JPS6022443B2 - insulation material - Google Patents

insulation material

Info

Publication number
JPS6022443B2
JPS6022443B2 JP57055156A JP5515682A JPS6022443B2 JP S6022443 B2 JPS6022443 B2 JP S6022443B2 JP 57055156 A JP57055156 A JP 57055156A JP 5515682 A JP5515682 A JP 5515682A JP S6022443 B2 JPS6022443 B2 JP S6022443B2
Authority
JP
Japan
Prior art keywords
layer
laminate
printed
conductor
coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57055156A
Other languages
Japanese (ja)
Other versions
JPS58172803A (en
Inventor
稔 高谷
淳二 新原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP57055156A priority Critical patent/JPS6022443B2/en
Publication of JPS58172803A publication Critical patent/JPS58172803A/en
Publication of JPS6022443B2 publication Critical patent/JPS6022443B2/en
Expired legal-status Critical Current

Links

Description

【発明の詳細な説明】 本発明は絶縁材料に関し、特にLC複合部品のコンデン
サ用議電体材料及び空芯コイル用基体材料として好適な
絶縁材料に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an insulating material, and particularly to an insulating material suitable as a capacitor electrode material and an air-core coil base material of LC composite parts.

近年電子機器の部品を正確に組込むために自動部品挿入
機が使用されている。
In recent years, automatic component insertion machines have been used to accurately assemble components of electronic devices.

この自動部品挿入機に使用される部品としてはチップ部
品が好適であり、このために各種チップ部品が提供され
、特に抵抗やコンデンサ等が多く提供されている。最近
コイルLとコンデンサCを複合化してモノリシック構造
としたLC複合部品が各種提案されている。なかでも実
開昭57−29131号公報、実関昭57−12813
3号公報には印刷技述を応用して磁性体層及びコイル形
成用導体を交互に印刷積属してコイル部分を作り、この
積層体上に、あるいはこれとは別個に、譲母体層及び電
極形成用の導体を交互に印刷積層し、これらコイル用積
層体及びコンデンサ用積層体を童畳した状態で高温焼成
して一体化しLC複合部品を構成することが提案されて
いる。その1例は、第1図に示すように、Ti02や母
Ti03などの誘電体粉末のペーストを印刷法により適
当な剥離性基板(図示省略)上に印刷して誘電体層1を
形成し、その上にAg,Ag−Pd,Pd等の金属粉末
のペーストを印刷法によりこの譲電体層1上に印刷して
電極2を形成し、更にその上に誘電体層3を印刷し(図
面では構成をわかり易くするために分解して示してある
)、この譲軍体層3上に他の電極4を形成する。
Chip components are suitable as the components used in this automatic component insertion machine, and various chip components are provided for this purpose, with resistors, capacitors, and the like in particular being provided in large numbers. Recently, various LC composite parts have been proposed that have a monolithic structure in which a coil L and a capacitor C are combined. Among them, Utility Model Publication No. 57-29131, Utility Model Publication No. 57-12813
In Publication No. 3, a coil portion is created by printing and laminating magnetic layers and coil-forming conductors alternately by applying printing techniques, and a concessionary layer and an electrode are placed on this laminate or separately. It has been proposed to form an LC composite component by alternately printing and laminating forming conductors, and then baking the coil laminate and capacitor laminate in a folded state at a high temperature to integrate them. In one example, as shown in FIG. 1, a dielectric layer 1 is formed by printing a paste of dielectric powder such as Ti02 or mother Ti03 on a suitable removable substrate (not shown) by a printing method. On top of that, a paste of metal powder such as Ag, Ag-Pd, Pd, etc. is printed on this current transfer layer 1 by a printing method to form an electrode 2, and then a dielectric layer 3 is printed on top of this (see the drawings). (The structure is shown exploded to make it easier to understand), and another electrode 4 is formed on this transfer body layer 3.

