JPS60236728A - Manufacture of electric laminate plate - Google Patents

Manufacture of electric laminate plate

Info

Publication number
JPS60236728A
JPS60236728A JP59093376A JP9337684A JPS60236728A JP S60236728 A JPS60236728 A JP S60236728A JP 59093376 A JP59093376 A JP 59093376A JP 9337684 A JP9337684 A JP 9337684A JP S60236728 A JPS60236728 A JP S60236728A
Authority
JP
Japan
Prior art keywords
thermoplastic resin
resin sheet
metal foil
sheets
laminate plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59093376A
Other languages
Japanese (ja)
Inventor
Shoji Fujikawa
藤川 彰司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP59093376A priority Critical patent/JPS60236728A/en
Publication of JPS60236728A publication Critical patent/JPS60236728A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0346Organic insulating material consisting of one material containing N
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers

Landscapes

  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:To obtain the titled laminate plate excellent in the thickness accuracy, the adhesivity of a metal foil, high frequency characteristic and the like with a better moldability by using a thermoplastic resin sheet with a specified water content to be a substrate for a laminate plate as such. CONSTITUTION:A plurality of thermoplastic resin sheets (preferably made of polyeter imide resin) each with the premolding water content of 0.3% or less are laminated one upon another and after a metal foil such as copper foil is piled on the outermost surface of the sheets thus laminated, they are thermopressure molded monolithically to obtain the desired laminate plate. The adjustment of the water content of the thermoplastic resin sheet may be done by heat aging. The thickness of the thermoplastic resin sheet is generally 10mum-3mm. and that of the metal foil preferably 18-70mum.

Description

【発明の詳細な説明】 ]技術分野1 本発明は、プリント配線板などとして用いられる電気用
積JvJiの製造方法に関するものである。
[Detailed Description of the Invention] Technical Field 1 The present invention relates to a method for manufacturing an electrical product JvJi used as a printed wiring board or the like.

[背景技術1 例えばフレキシブルプリン1配線板なとの用途に、熱可
塑性樹脂のシートを積層させたものを基板とする電気用
積層板が多用されている。この電気用積層板は熱可塑性
48脂のシートを所要枚数重ね、この最外面の」二面ま
たは下1f11あるいは画面に銅箔などの金属箔を巾ね
、これを加熱加圧することによって一体化さぜることで
イ:1られる。そしてこのもので問題となっているのは
、板厚精度、熱可塑性樹脂シートによる基板と金属箔と
の密着性、高周波特性、耐熱性、成型時のカスレやボイ
ドの発生などである。そこで本発明者等はこれらの問題
点の原因を種々検討した結果、これらは熱可塑性(3(
脂のシートの含水率が成形に供する前の状態で高いため
ではないかと考えられるに至った。すなわちこの種の電
気用+r+屑扱の製造に供される熱可塑性樹脂シートの
含水率はいずれも0.5%以−してあり、この含水率が
」―記問題の原因となるのではないかと考えられるもの
である。
[Background Art 1] Electrical laminates having a substrate made of laminated sheets of thermoplastic resin are often used for applications such as flexible print 1 wiring boards, for example. This electrical laminate is made by stacking the required number of thermoplastic 48 resin sheets, wrapping metal foil such as copper foil over the outermost two sides or the bottom 1F11 or the screen, and heating and pressing them together to integrate them. By doing so, you can get 1:1. Problems with this product include plate thickness accuracy, adhesion between the thermoplastic resin sheet and the substrate, high frequency characteristics, heat resistance, and the occurrence of scratches and voids during molding. Therefore, the present inventors investigated various causes of these problems, and found that these were thermoplastic (3(
We have come to believe that this is because the moisture content of the fat sheet is high before being subjected to molding. In other words, the moisture content of the thermoplastic resin sheets used in the production of this type of electrical +r+ waste handling is all 0.5% or more, and this moisture content is not the cause of the problem mentioned above. This is something that can be considered.

