JPS6022445B2 - Laminated mica material and laminated mica prepreg material - Google Patents

Laminated mica material and laminated mica prepreg material

Info

Publication number
JPS6022445B2
JPS6022445B2 JP16384680A JP16384680A JPS6022445B2 JP S6022445 B2 JPS6022445 B2 JP S6022445B2 JP 16384680 A JP16384680 A JP 16384680A JP 16384680 A JP16384680 A JP 16384680A JP S6022445 B2 JPS6022445 B2 JP S6022445B2
Authority
JP
Japan
Prior art keywords
mica
weight
aspect ratio
particle size
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16384680A
Other languages
Japanese (ja)
Other versions
JPS5787009A (en
Inventor
秀次 桑島
武美 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP16384680A priority Critical patent/JPS6022445B2/en
Priority to DE3144006A priority patent/DE3144006C2/en
Priority to FR8120888A priority patent/FR2493828A1/en
Priority to CH7166/81A priority patent/CH652999A5/en
Publication of JPS5787009A publication Critical patent/JPS5787009A/en
Priority to US06/621,461 priority patent/US4576856A/en
Publication of JPS6022445B2 publication Critical patent/JPS6022445B2/en
Expired legal-status Critical Current

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  • Insulating Bodies (AREA)

Description

【発明の詳細な説明】 本発明は集成マィカ材料及び集成マィカプリプレグ材料
に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composite mica material and a composite mica prepreg material.

従来集成マィカとしては、マスコバィトを800℃付近
に加熱して膨積させ、ついで、これを水中で渡洋又はジ
ェット水流などにより粉砕して粒径が約0.2肋1.仇
吻程度の小さなマィカりん片にしたものをスラリーとし
て一般に抄紙用に使用される長網式抄造機で抄造したマ
ィカ箔し、わゆる焼成集成マイカが一般に使用され、こ
の他にはフロゴパィトを水中で粉砕して粒径が2肋程度
の小さなマィカりん片にしたものをスラリーとして一般
に抄紙用に使用される最網式抄造機で抄造したマィカ箔
し・わゆる軟費集成マィカが使用されていた。
Conventionally, laminated mica is produced by heating muscovite to around 800°C to swell it, and then crushing it in water by wading in water or using a jet stream to obtain a particle size of about 0.2 mm. Mica foil, which is made from slurry of mica flakes as small as a proboscis, using a fourdrinier machine commonly used for paper making, is commonly used as calcined laminated mica, and phlogopite is also used in water. The slurry is made by grinding mica flakes into small mica particles with a particle size of about 2 ribs, and is made into a mica foil using a reami-type paper machine, which is generally used for paper making. Ta.

焼成マィカを5〜IQ岬角に、工業的に薄く粉砕するこ
とは出来ず、また、焼成マィかまマィカの結晶水を放出
した際の微細なクラックがマィカりん片内に生じている
ため、マィカりん片の強度が低く、補強材としての効果
が小さく、かつ焼成集成マィカはマィカ箔の密度が1.
3〜1.雛/ふと低くマィカ箔中の空隙が多く、例えば
プリプレグ材料にするためには、多くの熱硬化性樹脂を
必要とし、その結果プリプレグ材料を加熱加圧成形して
得た製造中の熱硬化性樹脂分が多く機械的性質、電気特
性などが劣っていた。一方フロゴパィトはマスコバィト
に比べて耐熱性が少しすぐれてはいるものの電気特性が
劣るため、発電機などのような高電圧機器の絶縁用には
使用することができない。
It is not possible to industrially grind fired mica thinly into 5 to IQ cape angles, and fine cracks are generated within the mica flakes when the crystal water of fired mica is released. The strength of the piece is low, the effect as a reinforcing material is small, and the density of fired laminated mica foil is 1.
3-1. Hina/There are a lot of voids in the mica foil.For example, in order to make a prepreg material, a large amount of thermosetting resin is required. It contained a large amount of resin and had poor mechanical and electrical properties. On the other hand, although phlogopite has slightly better heat resistance than muscovite, its electrical properties are inferior, so it cannot be used for insulation in high-voltage equipment such as generators.

一方無焼成マィカを小さく粉砕したものは焼成集成マィ
カを小さく粉砕したものに比べて集成マィカ製品に加工
する際の熱硬化性樹脂組成物量を低下させることは可能
だが機械的性質や電気特性は、はがしマィカ製品に〈ら
べて不十分である。
On the other hand, unfired mica that has been crushed into smaller pieces can reduce the amount of thermosetting resin composition when processed into a laminated mica product compared to finely crushed fired laminated mica, but the mechanical and electrical properties are Insufficient compared to peelable mica products.

これらの欠点を解決するために、米国サマィカ社(U.
S.SAMICACorporation)によって、
マィカナィトロ(Micaniteo)なる無焼成集成
マィカが開発された。マィカナィト0‘ま、無焼成のマ
スコバィトフレークを超音波のエネルギーを使用して水
中で粉砕して得られたもので、その粒度分布を一般に使
用されている集成マィカの値とともに表1に示した。表
1 マィヵナィトU及び集成マィヵ (一般)の粒度分布 *1 表中の数字は重量百分率で示した。
In order to solve these shortcomings, U.S. Samica Corporation (U.S.
S. SAMICA Corporation),
An unfired laminated mica called Micaniteo has been developed. Micaite 0' is obtained by crushing unfired muscovite flakes in water using ultrasonic energy, and its particle size distribution is shown in Table 1 along with the values of commonly used aggregate mica. . Table 1 Particle size distribution of Micanaite U and aggregate mica (general) *1 The numbers in the table are expressed as weight percentages.

*2 出典,U.S.SAMICACorporati
onのカタログマィカナィトDは無焼成の集成マイカで
ありながら何ら熱硬化性樹脂組成物等を使用せずともそ
の引張り強さが0.7〜1.3k9f/地と強く、また
マィカ箔の密度も1.6〜1.7g/のと高くすぐれた
ものであるが、これには表1に示した粒度分布に起因す
る欠点がある。
*2 Source, U. S. SAMICA Corporation
on's catalog Mica Nite D is an unfired laminated mica, but it has a strong tensile strength of 0.7 to 1.3 k9f/ground without using any thermosetting resin composition. Although the density is high and excellent at 1.6 to 1.7 g/, it has a drawback due to the particle size distribution shown in Table 1.

マイカナイト川ま、大きなマイカりん片を使用している
のでマィカりん片による補強効果は大きく、これを加工
したマィカ製品の機械的性質は向上するが、反面、大き
なマィカりん片だけでは技密充てんできず、長期間の劣
化後では、その特性がなかでも電気特性がはがしマィカ
製品より劣るという欠点があった。はがしマィカ製品と
いうのは直径約5仇奴以上でかつ厚さ30〜50〃mに
人間の手ではがしたマイカ片で、その形状が大きいため
、集成マィカのごとく湿式の抄紙機で抄造することは出
来ず、手貼り又は半自動化これた機械で製造されている
Since Micaite Kawama uses large mica flakes, the reinforcing effect of the mica flakes is large, and the mechanical properties of mica products processed with this are improved, but on the other hand, large mica flakes alone cannot fill the technical details. However, after long-term deterioration, it had the disadvantage that its properties, especially its electrical properties, were inferior to those of peelable mica products. Peeled mica products are pieces of mica that are peeled off by hand and have a diameter of about 5 mm or more and a thickness of 30 to 50 m. Because of their large size, they must be made using a wet paper machine like laminated mica. It cannot be applied by hand or manufactured by semi-automated machines.

はがしマィカが高価であり、かつ機械化による大量生産
が困難であることから、はがしマィカ製品は集成マィカ
製品より高価である。はがしマィカ製品の特性は、従来
の集成マィカより大きなマィカ片を使用していため熱硬
化性樹脂組成物が劣化した後も大きいマィカ片が絶縁体
として働くため長期劣化後でもすぐれている。はがしマ
ィカ製品及び集成マィカ製品の両者の特長を生かすため
に両者を組み合わせて使用することが考案されている例
えば特開昭53−5050び号のごとく、はがしマィカ
材料両面に集成マィカ材料を貼り合わせたものは、はが
しマィカ製品より厚さの精度は向上するが、その特性は
、特に長期劣化後においては、はがしマィカ単独より低
く、両者のいずれよりもすぐれたものとはなりえなかっ
た。
Peelable mica products are more expensive than laminated mica products because peelable mica is expensive and difficult to mass produce through mechanization. Peelable mica products use larger mica pieces than conventional laminated mica, so even after the thermosetting resin composition has deteriorated, the large mica pieces act as an insulator, so they are excellent even after long-term deterioration. In order to take advantage of the features of both peel-off mica products and laminated mica products, it has been devised to use them in combination.For example, as in JP-A-53-5050, a laminated mica material is laminated on both sides of the peel-off mica material. Although the thickness accuracy of the peel-off mica product is better than that of the peel-off mica product, its properties are lower than peel-off mica alone, especially after long-term deterioration, and it cannot be superior to either of the two.