そしてこの電極4上にガラス粉末やフェライト一誘電体
粉末混合物のペーストによる中間層5を印刷形成し、そ
の上に今度は透磁性磁性フェライト粉末のペーストによ
る磁性体層6を印刷し、さらに上記の金属粉末と同様な
粉末のペーストによりコイル形成用導体7を印刷し、導
体7の一部をマスクする磁性体層8を印刷し、さらに導
体7に接続する導体9を印刷する。以下同様にして磁性
体層10,導体11,磁性体層12,導体13,磁性体
層14及び導体15を印刷し、最後に磁性体層16を積
層する。このようにして得た積層体を高温焼成して一体
暁結体に変換し、第2図に示す如く、両端の導体露出端
に適当な外部端子(銀ペースト等)17,18を暁付け
てLC複合部品を完成する。
Then, on this electrode 4, an intermediate layer 5 made of a paste of glass powder or a ferrite-dielectric powder mixture is printed, and on top of that, a magnetic layer 6 made of a paste of permeable magnetic ferrite powder is printed, and then the above-mentioned A coil-forming conductor 7 is printed using a powder paste similar to metal powder, a magnetic layer 8 that masks a part of the conductor 7 is printed, and a conductor 9 to be connected to the conductor 7 is printed. Thereafter, magnetic layer 10, conductor 11, magnetic layer 12, conductor 13, magnetic layer 14, and conductor 15 are printed in the same manner, and finally, magnetic layer 16 is laminated. The thus obtained laminate is fired at a high temperature to convert it into an integrated solid body, and as shown in FIG. Complete the LC composite part.

このときその等価回路は第3図に示す如きものとなる。
上記の場合において、中間層5の在存は次の理由による
。すなわちコンデンサ用積層体を礎成している謙雷体層
1,3はTj02,や母Ti03により構成され、また
コイル用積層体を構成している磁性体層6,8,10,
12,14,16等は透磁性磁性フェライトにより構成
されているため、これらの誘電体層と磁性体層は熱膨脹
係数が異なる。したがってこれらの誘電体層と磁性体層
をそのまま単純に積層すれば、嫌結後の冷却時において
収縮率が異なるため割れやソリが発生して不良部品とな
り易い。それ故、これらの中間程度の熱膨脹係数を有す
る中間層5を介在させることが必要となる。このような
構造の複合部品は機械的に強く、小型であり、また形状
が単純なためにプリ,ント基板への直付け作業が簡単で
この作業を自動化でき、また多数の同一部品を並列的に
同時印刷で製造できるので、大量生産に適するなどの利
点を有するけれども、コンデンサ用積層体部分とコイル
用積層体部分との熱収縮の差があるために、中間層を介
在させても熱応力による歪みや割れ、特性変動などがあ
り、適切な中間層を得ることができないという欠点があ
る。
At this time, the equivalent circuit becomes as shown in FIG.
In the above case, the existence of the intermediate layer 5 is due to the following reason. That is, the magnetic layers 1 and 3 forming the foundation of the capacitor laminate are composed of Tj02 and mother Ti03, and the magnetic layers 6, 8, 10, forming the coil laminate are composed of Tj02 and mother Ti03.
Since the layers 12, 14, 16, etc. are made of permeable magnetic ferrite, these dielectric layers and magnetic layers have different coefficients of thermal expansion. Therefore, if these dielectric layers and magnetic layers are simply laminated as they are, the shrinkage rates will be different during cooling after solidification, so cracks and warpage will likely occur, resulting in defective parts. Therefore, it is necessary to interpose an intermediate layer 5 having a coefficient of thermal expansion intermediate between these. Composite parts with this structure are mechanically strong, small, and have a simple shape, making it easy to attach directly to a printed circuit board and automate this process. Although it has the advantage of being suitable for mass production because it can be manufactured by simultaneous printing, there is a difference in thermal shrinkage between the capacitor laminate part and the coil laminate part, so even if an intermediate layer is used, thermal stress may occur. There are distortions, cracks, and characteristic fluctuations due to this, and the disadvantage is that it is not possible to obtain a suitable intermediate layer.

