JPS60234287A - Magnetic bubble memory element - Google Patents

Abstract

PURPOSE:To measure an accurate chip temperature without increasing the number of terminals by connecting a magnetic bubble erasion coil in series to a temperature detecting element set within a package, and inserting them between array erasion coil terminals provided outside a package of elements. CONSTITUTION:A plastic molded package 1 includes a memory erasing positive terminal 2, a temperature detecting element 3, a memory erasing coil 4, a rotary magnetic field generating coil 5 and a memory erasing negative terminal 6. The coil 4 is connected in series to the element 3 between terminals 2 and 6. In such constitution, the element 3 is buried into the package 1 and also set at a position near a chip, i.e., a subject for measurement of temperature or the coil 5 surrounding said chip. Thus it is possible to measure the chip temperature with much higher accuracy than before and with no effect of the wind, etc. nor increase of the number of terminals.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a magnetic bubble memory element that allows the temperature inside a package to be measured relatively accurately.

[Background of the invention]

In order to operate the magnetic bubble memory element reliably, it is necessary to ensure a so-called operating margin as large as possible, and for this purpose, the temperature of the so-called chip, which is the magnetic bubble carrier, must be detected.

In conventional magnetic bubble memory elements, in order to detect temperature, a temperature sensing element such as a positive temperature coefficient thermistor is attached to the outer surface of the element package to measure the temperature there.
The temperature of the magnetic bubble carrier inside the package was estimated from that value. However, with this method, the temperature sensing element is pressed well against the outer surface of the package to ensure close contact.
Thermal conductivity there must be increased, which requires the installation of additional parts such as special retaining metal fittings. Furthermore, even if the temperature is properly pressed, if there is wind (flow of surrounding air, etc.) in the vicinity, the measured temperature value will be inaccurate and unreliable. In a magnetic bubble memory element, a rotating magnetic field must be applied to the magnetic bubble carrier in order to transfer magnetic bubbles, but the coil for generating this rotating magnetic field is used for a long time and is the largest source of heat generation in the magnetic bubble memory element. It is. A magnetic bubble carrier (chip) exists in a space surrounded by a rotating magnetic field generating coil.

In the above conventional method, the temperature was measured at a location far away from the rotating magnetic field generating coil or chip, which is the heat source, so a complicated temperature conversion formula was used to convert the measured temperature value to the desired temperature value. There was also the problem of having to estimate .

Furthermore, Japanese Patent Application Laid-Open No. 54-27330 describes a method of expanding the operable temperature range by configuring the bubble detector so that the current flowing through it changes with a negative temperature gradient in response to the ambient temperature. However, this method has a problem in that in order to detect temperature, it is necessary to increase the number of terminals provided outside the package of the magnetic bubble memory element.

[Purpose of the invention]

An object of the present invention is to provide a temperature detection means built into the package without the problems of the conventional methods described above, and to enable accurate temperature measurement of a magnetic bubble carrier (chip). An object of the present invention is to provide a magnetic bubble memory element that does not require an increase in the number of terminals disposed outside a pan cage.

[Summary of the Invention] In order to achieve the above object, the present invention connects a magnetic bubble erasing coil and a temperature sensing element arranged inside the pan cage in series between erasing coil terminals arranged outside the element package. I decided to insert it. Since the magnetic bubble extinguishing coil is used infrequently, the extinguishing coil terminal can be used to measure the temperature of the magnetic bubble carrier most of the time (thus reducing the number of parts). The temperature sensing element can be embedded in the package of the magnetic bubble storage element, for example in a plastic mold, and can be placed on a magnetic bubble carrier (for example, by LPing a YIG film on a GGG substrate).
(formed by method E) can be accurately measured without being bothered by the influence of external air flow.

[Embodiments of the invention]

FIG. 1 shows an embodiment of the present invention, in which 1 is a plastic mold package, 2 is a memory erasing + terminal, 3 is a temperature sensing element, 4 is a memory erasing coil, 5 is a rotating magnetic field generating coil, 6
is the memory erase terminal.

For the temperature detection element 3, a positive temperature coefficient thermistor or the like, which can pass a memory erasing current of 2 A or more, may be used. The time required to perform a memory erasing operation with the memory erasing filler 4 is extremely short under normal usage conditions. Most of the rest of the time can be used to detect the temperature of the implanted area by passing a current that generates a weak voltage between the terminals. A temperature detection circuit similar to a conventional one may be connected between the terminals 2 and 6 as a temperature detection circuit that measures the temperature by measuring the voltage between the terminals. The temperature sensing element 3 is embedded in the plastic mold package 1, and is placed close to the chip whose temperature is to be measured and the rotating magnetic field generating coil 5 that surrounds it, so it is free from the effects of wind, etc. Chip temperature can be measured more accurately than before without having to worry about

Conventionally, due to the mounting density of the board of the magnetic bubble storage device, it was not possible to attach temperature detection elements to the outside of the package of all magnetic bubble elements, and the temperature detection element could not be attached to the outside of the package of all the magnetic bubble elements. 1 sensing element, or
Temperature sensing elements were provided at a ratio of about one out of every three. Therefore, even if a temperature rise occurs in a magnetic bubble element without a temperature detection element attached for some reason,
Although temperature detection was not possible, according to the present invention, a temperature detection element can be attached to each of the magnetic bubble elements, eliminating the anxiety that would occur in the conventional case.

Note that instead of using a temperature sensing element whose electrical resistance changes with temperature changes as in this embodiment, the temperature can also be measured by measuring electromotive force with a thermocouple. The memory erasing coil 4, which requires a long winding, must be made of copper, which has low resistance, but it is not possible to use a metal other than copper, such as nickel, from one external terminal to one end of the memory erasing coil winding. I can do it.

[Effects of the Invention] As explained above, according to the present invention, the external terminal of the memory erasing coil, which is rarely used, is also used for chip temperature measurement, and the temperature of each chip can be measured much more accurately than before. Moreover, the number of parts is reduced, and complicated temperature conversion calculations as in the past are no longer necessary.

[Brief explanation of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention. 2-memory erasing + terminal, 3-temperature sensing element, 4-memory erasing coil,
5--rotating magnetic field generating coil, 6--memory erasing terminal. Figure 1 (♀

Claims (1)

[Claims] In a magnetic bubble memory element equipped with a magnetic bubble erasing coil, the erasing coil and a temperature sensing element disposed inside the package are connected in series and inserted between erasing coil terminals arranged outside the package of the element. A magnetic bubble memory element featuring: