JPS602333A - Manufacture of laminate plate - Google Patents
Manufacture of laminate plateInfo
- Publication number
- JPS602333A JPS602333A JP58111739A JP11173983A JPS602333A JP S602333 A JPS602333 A JP S602333A JP 58111739 A JP58111739 A JP 58111739A JP 11173983 A JP11173983 A JP 11173983A JP S602333 A JPS602333 A JP S602333A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- pressure
- laminate plate
- depressurization
- time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/40—Shaping or impregnating by compression not applied
- B29C70/42—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2791/00—Shaping characteristics in general
- B29C2791/001—Shaping in several steps
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、そり、ねじれの発生の少ない積層板の製造法
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a laminate with less warpage and twisting.
近年、プリント配線板は、配線密度が高くなると共に、
加工工程の自動化か進み、そり、ねじれの抑制齋こ対し
厳しい要求カナなされている。In recent years, the wiring density of printed wiring boards has increased, and
As the automation of machining processes progresses, strict requirements are being made to suppress warpage and twisting.
しかしながら、プリント配線板の基板である積層板は、
基材と樹脂の熱収縮率の差があるため、そり、ねじれが
発生する。このそり、ねじれを抑制するために、積層板
成形時の加熱温度の上昇速度や成形圧力を調整したり、
樹脂の溶融粘度を変えたり基材構成を検討したり種々改
善がなされているが、未1ど十分ではない。However, the laminate board that is the substrate for printed wiring boards,
Warpage and twisting occur due to the difference in thermal shrinkage rate between the base material and the resin. In order to suppress this warpage and twisting, the rate of increase in heating temperature and molding pressure during laminated board molding may be adjusted.
Various improvements have been made, such as changing the melt viscosity of the resin and considering the structure of the base material, but they are still not sufficient.
本発明は、比較的制御の容易な成形圧力に着目し、そり
、ねじれの発生の少ない積層板を製造することを目的と
するものである。The present invention focuses on molding pressure, which is relatively easy to control, and aims to produce a laminate with less warpage and twisting.
上記の目的を達成するために本発明は、熱硬化性樹脂を
基材に含浸乾燥して得たプリプレグを所定枚数重ね加熱
加圧して積層板を成形する工程において、一旦加圧を解
除しく以下脱圧という)再びもとの圧力に戻す工程を1
〜3回繰り返すことを特徴とする。In order to achieve the above object, the present invention has the following features: In the step of forming a laminate by stacking a predetermined number of prepregs obtained by impregnating and drying a thermosetting resin into a base material and heating and pressing them, the following steps are taken: The process of returning to the original pressure (called depressurization) is 1.
It is characterized by repeating ~3 times.
加熱加圧を一貫して続けた場合には歪が残った状態のま
まで樹脂が゛硬化し、そり、ねじれの要因を内在した積
層板が成形されること彎こなる。If heating and pressing are continued consistently, the resin will harden with residual distortion, resulting in the formation of a laminate that is susceptible to warping and twisting.
それに対し1本発明は加熱加圧中に一旦脱圧をすること
多こより、それまで蓄積されていた歪が分散、緩和され
、そり、ねじれの少ない積層板か製造できる訳けである
。脱圧し再びもとの圧り返すと積層板の層間密着性が低
下したり新たな歪みを発生したりするので避けるべきで
ある。On the other hand, in the present invention, since the pressure is once removed during heating and pressurization, the strain that had been accumulated up to that point is dispersed and relaxed, and a laminate with less warpage and twisting can be produced. If the pressure is released and then the pressure is returned to the original level, the interlayer adhesion of the laminate may deteriorate or new distortion may occur, so this should be avoided.