ところで第3図のよな回路構成の複合部品は、周波数が
80〜11.0MH2帯城でトラップ等に使用する場合
にはL≠1仏日以上が得られれば充分である。
By the way, when a composite component having a circuit configuration as shown in FIG. 3 is used for a trap or the like at a frequency of 80 to 11.0 MH2, it is sufficient to obtain L≠1 or more.

本発明者はこのような目的に使用されるしC複合部品が
、L部分に磁性体層を用いなくとも充分に実現できるこ
とを見出した。そしてすべての絶縁体層(L部分及びC
部分ともに)を同一の暁給性非磁性材料より機成された
積層型LC複合部品を開発してこれを待顔昭57一機6
6号(特関昭斑−145114号公報参照)として出願
した。これによればL部分とC部分をともに同一の絶縁
体層を使用したので、前記コンデンサ用積層体部分とコ
イル用積層体部分との熱収縮率の差により存在した問題
点を改善することができた。しかしながらこの場合では
絶縁体層として通常の競結セラミック等の材料を使用し
たので、その焼成温度が1200oo〜1400qoと
非常に高くそのためコンデンサ部分の内部電極やコイル
部分の導体に高価なPdを使用しなければならないとい
う問題点が存在した。
The present inventor has discovered that a C composite component used for such purposes can be sufficiently realized without using a magnetic layer in the L portion. and all insulator layers (L part and C
Developed a laminated LC composite part made of the same non-magnetic material (both parts) and used it as a 57-1 machine 6.
The application was filed as No. 6 (Refer to Tokusekki Shobara Publication No. 145114). According to this, since the same insulating layer is used for both the L part and the C part, it is possible to improve the problem that existed due to the difference in thermal shrinkage rate between the capacitor laminate part and the coil laminate part. did it. However, in this case, since a material such as ordinary competitive ceramic was used for the insulator layer, the firing temperature was extremely high at 1200 oo to 1400 qo, so expensive Pd was used for the internal electrodes of the capacitor part and the conductor of the coil part. There was a problem that it had to be done.

したがって本発明は、このような問題を改善するために
、LC複合部品のィンダクタンス部分とコンデンサ部分
に共通に使用できるとともに、その焼成温度が低い積層
コンデンサ用及びコイルの絶縁材料を提供することを目
的とする。
Therefore, in order to improve such problems, the present invention aims to provide an insulating material for laminated capacitors and coils that can be commonly used for the inductance part and capacitor part of LC composite parts and has a low firing temperature. purpose.

そしてこの目的を達成するために本発明者は研究の結果
、Si02,Aそ2Q,Ca○等を含有する結晶化ガラ
スにNi−Cu−Zn系フェライトを1owt%以下含
有する組成物で積層コンデンサ用の誘電体とコイル用の
基本を構成すればよいことを見出した。
In order to achieve this objective, the present inventor has conducted research and has developed a multilayer capacitor using a composition containing 1wt% or less of Ni-Cu-Zn ferrite in crystallized glass containing SiO2, ASO2Q, Ca○, etc. We discovered that all we need to do is to configure the dielectric material and the basics for the coil.

以下本発明の一実施例を第4図〜第8図にもとづき説明
する。
An embodiment of the present invention will be described below based on FIGS. 4 to 8.

まず結晶化ガラスの出発材料としてSi02:Aそ20
3:Ca0を約3:1:2の重量比で調合し、これにT
i02,Zno,&03,Mぬ等を適量含有させ、一度
ガラス化したものを微粉砕する。
First, Si02:Aso20 is used as a starting material for crystallized glass.
3: Ca0 was prepared in a weight ratio of approximately 3:1:2, and T
A suitable amount of i02, Zno, &03, Mnu, etc. is contained, and once vitrified, it is finely pulverized.