本発明はこれらの欠点を解決するものである。本発明は
、無焼成マィカを粉砕して得られた粒径1.7側以上で
アスペクト比が150以上のマィカりん片を2〜25重
量部、粒径1.仇奴以上1.7肋未満でかつアスペクト
比が150以上のマイカりん片を20〜6の重量部、粒
径0.25豚以上1.物吻未満でかつアスペクト比が1
00以上のマイカりん片を20〜40重量部及び粒径0
.25肋未満でかつアスペクト比が100以上のマイカ
りん片を10〜3の重量部含むスラリーを沙造して得ら
れる集成マィカを袋打材に接着してなる集成マィカ材料
ならびに無焼成マィカと粉砕して得られた粒径1.7脚
以上でアスペクト比が150以上のマィカりん片を2〜
25重量部、粒径1.0肋以上1.7肋未満でかつアス
ペクト比が150以上のマィカりん片を20〜6の重量
部、粒径0.25腿以上1.仇磁未満でかつアスペクト
比が100以上のマィカりん片を20〜4の重量部及び
粒登0.25肋未満でかつアスペクト比が100以上の
マィカりん片を10〜3の重量部含むスラリーを抄造し
て得られる集成マィカに熱硬化性樹脂組成物を含浸又は
塗工し必要に応じて髪打材と接着し、半硬化させた集成
マィカプリプレグ材料に関する。
The present invention overcomes these drawbacks. In the present invention, 2 to 25 parts by weight of mica flakes having a particle size of 1.7 or more and an aspect ratio of 150 or more obtained by crushing unfired mica are used. 20 to 6 parts by weight of mica lime chips with a size of more than 1.7 ribs and an aspect ratio of 150 or more, particle size of 0.25 or more 1. Less than the proboscis and the aspect ratio is 1
20 to 40 parts by weight of mica lime chips with a particle size of 0 or more and a particle size of 0
.. A laminated mica material obtained by adhering a laminated mica obtained by sanding a slurry containing 10 to 3 parts by weight of mica scale pieces having less than 25 ribs and an aspect ratio of 100 or more to bag batting material, and unfired mica and pulverization. Two or more pieces of mica lime with a grain size of 1.7 feet or more and an aspect ratio of 150 or more obtained by
25 parts by weight, 20 to 6 parts by weight of mica flakes with a particle size of 1.0 to 1.7 ribs and an aspect ratio of 150 or more, 1. A slurry containing 20 to 4 parts by weight of mica flakes having an aspect ratio of 100 or more and less than 0.25 grain size and 10 to 3 parts by weight of mica flakes having a grain size of less than 0.25 and an aspect ratio of 100 or more. The present invention relates to a mica pre-preg material obtained by impregnating or coating a thermosetting resin composition on mica obtained by paper-making, adhering it to a hair batting material as needed, and semi-curing it.

本発明におけるアスペクト比とは マイカりん片の直径 マィカりん片の厚さ であり、粒度分布を測定する方法は、標準分析ふるいを
使用して湿式で分級したのち乾燥後重量を測定して算出
した。
In the present invention, the aspect ratio refers to the diameter of the mica flakes and the thickness of the mica flakes, and the particle size distribution was calculated by wet classification using a standard analytical sieve and then measuring the weight after drying. .

無焼成マィカを本発明の粒度分布及びアスペクト比に粉
砕する粉砕方法としては、特公昭54−総9叫号、椿開
昭53−39班4号などの方法が採用される。
As a pulverizing method for pulverizing the unfired mica to the particle size distribution and aspect ratio of the present invention, methods such as those disclosed in Tokko 1984-So9 No. 9 and Tsubaki Kai 1983-39 Ban 4 are adopted.

これらの方法はアスペクト比が大きく、かつ望みの粒度
分布を容易に得られるすぐれた方法である。粒径1.7
肋以上でアスペクト比が150以上のマィカりん片の割
合が25重量部を越えるとマィカりん片の補強効果は大
きく機械的性質は向上するが、電機特性のバラッキ、な
かでも絶縁破壊電圧のばらつきが大きくなる。
These methods are excellent methods in which a large aspect ratio and a desired particle size distribution can be easily obtained. Particle size 1.7
If the proportion of mica flakes with an aspect ratio of 150 or more above the ribs exceeds 25 parts by weight, the reinforcing effect of the mica flakes will be large and the mechanical properties will improve, but there will be variations in electrical properties, especially variations in dielectric breakdown voltage. growing.

