JPS60230384A - Method of soldering to connector terminal - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention relates to a method for soldering connector terminals.

Generally, when attaching a solder type connector to the end of a cable, it is necessary to solder the conductor end C of the cable lead wire to the terminal a of the connector, as shown in FIG. If preliminary solder is applied to terminal a of the connector in advance, subsequent soldering will be easier.

However, in the conventional work of applying preliminary solder, the worker holds a lead wire in one hand and a soldering iron in the other hand, and performs the work for each connector terminal a. This method is not only extremely inefficient, but also involves difficult manual work that requires skill, and the quality varies widely. Furthermore, as shown in FIG. 2, there was a high probability that solder bridges f would occur between adjacent connector terminals a that were arranged in an orderly manner and protruded from the connector case, resulting in a defective product.

Further, there are problems such as the amount of preliminary soldering being too small, resulting in insufficient soldering afterward, and the need to resupply thread solder.

The purpose of the present invention is to solve these problems, improve soldering work efficiency and stabilize quality, reliably prevent solder bridges, and ensure that an appropriate amount of preliminary solder is always available. do. Therefore, a feature of the present invention is that the back surface of a die plate having a plurality of die holes is brought into contact with the horizontal surface of the molten solder, and the bottom of the die hole is made blind by the surface of the molten solder. Flux is injected into the die hole, and then the lead connection side end of the connector terminal is penetrated into the die hole, and the end penetrates into the molten solder, which is pulled out and cooled and solidified to form the end. The point is that a preliminary solder layer is applied to the area, and then the preliminary solder layer is melted again and the conductor of the lead wire is soldered.

Hereinafter, the present invention will be explained in detail based on illustrated embodiments.

A connector 2 is attached to one end of the shielded cable 1 shown in FIG.
and a plastic outer covering layer 6.

As shown in FIGS. 3, 4, and 5, the connector case 3 has an outer flange 7 in the middle, a surrounding wall 8 on the outside, and a plurality of pin-shaped connector terminals arranged in an orderly manner. 9...
is attached. This connector terminal 9 has a shape as shown in FIG. That is, one end is formed as a male insertion rod part 10, and the other end is formed with a blind hole part 12 as a lead connection side end part 11, and a notch part 13 is formed in a sloping shape, so that a so-called solder cup shape is formed. to do.

In Fig. 3, this male insertion rod part 10... can be seen, and in Figs. 4 and 5, the upper part is this male insertion part 10..., and the lower part (
The inside) is the lead connection side end portion 11...

However, the connector terminal 9 having such a shape...
Embodiments of the method of soldering the conductors 15 of the cable lead wires 14 to the ends 11 of the cables (as shown in FIG. 20) will be sequentially explained with reference to FIGS. 6 to 20. .

First, in FIG. 6, the solder tank 16 is filled with molten high temperature solder 17. Horizontal surface 1 of this molten solder 17
It is necessary to keep the height of the notch 8 constant, preferably the height of the notch 1
It is preferable to use a jet solder tank that overflows from 9. 20 is a die plate, and as shown in FIG. 6, FIG. 7, and FIG. Holes 22... are provided therethrough. Moreover, the arrangement of the die holes 22 corresponds to the positions of the connector terminals 9 of the connector 2 illustrated in FIG. 3, FIG. 4, or FIG. 1θ. The inner diameter of each of the die holes 22 is 1.5 to 3 of the outer diameter d of the lead connection side end 11 of the connector terminal 9.
It is desirable to set it to twice the size (see Figure 12).

Further, guide pins 23, 23 are provided at appropriate positions to protrude upward from the top plate portion 21. In the illustrated example, a pair of guide pins 23 are protruded from the left and right outer sides of two rows of die holes 22 arranged in a staggered manner.

Such a die plate 20 is brought into contact with the horizontal surface 18 of the molten solder from above, and the back surface of the die plate 20 and the surface 18 are brought into contact with each other.
Match them as shown in Figure 8. Therefore, the die hole 22
. . are blinded by the surface 18 of the molten solder 17. Next, as shown in FIG. 9, this blind hole-shaped die hole 22
. . . Inject liquid flux 25 into the inside. For example, if liquid flux 25 is applied to a brush 26 or the like and run over the surface of the die plate 20, it will be injected into the die holes 22 in a substantially filling shape.