それからこの粉末にフェライト材料(例えばFe203
を50モル%にNi○−COO−Zn0をモル比で約2
:1:2混合したものを仮蛾,粉砕したもの)を加えて
純水中で約1曲時間湿式混合し、脱水乾燥し、適度のバ
インダーと溶剤を入れてペースト化した。このとき試料
として結晶化ガラスとフェライトとの組成比が最終的に
第1表に示す状態になるように各材第1表 料を秤量した。
This powder is then added to a ferrite material (e.g. Fe203).
to 50 mol% and Ni○-COO-Zn0 at a molar ratio of about 2
A 1:2 mixture was added with a pulverized product) and wet-mixed in pure water for about 1 hour, dehydrated and dried, and an appropriate amount of binder and solvent were added to form a paste. At this time, the first surface material of each material was weighed as a sample so that the composition ratio of crystallized glass and ferrite was finally in the state shown in Table 1.

そしてこのよにして得られた材料により構成した絶縁体
ペーストにより、第4図における絶縁体層21を、例え
ばスクリーン印刷法により剥離性シート(図示省略)の
面に印刷して形成する。この上にAgの導電ペーストに
より電極22を印刷するが「 このとき電極22の一端
T,は絶縁体層21の左辺に露出させる。その上に同じ
絶縁体ペーストを印刷して絶縁体層23を形成しその上
に積層体の右辺に露出する端部T2を有する電極24を
印刷する。所望ならばこのコンデンサ部分の印刷工程は
必要な積層数が得られるまでさらに行うことができる。
次いで上記積層体の上にさらに絶縁体26を印刷形成し
、その上にコイル形成用の線状導体27を導電ペースト
により印刷する。
Then, the insulating layer 21 shown in FIG. 4 is formed by printing the insulating paste made of the material thus obtained on the surface of a removable sheet (not shown) by, for example, screen printing. On top of this, an electrode 22 is printed using Ag conductive paste, but at this time, one end T of the electrode 22 is exposed on the left side of the insulating layer 21.The same insulating paste is printed on top of this to form an insulating layer 23. An electrode 24 is formed and printed thereon, with the end T2 exposed on the right side of the stack. If desired, the printing process of this capacitor section can be carried out further until the required number of stacks is obtained.
Next, an insulator 26 is further printed on the laminate, and a linear conductor 27 for forming a coil is printed thereon using a conductive paste.

その際、導体27の末端T3は積層体の左辺に露出させ
る。それから今度は導体27の右端を覆わない程度の絶
縁体層28を積層体の左側に寄せて印刷し、その上に線
状導体27の端部と重なる端部を有するように線状導体
29を印刷する。図示点線は相互に接続されることを図
式的に示す。以下同様にして絶縁体層30,線状導体3
1,絶縁体層32,線状導体33を順次印刷形成する。
この工程もまた所望の積層数が得られるまで行うことが
できる。そしてこの積層体の上にさらに絶縁体層34を
印刷し、また導体を線状導体35の印刷により積層体の
右辺端部T4に引き出す。最後に表面層となる絶縁体層
36を印刷して積層工程を終了する。このようにして得
られた積層体を焼成炉に袋入して、これを約800〜9
00oCで約2時間焼成を行って積層体を一体的に焼成
体とし、必要ならば追加の熱処理を行い、ひづみ等を除
去し、特性を整える。かくして得た積層体を個々に切断
して1個のLC複合部品の素体とし、そのコンデンサ部
分のみと、ィンダクタンス部分のみに電極を形成してテ
ストサンプルを得、その電気的特性を測定して第7図,
第8図に示す如き結果を得た。
At this time, the terminal end T3 of the conductor 27 is exposed on the left side of the laminate. Next, an insulating layer 28 is printed on the left side of the laminate to the extent that it does not cover the right end of the conductor 27, and a linear conductor 29 is placed on top of it so that the end overlaps with the end of the linear conductor 27. Print. The illustrated dotted lines schematically indicate that they are interconnected. Thereafter, in the same manner, the insulator layer 30 and the linear conductor 3 are
1. The insulator layer 32 and the linear conductor 33 are sequentially formed by printing.
This step can also be repeated until the desired number of laminated layers is obtained. Then, an insulator layer 34 is further printed on this laminate, and a conductor is drawn out to the right end T4 of the laminate by printing a linear conductor 35. Finally, an insulator layer 36 serving as a surface layer is printed to complete the lamination process. The laminate thus obtained is placed in a bag in a firing furnace, and is heated to approximately 800 to 900 ml.
Firing is performed at 00oC for about 2 hours to make the laminate into an integrally fired body, and if necessary, additional heat treatment is performed to remove distortions and adjust the characteristics. The thus obtained laminate was individually cut to form a single LC composite component element, and electrodes were formed only on the capacitor portion and the inductance portion to obtain a test sample, and its electrical characteristics were measured. Figure 7,
The results shown in FIG. 8 were obtained.