また2重量部禾満では機械的性質がはがしマィカを使用
したものより低くなる。
Furthermore, when the content is 2 parts by weight, the mechanical properties are lower than those using peelable mica.

また粒径1.7以上でアスペクト比が150未満のマィ
カりん片では機械的性質及び電気特性が低下する。
Furthermore, mica flakes having a particle size of 1.7 or more and an aspect ratio of less than 150 have poor mechanical properties and electrical properties.

また粒径1.仇肋以上1.7未満でかつアスペクト比が
150以上のマィカりん片が6項重量部を越えると絶縁
層の電気特性のばらつきを生じ、2の重量部未満ではマ
ィカりん片の補強効果が小さくなり、機械的性質を低下
させ、さらにアスペクト比が150未満では、熱硬化性
樹脂組成物を使用せずに抄造した無焼成集成マィカのシ
ート強さが低くなり無焼成集成マィカの取り扱いが困難
になる。
Also, the particle size is 1. If the amount of mica flakes with an aspect ratio of less than 1.7 and an aspect ratio of 150 or more exceeds 6 parts by weight, the electrical properties of the insulating layer will vary, and if it is less than 2 parts by weight, the reinforcing effect of the mica flakes will be small. Furthermore, if the aspect ratio is less than 150, the sheet strength of the unfired laminated mica made without using a thermosetting resin composition will be low, making it difficult to handle the unfired laminated mica. Become.

粒径1.仇岬禾満のマィカりん片のアスペクト比が10
0禾満では、熱硬化性樹脂組成物を使用せずに抄造した
無焼成集成マィカのシ−ト強さが低くなり、無焼成集成
マィカの取り扱いが困難になるとともに、電気特性なか
でも絶縁破壊電圧が低下する。粒径0.25肌以上1.
仇吻未満でかつアスペクト比が100以上のマィカりん
片が4広重量部を越えると機械的性質が低下し、またこ
れが2の重量部未満では電気特性なかでも絶縁破壊電圧
が低下する。0.25側未満でかつアスペクト比が10
0以上のマィカりん片が3の重量部を越えると機械的性
質が低下し、またこれが1の重量部禾満では電気特性な
かでも長期の劣化特性が低下するのみならず、マィカり
ん片の空隙を埋めるために熱硬化性樹脂組成物を多く必
要とする。
Particle size 1. The aspect ratio of the mica limestone of Keiman is 10.
At zero heat, the sheet strength of the unfired laminated mica made without using a thermosetting resin composition becomes low, making it difficult to handle the unfired laminated mica, and also causing dielectric breakdown among electrical properties. Voltage drops. Particle size 0.25 skin or more 1.
If the amount of mica flakes with an aspect ratio of 100 or more exceeds 4 parts by weight, the mechanical properties will deteriorate, and if it is less than 2 parts by weight, the electrical properties, especially the dielectric breakdown voltage, will decrease. Less than 0.25 side and aspect ratio is 10
If the amount of mica flakes exceeds 3 parts by weight, the mechanical properties will deteriorate, and if the content is 1 part by weight, not only will the long-term deterioration characteristics among electrical properties deteriorate, but also the voids in the mica flakes will deteriorate. A large amount of thermosetting resin composition is required to fill the area.

本発明にける裏打材としては、特に制限はなく例えばポ
リエステル,ポリアミド,ガラス等の有機材料または無
機材料の織布,不織布,フィルム等が必要ならば組み合
わせて用いられ、またこれらとガラスヤーン,ポリエス
テル繊維ャーン等を組み合わせても差支えない。
The backing material used in the present invention is not particularly limited, and woven fabrics, nonwoven fabrics, films, etc. made of organic or inorganic materials such as polyester, polyamide, glass, etc. may be used in combination if necessary, and these may be used in combination with glass yarn, polyester, etc. There is no problem in combining fiber yarn, etc.

熱硬化性樹脂組成物を含浸又は塗工する方法は、熱硬化
性樹脂組成物を加熱溶融し、もしくはメチルエチルケト
ン,アセトン,メタノールなどの溶剤に溶解し、これを
スプレーノズル,ブラシ塗工機などの一般の塗工機を使
用してなされるが特に制限しない。
The method of impregnating or coating a thermosetting resin composition is to melt the thermosetting resin composition by heating, or dissolve it in a solvent such as methyl ethyl ketone, acetone, or methanol, and apply it using a spray nozzle, brush coating machine, etc. Although it is done using a general coating machine, there is no particular restriction.