1発明の目的1 本発明は、」二記の点に鑑みて為されたものであリ、仔
i 1r’を版の板1’7精度、金属箔の密着性、高周
波1・r性、成型性などに優れた電気用積層板の製造方
法を提供することを目的とするものである。
1 Objective of the Invention 1 The present invention has been made in view of the following points. The object of the present invention is to provide a method for manufacturing an electrical laminate with excellent moldability.

[発明の開示1 しかして本発明に係る電気用積層板の製造方法は、熱可
塑性樹脂のシートを複数枚重ねると共にこのシートの最
外面に金属箔を重ね、これを加熱加圧成形して一体化さ
せることによって電気用積層板を製造するにあたって、
熱可塑性樹脂シートとして成形前の含水率が0.3%以
下のものを用いることを特徴とするもので、かがる含水
率の熱可塑性樹脂シートを用いることによってL記目的
を達成したものであり、以下本発明の詳細な説明する。
[Disclosure 1 of the Invention] However, the method for manufacturing an electrical laminate according to the present invention involves stacking a plurality of sheets of thermoplastic resin, overlaying a metal foil on the outermost surface of the sheets, and molding them under heat and pressure to form an integral piece. In manufacturing electrical laminates by
It is characterized by using a thermoplastic resin sheet with a moisture content of 0.3% or less before molding, and achieves the purpose listed in L by using a thermoplastic resin sheet with a moisture content of 0.3% or less. The present invention will be described in detail below.

積層板の基板となる熱可塑性樹脂シートとしては、主と
してポリエーテルイミド樹脂のシート(フィルムも含む
)が用いられるが、その他ポリサル7Tン、ポリエーテ
ルサル7アン、ポリフェニレンサルファン、ポリフェニ
レンオキサイド、ポリオレフィンなどのシートを用いる
ことができる。
As the thermoplastic resin sheet that becomes the substrate of the laminate, polyetherimide resin sheets (including films) are mainly used, but other materials such as polysal 7T, polyethersal 7an, polyphenylene sulfan, polyphenylene oxide, polyolefin, etc. sheets can be used.

そして本発明にあってはこの熱意ヴv2性樹脂シートを
加熱によるエージング処理してその含水率を()。
In the present invention, this heat-aging resin sheet is heated to determine its moisture content ().

3%以下にした状態で使用するようにと、−ろに特徴を
有する。ここで含水率は、絶乾状態の@量に対する含水
水分の取量の百分率で示されるものであり、例えば熱可
塑性樹脂シートが10μ〜;3゜(1+nm厚のポリエ
ーテルイミド樹脂(例えばエンジニアプラスチック社製
ウルテム)の場合には190°Cで2時間エージングす
ることによって絶乾状態になる。また熱可塑性樹脂シー
トの含水率は0゜3%IJ、下であることが必要であり
、含水率がこれより大きいと本発明の目的が十分達成さ
れないものである。熱可塑性樹脂シートの厚みは10μ
〜3.0mmが一般的である。
It has a special feature that it should be used at 3% or less. Here, the moisture content is expressed as a percentage of the amount of water contained in the absolute dry state.For example, a thermoplastic resin sheet has a thickness of 10μ~; In the case of Ultem (manufactured by Ultem), it becomes completely dry by aging at 190°C for 2 hours.Moreover, the moisture content of the thermoplastic resin sheet must be below 0°3% IJ. If it is larger than this, the object of the present invention cannot be fully achieved.The thickness of the thermoplastic resin sheet is 10 μm.
~3.0 mm is common.

しかして上記熱可塑性樹脂シートを所要枚数重ね、さら
にこの積載した熱可塑性樹脂シートの最外の上面または
下面、あるいは両面に銅箔などの金属箔を重ねこれを積
層成型装置に導入して加熱加圧成形を行うことにより、
熱可塑性樹脂シート及び金属箔を積層一体化させ、電気
用積層板を得ることができるものである。ここで金属箔
としては厚みが18 = 7 (lμのものが好ましい
。尚、同様な操作によって多層プリント配線糎用の積ノ
ー板を作成することもできる。
Then, the required number of thermoplastic resin sheets are stacked, and then a metal foil such as copper foil is stacked on the outermost top or bottom surface or both sides of the stacked thermoplastic resin sheets, and this is introduced into a lamination molding machine and heated. By performing pressure forming,
An electrical laminate can be obtained by laminating and integrating a thermoplastic resin sheet and a metal foil. Here, the metal foil preferably has a thickness of 18 = 7 (lμ). Note that a laminated board for multilayer printed wiring can also be created by a similar operation.

