JPS60227427A - Ｓｉｐ形部品のパツケ−ジング方法 - Google Patents

Ｓｉｐ形部品のパツケ−ジング方法

Info

Publication number
JPS60227427A
JPS60227427A JP59084532A JP8453284A JPS60227427A JP S60227427 A JPS60227427 A JP S60227427A JP 59084532 A JP59084532 A JP 59084532A JP 8453284 A JP8453284 A JP 8453284A JP S60227427 A JPS60227427 A JP S60227427A
Authority
JP
Japan
Prior art keywords
resin
terminal
parts
sip
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59084532A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0256811B2 (enExample
Inventor
Takayoshi Kokubu
国分　孝喜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59084532A priority Critical patent/JPS60227427A/ja
Publication of JPS60227427A publication Critical patent/JPS60227427A/ja
Publication of JPH0256811B2 publication Critical patent/JPH0256811B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59084532A 1984-04-26 1984-04-26 Ｓｉｐ形部品のパツケ−ジング方法 Granted JPS60227427A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59084532A JPS60227427A (ja) 1984-04-26 1984-04-26 Ｓｉｐ形部品のパツケ−ジング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59084532A JPS60227427A (ja) 1984-04-26 1984-04-26 Ｓｉｐ形部品のパツケ−ジング方法

Publications (2)

Publication Number Publication Date
JPS60227427A true JPS60227427A (ja) 1985-11-12
JPH0256811B2 JPH0256811B2 (enExample) 1990-12-03

Family

ID=13833247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59084532A Granted JPS60227427A (ja) 1984-04-26 1984-04-26 Ｓｉｐ形部品のパツケ−ジング方法

Country Status (1)

Country Link
JP (1) JPS60227427A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62174677U (enExample) * 1986-04-23 1987-11-06
KR20180123895A (ko) * 2017-05-10 2018-11-20 주식회사대일코팅씨오 자동차용 에어백 와이어하니스커넥터 보호캡 성형금형 및 이로부터 성형되는 보호캡
CN111863363A (zh) * 2020-06-03 2020-10-30 中科立民新材料（扬州）有限公司 一种高温热敏电阻的封装方法及其封装的电阻和应用

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62174677U (enExample) * 1986-04-23 1987-11-06
KR20180123895A (ko) * 2017-05-10 2018-11-20 주식회사대일코팅씨오 자동차용 에어백 와이어하니스커넥터 보호캡 성형금형 및 이로부터 성형되는 보호캡
CN111863363A (zh) * 2020-06-03 2020-10-30 中科立民新材料（扬州）有限公司 一种高温热敏电阻的封装方法及其封装的电阻和应用
CN111863363B (zh) * 2020-06-03 2023-02-17 中科立民新材料（扬州）有限公司 一种高温热敏电阻的封装方法及其封装的电阻和应用

Also Published As

Publication number Publication date
JPH0256811B2 (enExample) 1990-12-03

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