本発明における半硬化させた集成マィカプリプレグ材料
は、必要に応じて裏打材を備えるが、裏打材を有しなく
てもよい。
The semi-cured composite mica prepreg material of the present invention may be provided with a backing material if necessary, but may not have a backing material.

含浸又は塗工後の半硬化は通常の条件が採用され、特に
制限はない。
Normal conditions are used for semi-curing after impregnation or coating, and there are no particular restrictions.

無焼成マィカとは、焼成処理をしないマィカ及びスクラ
ップマイカ,カットマイカ等のマイカ中に含まれる紙,
木,繊維などの有機分をマィカ結晶水を脱水しない温度
(約600qo以下)からマィカ結晶水の1/a〆下を
脱水する温度範囲で、空気中で完全に燃焼除去したマィ
カをいう。
Unfired mica refers to mica that is not subjected to firing treatment, as well as paper contained in mica such as scrap mica and cut mica.
This refers to mica in which organic components such as wood and fibers have been completely removed by combustion in the air at a temperature that does not dehydrate mica crystal water (approximately 600 qo or less) to a temperature that dehydrates mica crystal water below 1/a.

無焼成マィカの代りに焼成マィカを使用したのでは機械
特性なかでも曲げ強さ、曲げ弾性率が大きく低下して望
ましくない。
If fired mica is used instead of unfired mica, mechanical properties such as bending strength and bending elastic modulus are undesirably reduced.

マィカりん片を集成マィカに抄造する方法は特に制限さ
れず、通常0.5〜2重量%のスラリーとしたのち、こ
れを長網式、丸絹式などの抄紙機を使用して行なわれる
There are no particular restrictions on the method for forming mica flakes into a composite mica, and the method is usually to form a slurry of 0.5 to 2% by weight, and then use a fourdrinier type, round silk type, or other paper machine.

本発明における熱硬化性樹脂組成物としては、硬化剤、
界面活性剤、溶剤、反応性溶剤などを含むェポキシ樹脂
組成物、不飽和ポリエステル樹脂組成物などが使用され
、特に制限はない。
The thermosetting resin composition in the present invention includes a curing agent,
Epoxy resin compositions, unsaturated polyester resin compositions, etc. containing surfactants, solvents, reactive solvents, etc. are used, and there are no particular limitations.

以下実施例により本発明を説明する。The present invention will be explained below with reference to Examples.

実施例 1 表2 * シート重量はいずれも20雌ノで ** 上記の集成マィカはマィカりん片を水に分散した
1重量%のマィカスラリ−を最網式抄紙機で抄造して得
た。
Example 1 Table 2 *All sheet weights were 20 mm.** The above mica assembly was obtained by making a 1% by weight mica slurry in which mica flakes were dispersed in water using a remesh paper machine.

表3 ェボキシ樹脂組成物 表2記載の集成マィカ1の60ooに加熱した表3記載
のェポキシ樹脂組成物を10咳/めで塗工し、かつガラ
スクロス日東紡績■製WE05(3鷺/〆)を菱打村と
して貼り合わせ、80午○で1時間加熱、半硬化させて
集成マイカプリプレグ材料とした。
Table 3: Epoxy resin composition The epoxy resin composition shown in Table 3 heated to 60 oo of laminated mica 1 shown in Table 2 was coated at 10 coats per second, and the glass cloth WE05 manufactured by Nitto Boseki ■ (3 herons/final) was coated. The pieces were bonded together as a sheet of rhombus, heated at 80 o'clock for 1 hour, and semi-cured to obtain a laminated mica prepreg material.