次に本発明を実施例によって具体的に説明する。Next, the present invention will be specifically explained using examples.

尺湾例−1− 厚さく1.2mmのポリエーテルイミド樹脂シート(エ
ンジニアプラスチック社製:商品名ウルテム)を180
°Cで60分間加熱してエージング処理したのち含水率
を測定したところ0.1%であった。この樹脂シー1を
直ちに成形に供した。すなわちこの樹脂シートを8枚重
ね、さらに最外のに面と下面とに厚さQ 、035 +
nmの接着剤イ1き銅箔を積載し、これを20Kg/c
+n’、250°c、f’+0分の条イ′1で加熱加圧
して銅箔張り積層板を1(jた。
Shakuwan example - 1 - A polyetherimide resin sheet (manufactured by Engineer Plastics Co., Ltd., trade name: Ultem) with a thickness of 1.2 mm is
After aging treatment by heating at °C for 60 minutes, the moisture content was measured and found to be 0.1%. This resin sheet 1 was immediately subjected to molding. That is, 8 of these resin sheets are stacked, and the outermost surface and bottom surface have a thickness of Q, 035 +
Loaded with 1 nm adhesive copper foil, this was 20Kg/c.
+n', 250°C, and f'+0 minutes of heat and pressure to form a copper foil-clad laminate.

宋1州ζ 実施例]におけるポリエーテルイミド樹脂シートを45
 +1 ’(:で6()分間加熱してエージング処理し
たのち含水率を測定したところ()、2%であった1、
この樹脂シートを用いて実施例1と同様にして銅箔張り
積層板を1!lた。
45 polyetherimide resin sheets in Song 1st Prefecture ζ Examples]
+1 '(:) After heating for 6 () minutes and aging treatment, the moisture content was measured () and found to be 2%.
Using this resin sheet, a copper foil-clad laminate was made in the same manner as in Example 1! It was.

ル2裳肚 実施例1におけるポリエーテルイミド樹脂シートの含水
率を測定したところ0.7%であった。
The moisture content of the polyetherimide resin sheet in Example 1 was measured and found to be 0.7%.

この樹脂シートをエージング処理[ることなく、あとは
実施例1と同様にして銅箔張り積層板をイミドた。
A copper foil-clad laminate was imidated in the same manner as in Example 1 without aging this resin sheet.

上記の3Lうにして得た実施例1,2及び比較例の積層
板について、成型性、板厚精度、誘電率、誘電正接、銅
箔との引き剥がし強度を観察乃至測定した。、結果を次
表にボす3.成型性は積層板にカスレやボイドの発生し
ているがどうかを観察することにJ:りお5二ない、ま
た板1’f精度は1 +n四方の大きさに成形された積
/F!根の厚みの最小餉と最大値とを測定rることによ
っておこなった、また次表において処理後とは2;(”
Cの水中に2/1時間浸漬する処理の後に測定したこと
を示す。
For the laminates of Examples 1 and 2 and Comparative Example obtained in the above 3L process, moldability, plate thickness accuracy, dielectric constant, dielectric loss tangent, and peel strength from copper foil were observed and measured. , the results are shown in the table below.3. Formability is determined by observing whether scratches or voids occur in the laminate.J: Rio 52 is not present, and the accuracy of the plate 1'f is the product/F! This was done by measuring the minimum and maximum root thickness, and in the following table, after treatment is 2;
It shows that the measurement was taken after treatment of immersion in water of C for 2/1 hour.