なお第7図,第8図のものは860つ○で2時間焼成し
た例を示す。勿論この素体に、第5図に示す如く外部端
子37,38を設ければ、第6図の電気回路を有するL
C複合部品となる。この第7図によればそのコンデンサ
部分は周波数の広い変化にもかかわらず誘電体損失ta
n8(%)はフェライトが1〜1びれ%の範囲では略一
定であり、また譲軍率ごsも、これまた11〜13の範
囲で、第1表の(i)〜仙に応じてわずかの差があるも
のの周波数の広い変化にもかかわらずこれまた略一定で
あることがわかる。
Note that FIGS. 7 and 8 show examples of firing at 860 ○ for 2 hours. Of course, if this element body is provided with external terminals 37 and 38 as shown in FIG. 5, an L having the electric circuit shown in FIG.
C It becomes a composite part. According to Fig. 7, the capacitor part has a dielectric loss ta despite wide frequency changes.
n8 (%) is almost constant in the range of 1% to 1% ferrite, and the concession rate is also in the range of 11 to 13, and varies slightly depending on (i) to 1% in Table 1. It can be seen that although there is a difference in frequency, this is also approximately constant despite wide changes in frequency.

また第8図にそのィンダクタンス部分の特性を示してい
る。このィンダクタンス部分は、第1表仙のものを86
ぴ0で2時間焼成した例であり、長さ3.2豚,幅2,
5肋の導体を厚みが2.2職の絶縁体層により巻数1乳
ums積層してコイルとしたものであり、そのィンダク
タンス値は第8図のLで示す如く、周波数を29M日2
〜79MH2で変化しても、その値は略一定である。ま
たそのコイルのQの値も、周波数の増加につれて直線状
にゆるやかに増加し、実用上すぐれたものとなることが
わかる。また、本発明の絶縁材料は、従釆のTi02系
,やBaTi03系セラミック材料が1200qo〜1
40000で焼成しなければならなかったのに対して8
00〜900℃の低い温度で焼成することができる。
Further, FIG. 8 shows the characteristics of the inductance portion. This inductance part is 86
This is an example of baking for 2 hours at Pi 0, length 3.2 pigs, width 2,
A 5-rib conductor is laminated with an insulator layer having a thickness of 2.2 m and a turn of 1 um to form a coil, and its inductance value is as shown by L in Figure 8, at a frequency of 29 m/day 2.
Even if it changes from ~79MH2, the value remains approximately constant. It can also be seen that the Q value of the coil increases linearly and gently as the frequency increases, making it practically excellent. Further, in the insulating material of the present invention, the secondary Ti02-based or BaTi03-based ceramic material has a content of 1200 qo to 1
8 whereas it had to be fired at 40,000
It can be fired at a low temperature of 00 to 900°C.