これを3仇舷幅のテープに切断したのち、9.5脚×3
6.5肌×長さ1000脇の導体(銅製)に半分重ね合
わせながら8回巻きつけたのち100℃に加熱して押し
つけ集成マィカプリプレグ材料中の上記ェポキシ樹脂組
成物を流しながら170qoに昇温して硬化させ(3時
間)厚さ3側の絶縁層を持ったコイルを製作した。コイ
ルは4本製作し、常態で2本、熱劣化試験(130qo
で1ぴ時間)後2本試験した。試験は松V/秒の昇温速
度で絶縁破壊電圧を測定し、次いで4点法曲げ試験(外
スパン550肋、内スパン25仇舷、試験速度5肋/分
)を行なった。絶縁層を60000で2時間加熱してェ
ポキシ樹脂組成物量を求めた。結果を平均値で表4に示
した。実施例 2 表2記載の集成マィカ2に60ooに加熱した表3記載
のェポキシ樹脂組成物を10雌塗工し、かつ、ガラスク
ロス(3酸/め)を菱打材として貼り合わせ8000で
1時間加熱、半硬化させて集成マイカプリプレグ材料と
した。
After cutting this into a tape of 3 broadside width, 9.5 legs x 3
6.5 skin x length 1000 Wrap it around the side conductor (made of copper) 8 times, overlapping half of it, heat it to 100 ° C., press it, and raise it to 170 qo while flowing the above epoxy resin composition in the laminated mica prepreg material. The coil was heated and cured (for 3 hours) to produce a coil with an insulating layer of thickness 3. Four coils were manufactured, two were tested under normal conditions, and a thermal deterioration test (130qo
After 1 hour), two tests were performed. In the test, the dielectric breakdown voltage was measured at a heating rate of V/sec, followed by a four-point bending test (outer span: 550 ribs, inner span: 25 bowers, test speed: 5 ribs/min). The insulating layer was heated at 60,000 for 2 hours to determine the amount of epoxy resin composition. The results are shown in Table 4 as average values. Example 2 Ten coats of the epoxy resin composition shown in Table 3 heated to 600° were applied to laminated mica 2 shown in Table 2, and glass cloth (3 acids/me) was laminated as a rhombus material and the mixture was heated to 8000°C. It was heated for a period of time and semi-cured to form a laminated mica prepreg material.

これを使用して実施例1記載の方法でコイルを4本製作
し、実施例1と同じ条件で測定して結果を平均値で表4
に示した。実施例 3 表2記載の集成マィカ3に60℃に加熱した表3記載の
ェポキシ樹脂組成物を10雌塗工し、かつガラスクロス
(3斑/枕)を裏打材として貼り合わせ8ぴ0で1時間
加熱、半硬化させて集成マィカプリプレグ材料とした。
Using this, four coils were manufactured using the method described in Example 1, and the results were measured under the same conditions as Example 1. The average values are shown in Table 4.
It was shown to. Example 3 Ten coats of the epoxy resin composition shown in Table 3 heated to 60°C were applied to Laminated Mica 3 shown in Table 2, and glass cloth (3 spots/pillow) was laminated as a backing material with 8 pins. It was heated for 1 hour and semi-cured to obtain a composite mica prepreg material.

これを使用して実施例1記載の方法でコイルを4本製作
し、実施例1と同じ条件で測定して結果を平均値で表4
に示した。比較例 1表2記載の集成マィカ4に60q
oに加熱した表3記載のェポキシ樹脂組成物を10雌塗
工し、かつガラスクロス(3薄/れ)髪打材として鮎り
合わせ、8ぴ0で1時間加熱、半硬化させてマィカプリ
プレグ材料とした。
Using this, four coils were manufactured using the method described in Example 1, and the results were measured under the same conditions as Example 1. The average values are shown in Table 4.
It was shown to. Comparative example 1 60q for laminated mica 4 listed in Table 2
10 coats of the epoxy resin composition listed in Table 3 heated to 800° C., mixed with glass cloth (3 thin/thin) as a hair dressing material, heated at 800° C. for 1 hour, semi-cured, and made into mica. It was made into a prepreg material.

これを使用して実施例1記載の方法でコイルを4本製作
し実施例1と同じ条件で測定して結果を平均値で表4に
示した。比較例 2 表2記載のシート5に6ぴ0に加熱した表3記載のヱポ
キシ樹脂組成物を10雌塗工し、かつガラスクロス(W
E05)(3髭/府)を裏打材として貼り合わせ800
0で1時間加熱、半硬化させてマィカプリプレグ材料と
した、これを使用して実施例1記載の方法でコイルを4
本製作し、実施例1と同じ条件で測定して結果を平均値
で表4に示した。
Using this, four coils were manufactured by the method described in Example 1 and measured under the same conditions as in Example 1, and the results are shown in Table 4 as average values. Comparative Example 2 Sheet 5 shown in Table 2 was coated with 10 coats of the epoxy resin composition shown in Table 3 heated to 60°C, and glass cloth (W
E05) (3beard/fu) is pasted as a backing material 800
0 for 1 hour and semi-cured to obtain a mica prepreg material. Using this material, 4 coils were made by the method described in Example 1.
This was manufactured and measured under the same conditions as in Example 1, and the results are shown in Table 4 as average values.