前人の糸、′1果、′丸施例1,2のものではカスレや
ボイドの発生を低j威することかて゛さて成へり性を向
1−させる。−とかでき、板厚のバラツキを小さくして
板厚精度を向1−さぜることが丁′き、誘電率や誘電正
接を小さくして高周波Vj性を向にさせることができ、
銅箔との密着性を向上さぜることがで′きる5二とが確
認される。
The former's threads, '1' and 'round Examples 1 and 2, not only reduce the occurrence of fading and voids, but also improve the dryness. -, it is possible to reduce the variation in the plate thickness and improve the plate thickness accuracy, and it is possible to decrease the dielectric constant and dielectric loss tangent to improve the high frequency Vj property.
It is confirmed that the adhesion to the copper foil can be improved.

1発明の勿ノ果1 上述のように本発明にあっては、熱可塑性樹脂シートと
して成形前の含水率かOo:(%以下のものを用いるよ
うにしたので、加熱加圧成型時に気化される水分量が少
ない為と予想される理由によって、カスレやボイドの発
生を低減せしめて成型性よく積層板の製造をおこなうこ
とができると共に積層板の板厚精度、高周波特性、金属
箔との密λ′r性を向上させることができるものである
1 Consequences of the invention 1 As mentioned above, in the present invention, the thermoplastic resin sheet used has a moisture content of Oo: This is expected to be due to the small amount of moisture in the laminate, which reduces the occurrence of scratches and voids, making it possible to manufacture laminates with good formability, as well as improving the thickness accuracy of the laminate, high frequency characteristics, and tightness with metal foil. This can improve the λ'r property.

代理人 弁理士 石川J(七Agent Patent Attorney Ishikawa J (7)

Claims (2)

【特許請求の範囲】[Claims] (1)熱+i(塑fl: tH脂のシートを複数枚重ね
ると共にこのシートの最外面に金属箔を取ね、これを加
熱加圧成形して一体化さぜることによって電気用積層板
を製造するにあたって、熱可塑性樹脂シー1とし、て成
形前の含水甲が0.3%以下のものを用いることを特徴
とする電気用積層板の製造方法。
(1) Layering multiple sheets of heat + i (plastic fl: tH resin), attaching metal foil to the outermost surface of these sheets, and molding them under heat and pressure to integrate them together to create an electrical laminate. A method for manufacturing an electrical laminate, characterized in that the thermoplastic resin sheet 1 has a water content of 0.3% or less before molding.
(2)熱可塑性樹脂シートがポリエーテルイミド樹脂で
あることを特徴とする特許請求の範囲第1項記載の電気
用積層板の製造方法。
(2) The method for manufacturing an electrical laminate according to claim 1, wherein the thermoplastic resin sheet is a polyetherimide resin.
JP59093376A 1984-05-10 1984-05-10 Manufacture of electric laminate plate Pending JPS60236728A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59093376A JPS60236728A (en) 1984-05-10 1984-05-10 Manufacture of electric laminate plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59093376A JPS60236728A (en) 1984-05-10 1984-05-10 Manufacture of electric laminate plate

Publications (1)

Publication Number Publication Date
JPS60236728A true JPS60236728A (en) 1985-11-25

Family

ID=14080581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59093376A Pending JPS60236728A (en) 1984-05-10 1984-05-10 Manufacture of electric laminate plate

Country Status (1)

Country Link
JP (1) JPS60236728A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62127239A (en) * 1985-11-27 1987-06-09 東洋アルミニウム株式会社 Substrate for flexible printed circuit
EP0977471A1 (en) * 1997-12-08 2000-02-02 Matsushita Electronics Corporation Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62127239A (en) * 1985-11-27 1987-06-09 東洋アルミニウム株式会社 Substrate for flexible printed circuit
EP0977471A1 (en) * 1997-12-08 2000-02-02 Matsushita Electronics Corporation Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material
EP0977471A4 (en) * 1997-12-08 2001-10-10 Matsushita Electronics Corp Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material
US6409869B1 (en) 1997-12-08 2002-06-25 Matsushita Electric Industrial Co., Ltd. Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material
US6814836B2 (en) 1997-12-08 2004-11-09 Matsushita Electric Industrial, Co., Ltd. Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material
US6838164B2 (en) 1997-12-08 2005-01-04 Matsushita Electric Industrial Co., Ltd. Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material

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