between a shutoff valve provided in a purge gas discharge line connected to the trap.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9091984A JPS60237283A (en) | 1984-05-09 | 1984-05-09 | Plasma treatment device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9091984A JPS60237283A (en) | 1984-05-09 | 1984-05-09 | Plasma treatment device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60237283A true JPS60237283A (en) | 1985-11-26 |
Family
ID=14011830
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9091984A Pending JPS60237283A (en) | 1984-05-09 | 1984-05-09 | Plasma treatment device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60237283A (en) |
-
1984
- 1984-05-09 JP JP9091984A patent/JPS60237283A/en active Pending
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