表4 コィルの特性実施例 4 表2記載の集成マィカーに6000に加熱した表3記載
のェポキシ樹脂組成物を2弦塗工し、かつガラスクロス
(WE05)(35g/〆)を髪打材として貼り合わせ
80ooで1粉劫0熱、半硬化させて集成マィカ材料と
した。
Table 4 Coil characteristics Example 4 Two strings of the epoxy resin composition shown in Table 3 heated to 6000 were applied to the assembled mica shown in Table 2, and glass cloth (WE05) (35 g/〆) was used as a hair dressing material. They were laminated together at 80 mils and semi-cured at 0 heat for 1 minute to form a laminated mica material.

これを3仇岬幅のテープに切断したのち、9.5肌×3
6.5柳×長さ1,000肌の導体(銅製)に半分重ね
合わせながら8回巻きつけたのちテーピングした部分を
厚さ3欄まで加圧成形した。この白コイルを真空容器中
で1×10−2肋Hgの圧力で30分間脱気し引き続き
80qoに加熱した表3記載のェポキシ樹脂組成物を注
入して、白コイルを浸潰させた。浸債さてた状態で真空
容器を常圧にし1時間後、白コイルを取り出し、170
℃で3時間硬化させ、厚さ3帆の絶縁層を持ったコイル
を製作した。コイルは4本製作し、実施例1と同じ条件
で測定して結果を平均値で表5に示した。実施例 5 表2記載の集成マィカ2を実施例4と同条件で集成マィ
カに加工した。
After cutting this into a tape with a width of 3 cm, 9.5 skin x 3
It was wrapped around a 6.5 willow x 1,000 skin conductor (made of copper) 8 times, half overlapping, and then the taped part was pressure molded to a thickness of 3 columns. This white coil was degassed in a vacuum container at a pressure of 1 x 10-2 Hg for 30 minutes, and then the epoxy resin composition shown in Table 3 heated to 80 qo was injected to immerse the white coil. After 1 hour, the vacuum container was brought to normal pressure with the bond still in place, and the white coil was removed and heated to 170℃.
It was cured at ℃ for 3 hours to produce a coil with an insulating layer 3 times thick. Four coils were manufactured and measured under the same conditions as in Example 1, and the results are shown in Table 5 as average values. Example 5 Mica laminated 2 shown in Table 2 was processed into mica laminated under the same conditions as in Example 4.

実施例4と同条件でコイルを4本製作し実施例1と同じ
条件で測定して結果を平均値で表5に示した。
Four coils were manufactured under the same conditions as in Example 4 and measured under the same conditions as in Example 1, and the results are shown in Table 5 as average values.

比較例 3 表2記載の集成マィカ4を実施例4と同条件で集成マィ
カに加工した。
Comparative Example 3 Mica laminated 4 shown in Table 2 was processed into mica laminated under the same conditions as in Example 4.

実施例4と同条件でコイルを4本製作し、実施例1と同
じ条件で測定して結果を平均値で表5に示した。
Four coils were manufactured under the same conditions as in Example 4 and measured under the same conditions as in Example 1, and the results are shown in Table 5 as average values.

表5 コィルの特性 1側未満のマィカりん片を含まないものは電気特性が低
く、さらに長時間の熱劣化により電気特性の低下が著し
く、また1.7風以上のマィカりん片を含まないものは
機械的性質が低くて従来の焼成集成マィカを使用したも
のを大幅に上廻ることは出来ない。
Table 5 Characteristics of coils Coils that do not contain mica particles with a wind strength of less than 1 have poor electrical properties, and furthermore, their electrical properties deteriorate significantly due to long-term thermal deterioration. has poor mechanical properties and cannot significantly exceed those using conventional fired laminated mica.

Claims (1)