As shown in Fig. 3 and Fig. 1θ, holes 27.27 for screws 24.24 are provided through the outer flange 7 of the connector case 3, and the inner diameter and spacing of the holes 27.27 are pre-guided. If the outer diameter and interval of the pins 23.23 are set to predetermined values, the guide pin 23.23 is inserted into this hole 27.27 and the 10th
By pressing down in the direction of arrow A in Figures and Figure 11,
Connector terminal 9...glue connection side end 11... is first wetted with flux 25 and accurately inserted into die hole 22.
. . , and the end portions 11 . . . penetrate into the molten solder 17.

12, 13, and 14 show that in this way, the tip notch 13 of the connector terminal 9...glue connection side end 11 breaks through the flux 25 and enters the molten solder 17. It shows the immersed state.

Thereafter, the connector terminals 9 are immediately pulled up as shown in FIGS. 15 and 16. During this withdrawal, the remainder of the flux 25 adheres to the solder surface as a film of flux 25a. Next, if it is cooled and solidified, as shown in the cross-sectional view of FIG. 17 and the external view of FIG.
1, preliminary solder application B is completed.

Thereafter, as shown in FIG. 19, the end of the conductor 15 of the lead wire 14 is pressed with the tip 28a of the soldering iron 28 to remelt it, and the conductor 15 is inserted into the blind hole 12 of the end 11 as shown in FIG.
Solder to H. Of course, various methods other than the use of a soldering iron can be used for the above-mentioned remelting.

As in the above-mentioned embodiment, a plurality of connector terminals 9 are arranged and fixed to the connector case 3 in advance, and are inserted into the plurality of die holes 22 at once to inject the flux 25.
Since the molten solder 17 is sequentially adhered to the lead connection side ends 11..., the amount of adhesion can be equalized, and
It has the advantage of being able to work with extremely high efficiency. Further, since the flux 25 penetrates through the flux 25 and first adheres to the lead connection side end 11, and then the molten solder 17 adheres, there is an advantage that soldering can be performed using solder having sufficient strength. When the conductor 15 is pulled out, the remaining flux adheres as a film-like flux 25a, so that a sufficiently strong soldering with the conductor 15 can be achieved in the subsequent main soldering.

Thus, FIGS. 21 to 23 show other embodiments of the present invention.

As in the previous embodiment, flux 25 is first injected into the die holes 22 of the die plate 20, which are arranged so that the back side is in contact with the front surface 18 of the molten solder 17, and then the connector terminal 9 is inserted as an independent single item. ... in the die hole 22...
・Insert in the direction of arrow A. The lead connection side end 11 is first wetted with the flux 25 in the die hole 22, and then
It penetrates into the molten solder 17. At this time, the connector terminals 9 may be inserted one by one, or a plurality of connector terminals 9 may be inserted using a jig (not shown) to correspond to the arrangement of the die holes 22 of the die plate 20. While maintaining...
You are free to insert them all at once.

Thereafter, the connector terminals 9... are pulled up from the die plate 20, cooled and solidified, and the
As shown in Figure 8), preliminary solder B can be applied to the single connector terminal 9. Next, as shown in the cross-sectional view of Fig. 23,
A plurality of connector terminals 9... are assembled into the connector case 3. This lead connection side end 11 in FIG. 23...
Next, the conductor 15 of the lead wire 14 is soldered H in the same manner as already described in FIGS. 19 and 20, and the soldering work is completed.

According to the embodiment described later, when there are many types of connectors with different numbers of connector terminals, connector terminals 9 as common parts are prepared in advance with pre-soldering B as individual parts, It has the advantage that it can be assembled in accordance with each type of connector.