尚、脱圧の時間はプレス操作の時間であり、短かすぎる
と脱圧しても完全に無負荷ζこできなかったり、長すぎ
ると積層板の層間剥離を起こす惧れがある。脱圧の時間
は好ましくはα6〜5分間である。Incidentally, the time for depressurization is the time for the press operation, and if it is too short, it may not be possible to completely release the load even after depressurizing, and if it is too long, there is a risk that delamination of the laminate may occur. The depressurization time is preferably α6 to 5 minutes.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
実施例1゜
ガラス不織布基材lこエポキシ樹脂を含浸乾燥して得た
プリプレグを5枚重ね合せこれを、C鏡面板に挾み、こ
の6組をプレス熱盤開化挿入して加熱加圧した。加熱加
圧は図面lと示すようなパターンで行なフた。Example 1 Glass nonwoven fabric base material 5 prepregs obtained by impregnating and drying epoxy resin were stacked together, sandwiched between C mirror plates, and the 6 sets were inserted into a press hot plate and heated and pressurized. . The heating and pressurization was carried out in a pattern as shown in Drawing 1.
すなわち、曲線aで示すようにプレス熱盤の温度を17
0℃に70分間保持して加熱を行なう。曲線Cはプレス
熱盤間の中央にあるプリプレグの温度変化を示し、その
温度か′130℃になるまで曲@bで示す圧力を20に
9/C1lに保ち、その後soy/cdまで昇圧した。In other words, as shown by curve a, the temperature of the press heating plate is set to 17
Heating is carried out by holding at 0° C. for 70 minutes. Curve C shows the temperature change of the prepreg located at the center between the press hot platens, and the pressure indicated by curve @b was maintained at 20:9/C1l until the temperature reached 130°C, and then the pressure was increased to soy/cd.
加熱後50分間経過したところで無圧の状態まで1分間
脱圧してもとの80#/cIItの圧力まで昇圧し、4
分後に再び同様の脱圧、昇圧を行ない、1m厚の積層板
を6枚成形した。After 50 minutes had passed after heating, the pressure was depressurized for 1 minute to a no-pressure state, and the pressure was increased to the original pressure of 80#/cIIt.
After a few minutes, similar depressurization and pressure increase were performed again to form six laminates with a thickness of 1 m.
実施例2
脱圧、昇圧の工程を1回にする以外は実施例1と同様に
して積層板を成形した。Example 2 A laminate was molded in the same manner as in Example 1 except that the steps of depressurization and pressure increase were performed once.
比較例
脱圧、昇圧の工程を4回にする以外は実施例1と同様化
して積層板を成形した。Comparative Example A laminate was molded in the same manner as in Example 1, except that the steps of depressurization and pressure increase were repeated four times.
従来例
脱圧を1回も行なわず、実施例1と同様の加熱加圧条件
で積層板を成形した。Conventional Example A laminate was molded under the same heating and pressing conditions as in Example 1 without depressurizing even once.
上述のようにして得た各積層板を400X200圓の大
きさの試料片に切断し、JIS−C−6481iこ基づ
き常態および150℃で30分間加熱後のそり、ねじれ
を測定した。その結果を第1表化示す。表中のそり、ね
じれの各測定値は、常態における最大値〜加熱後の最大
値を示す。Each of the laminates obtained as described above was cut into sample pieces of 400 x 200 circles, and warpage and torsion were measured in accordance with JIS-C-6481i at normal conditions and after heating at 150°C for 30 minutes. The results are shown in Table 1. Each measured value of warp and twist in the table indicates the maximum value under normal conditions to the maximum value after heating.
第 1 表
第1表から明らかなように、本発明によれば、そり、ね
じれの発生か少ない積層板を得ることかでき1発生した
そり、ねじれのバラツキも小さいものであった。また、
本発明は、圧力の制御によるものであるので、操作も比
較的容易である点その工業的価値は極めて大なるもので
ある。Table 1 As is clear from Table 1, according to the present invention, it was possible to obtain a laminate with less warpage and twisting, and the variation in warpage and twisting that occurred was also small. Also,
Since the present invention is based on pressure control, it is relatively easy to operate, and its industrial value is extremely great.