【特許請求の範囲】 1 無焼成マイカを粉砕して得られた粒径1.7mm以
上でアスペクト比が150以上のマイカりん片を2〜2
5重量部、粒径1.0mm以上で1.7mm未満でかつ
アスペクト比が150以上のマイカりん片を20〜60
重量部、粒径0.25mm以上1.0mm未満でかつア
スペクト比が100以上のマイカりん片を20〜40重
量部及び粒径0.25mm未満でかつアスペクト比が1
00以上のマイカりん片を10〜30重量部含むスラリ
ーを抄造して得られる集成マイカを裏打材に接着してな
る集成マイカ材料。 2 無焼成マイカを粉砕して得られた粒径1.7mm以
上でアスペクト比が150以上のマイカりん片を2〜2
5重量部、粒径1.0mm以上1.7mm未満でかつア
スペクト比が150以上のマイカりん片を20〜60重
量部、粒径0.25mm以上1.0mm未満でかつアス
ペクト比が100以上のマイカりん片を20〜40重量
部及び粒径0.25mm未満でかつアスペクト比が10
0以上のマイカりん片を10〜30重量部含むスラリー
を抄造して得られる集成マイカに熱硬化性樹脂組成物を
含浸又は塗工し必要に応じて裏打材と接着し、半硬化さ
せた集成マイカプリプレグ材料。
[Claims] 1. 2 to 2 pieces of mica flakes with a particle size of 1.7 mm or more and an aspect ratio of 150 or more obtained by crushing uncalcined mica.
5 parts by weight, 20 to 60 mica flakes with a particle size of 1.0 mm or more but less than 1.7 mm and an aspect ratio of 150 or more.
20 to 40 parts by weight of mica flakes with a particle size of 0.25 mm or more and less than 1.0 mm and an aspect ratio of 100 or more and a particle size of less than 0.25 mm and an aspect ratio of 1.
A laminated mica material obtained by bonding laminated mica obtained by paper-making a slurry containing 10 to 30 parts by weight of mica scale pieces of 0.00 or more to a backing material. 2. 2 to 2 pieces of mica flakes with a particle size of 1.7 mm or more and an aspect ratio of 150 or more obtained by crushing unfired mica.
5 parts by weight, 20 to 60 parts by weight of mica flakes with a particle size of 1.0 mm or more and less than 1.7 mm and an aspect ratio of 150 or more, and 20 to 60 parts by weight of mica flakes with a particle size of 0.25 mm or more and less than 1.0 mm and an aspect ratio of 100 or more. 20 to 40 parts by weight of mica flakes with a particle size of less than 0.25 mm and an aspect ratio of 10
A composite mica obtained by paper-making a slurry containing 10 to 30 parts by weight of 0 or more mica scale pieces, impregnated or coated with a thermosetting resin composition, adhered to a backing material as necessary, and semi-cured. Mica prepreg material.
JP16384680A 1980-11-08 1980-11-19 Laminated mica material and laminated mica prepreg material Expired JPS6022445B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP16384680A JPS6022445B2 (en) 1980-11-19 1980-11-19 Laminated mica material and laminated mica prepreg material
DE3144006A DE3144006C2 (en) 1980-11-08 1981-11-05 Electrically insulating mica tape and its use
FR8120888A FR2493828A1 (en) 1980-11-08 1981-11-06 MATERIALS IN MICA RECONSTITUTED, MATERIALS PRE-IMPREGNATED IN MICA RECONSTITUTED, PRODUCTS IN MICA RECONSTITUTED AND ISOLATED WINDINGS
CH7166/81A CH652999A5 (en) 1980-11-08 1981-11-09 METHOD FOR PRODUCING RECONSTRUCTED MICA MATERIALS, RECONSTITUTED Mica PREPREG MATERIALS AND RECONSTITUTED Mica Products and Use of the Mica Material.
US06/621,461 US4576856A (en) 1980-11-19 1984-06-18 Reconstituted mica materials, reconstituted mica prepreg materials, reconstituted mica products and insulated coils

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16384680A JPS6022445B2 (en) 1980-11-19 1980-11-19 Laminated mica material and laminated mica prepreg material

Publications (2)

Publication Number Publication Date
JPS5787009A JPS5787009A (en) 1982-05-31
JPS6022445B2 true JPS6022445B2 (en) 1985-06-01

Family

ID=15781861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16384680A Expired JPS6022445B2 (en) 1980-11-08 1980-11-19 Laminated mica material and laminated mica prepreg material

Country Status (1)

Country Link
JP (1) JPS6022445B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62151338A (en) * 1985-12-25 1987-07-06 リグナイト株式会社 Mica sheet and manufacture thereof
JPS62151337A (en) * 1985-12-25 1987-07-06 リグナイト株式会社 Printed wiring substrate and manufacture thereof
JPS62151336A (en) * 1985-12-25 1987-07-06 リグナイト株式会社 Electric insulating board and manufacture thereof
CN102969097A (en) * 2012-12-04 2013-03-13 湖北平安电工材料有限公司 Manufacturing method of mica plate
WO2017175397A1 (en) * 2016-04-08 2017-10-12 日立化成株式会社 Mica tape, cured product of mica tape, and insulating material

Also Published As

Publication number Publication date
JPS5787009A (en) 1982-05-31

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