As described above, in the present invention, the horizontal surface 18 of the molten solder 17 is brought into contact with the back surface of the die plate 20 having a plurality of die holes 22 . The bottom part is blinded by the surface 18 of the molten solder 17, and the flux 25 is injected into the die hole 22. Then, the connector terminal 9...the glue connection side end 11... is inserted into the die hole 22. ..., the end 11 penetrates into the molten solder 17, is immediately pulled up, cooled and solidified, and a preliminary solder B is applied to the end 11. For subsequent soldering H, use the tip 28a of the solder. It can be easily done just by pressing, and
Since the flux 2S adheres to the lead connection side end 11 both when it is inserted and when it is pulled out, the bonding force between the end 11 and the solder pre-soldered B is stable and large, and the lead wire The soldering H of the 14 conductors 15 also has a stable and large bonding force. In particular, the occurrence of the conventional solder bridge f shown in FIG. 2 can be reliably prevented. That is, the bridge r does not generate any heat because the diameter of the die hole 22 of the die plate 20 is regulated, and only the solder in that portion adheres, and no excess solder adheres.

Furthermore, no skill is required for the work, and the amount of solder in the preliminary solder layer B can be made into an appropriate amount and evenly distributed, greatly contributing to stabilizing and improving quality. Moreover, the equipment can be manufactured relatively inexpensively, and the effect of reducing man-hours is significant. In addition, the conventional automatic soldering iron device with a thread solder feeder has a somewhat complicated structure, and soldering is limited to one point, i! 1ff
It was also difficult to control solder (the amount would be smaller), but with the present invention, it is extremely easy to perform pre-soldering B for a large number of solders at the same time, and the handling of connector 2 can be done by a robot. This also made it possible to do all the work in one go.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a main part for explaining conventional soldering, and FIG. 2 is a front view for explaining problems of the conventional method. FIG. 3 is a partially cutaway perspective view showing an example of a shielded cable manufactured by the soldering method according to the present invention, FIG. 4 is a front view showing an example of a connector, and FIG. 5 is a side view.
6 to 20 are diagrams showing an embodiment of the present invention in the order of steps, in which FIG. 6 is a partial pressure surface view, FIG. 7 is a plan view,
Figure 8 is a cross-sectional front view, Figures 9 and 10 are cross-sectional front views,
11th B! ! 1 and 12 are sectional side views, Fig. 13 is a partially sectional front view, Fig. 14 is a partially sectional side view, Figs. 15 and 16 are sectional side views, and Fig. 17 is a principal part sectional view. , 18th
19 is a partially sectional front view, FIG. 20 is a partially sectional front view showing a completed soldering state, and FIG. 21 is a partially sectional front view showing another embodiment of the present invention. , FIG. 22 is a side view of the same essential part, FIG. 23 is a sectional side view of the same essential part, and FIG. 24 is a side view showing an example of the connector terminal 9. 9...Connector terminal, 11...Lead connection side end,
17... Molten solder, 18... Surface, 20... Die plate, 22... Die hole, 25... Flux. Patent Issuer Dainichi Nippon Electric Cable Co., Ltd. Figure 1 1
4 ( 21!1 J13 Figure 4 Figure 4 Figure 5 Figure 9 Figure 11 WJ Figure 10 Figure 12 Figure 211!1 23rd Kuni No. 22 Shinsaku 24 Takumi

Claims (1)

[Claims] 1. The back surface of a die plate having a plurality of die holes is brought into contact with the horizontal surface of the molten solder, the bottom of the die hole is blinded by the surface of the molten solder, and the die hole is After that, the lead connection side end of the connector terminal is inserted into the die hole, the end is penetrated into the molten solder, pulled out, cooled and solidified, and a preliminary solder is placed at the end. A method for soldering connector terminals, which comprises applying solder, then remelting the preliminary solder and soldering a conductor of a lead wire. 2. Arrange and fix a plurality of connector terminals in the connector case in advance, and use a die plate with a plurality of die holes penetrated in advance at positions corresponding to the arranged and fixed connector terminals, and - Claim 1 of applying preliminary solder to a plurality of connector terminals of a connector case at the same time
How to solder the connector terminals described in section. 3. Applying preliminary solder to the connector terminal as a single item, and then assembling the plurality of connector terminals with preliminary solder applied to the connector case.Claim 1
How to solder the connector terminals described in section.