図面は本発明の一実施例における積層成形の温度および
圧力の経時変化を示す曲線図である。
aはプレス熱盤温度、bは圧力、Cはプリプレグ温度
時 局The drawing is a curve diagram showing changes over time in temperature and pressure in laminated molding in one embodiment of the present invention. a is the press platen temperature, b is the pressure, and C is the prepreg temperature.
Claims (1)
を所定枚数重ね加熱加圧して積層板を成形する工程にお
いて、一旦加圧を解除し再びもとの圧力基こ戻す工程を
1〜3回繰り返すことを特徴とする積層板の製造法。 2 加圧を解除している1回の時間が0.5〜5分間で
ある特許請求の範囲第1項記載の積層板の製造法。[Claims] L In the step of forming a laminate by heating and pressing a predetermined number of sheets of prepreg obtained by impregnating and drying a base material with a thermosetting resin, the pressure is once released and the original pressure base is restored. A method for producing a laminate, characterized by repeating the reconstitution step 1 to 3 times. 2. The method for manufacturing a laminate according to claim 1, wherein the time period during which the pressure is released is 0.5 to 5 minutes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58111739A JPS602333A (en) | 1983-06-21 | 1983-06-21 | Manufacture of laminate plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58111739A JPS602333A (en) | 1983-06-21 | 1983-06-21 | Manufacture of laminate plate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS602333A true JPS602333A (en) | 1985-01-08 |
JPS6363369B2 JPS6363369B2 (en) | 1988-12-07 |
Family
ID=14568955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58111739A Granted JPS602333A (en) | 1983-06-21 | 1983-06-21 | Manufacture of laminate plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS602333A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6111233A (en) * | 1984-06-28 | 1986-01-18 | Sumitomo Bakelite Co Ltd | Manufacture of laminate product |
JP2000094622A (en) * | 1998-09-25 | 2000-04-04 | Matsushita Electric Works Ltd | Manufacture of laminate |
JP2005155914A (en) * | 2003-11-26 | 2005-06-16 | Denso Internatl America Inc | Pipe mounting structure to dashboard |
CN113194640A (en) * | 2021-04-28 | 2021-07-30 | 中国科学院微电子研究所 | Manufacturing method of low-warpage high-density packaging substrate |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51133381A (en) * | 1975-05-15 | 1976-11-19 | Kuraray Co Ltd | Plywood and a process for manufacturing it |
JPS5421388A (en) * | 1977-07-18 | 1979-02-17 | Sumitomo Chemical Co | Position detecting method of defect of corrosion resistant coating layer of underground steel pipe |
JPS5660221A (en) * | 1979-10-22 | 1981-05-25 | Shin Kobe Electric Mach Co Ltd | Manufacture of laminate board |
-
1983
- 1983-06-21 JP JP58111739A patent/JPS602333A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51133381A (en) * | 1975-05-15 | 1976-11-19 | Kuraray Co Ltd | Plywood and a process for manufacturing it |
JPS5421388A (en) * | 1977-07-18 | 1979-02-17 | Sumitomo Chemical Co | Position detecting method of defect of corrosion resistant coating layer of underground steel pipe |
JPS5660221A (en) * | 1979-10-22 | 1981-05-25 | Shin Kobe Electric Mach Co Ltd | Manufacture of laminate board |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6111233A (en) * | 1984-06-28 | 1986-01-18 | Sumitomo Bakelite Co Ltd | Manufacture of laminate product |
JP2000094622A (en) * | 1998-09-25 | 2000-04-04 | Matsushita Electric Works Ltd | Manufacture of laminate |
JP2005155914A (en) * | 2003-11-26 | 2005-06-16 | Denso Internatl America Inc | Pipe mounting structure to dashboard |
CN113194640A (en) * | 2021-04-28 | 2021-07-30 | 中国科学院微电子研究所 | Manufacturing method of low-warpage high-density packaging substrate |
CN113194640B (en) * | 2021-04-28 | 2022-07-08 | 中国科学院微电子研究所 | Manufacturing method of low-warpage high-density packaging substrate |
Also Published As
Publication number | Publication date |
---|---|
JPS6363369B2 (en) | 1988-12-07 |
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