そのために内部電極も高価なPdを使用する必要なく、
Pdよりも安価で、しかも抵抗値の低いAgを使用する
ことが可能になる。その結果、外部端子を設けて複合部
品を構成すれば、コストダウンができるのみならず、特
性のよいものを提供することができる。しかもフェライ
トの添加のために白色のガラスの着色も可能(Fe3十
:黄色)となり、汚れが目立ちすぎるという欠点もあわ
せて解消できる。なおフェライト含有率がIM%以下の
ものの電気的特性は、第7図のものとほとんど変らない
Therefore, there is no need to use expensive Pd for the internal electrodes.
It becomes possible to use Ag, which is cheaper than Pd and has a lower resistance value. As a result, by configuring a composite component by providing external terminals, it is possible not only to reduce costs but also to provide a component with good characteristics. Furthermore, the addition of ferrite makes it possible to color white glass (Fe30: yellow), which also eliminates the drawback of conspicuous stains. Incidentally, the electrical characteristics of those with a ferrite content of IM% or less are almost the same as those of FIG. 7.

しかしlwt%未満のものでは色がかなり薄くなり汚れ
が目立つ。したがってこの汚れの目立ちが気にならなけ
れば、実用上IM%未満でも差支えはない。そしてフェ
ライト含有率がloWt%以上では、フェライトの収縮
率が結晶化ガラスの収縮率より3%以上も小さいために
穴も多くなり、強度も弱くなり、誘電体としては使用で
きない状態となる。
However, if it is less than lwt%, the color becomes quite pale and stains become noticeable. Therefore, if the conspicuousness of this stain is not a concern, there is no problem in practical use with less than IM%. If the ferrite content exceeds loWt%, the shrinkage rate of ferrite is 3% or more smaller than that of crystallized glass, resulting in more holes and weakening strength, making it unusable as a dielectric.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従釆のLC複合部品の製造例を示す斜視図、第
2図は同部品の断面図、第3図はその回路図、第4図は
本発明の絶縁材料を使用したLC複合部品の説明図、第
5図は同部品の断面図、第6図はその回路図、第7図及
び第8図は本発明の絶縁材料の特性図である。 1,3・・・・・・誘電体層、2,4・・・・・・電極
、5・・・・・・中間層、6,8,10,12,14,
16…・・・磁性体層、17,18・・・・・・外部端
子、21,23,26,28,30,32,34,36
・・・・・・絶縁体層、22,24・・・・・・電極、
27,29,31,33,35・・・・・・線状導体、
37,38・・…・外部端子。 第1図第2図 第3図 第4図 第5図 第6図 第7図 第8図
Fig. 1 is a perspective view showing an example of manufacturing a subordinate LC composite part, Fig. 2 is a sectional view of the same part, Fig. 3 is its circuit diagram, and Fig. 4 is an LC composite part using the insulating material of the present invention. FIG. 5 is a sectional view of the component, FIG. 6 is a circuit diagram thereof, and FIGS. 7 and 8 are characteristic diagrams of the insulating material of the present invention. 1, 3... Dielectric layer, 2, 4... Electrode, 5... Intermediate layer, 6, 8, 10, 12, 14,
16... Magnetic layer, 17, 18... External terminal, 21, 23, 26, 28, 30, 32, 34, 36
...Insulator layer, 22, 24... Electrode,
27, 29, 31, 33, 35... linear conductor,
37, 38...external terminals. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8

Claims (1)

【特許請求の範囲】 1 SiO_2,Al_2O_3,CaO等を含有する
結晶化ガラスにNi−Cu−Zn系フエライトを10w
t%以下の量含有させたことを特徴とするコンデンサ用
誘電体材料及び空芯コイル用基体材料として使用する絶
縁材料。 2 前記Ni−Cu−Zn系フエライトが1〜10wt
%含有されていることを特徴とする特許請求の範囲第1
項記載のコンデンサ用誘電体材料及空芯コイル用基体材
料として使用する絶縁材料。
[Claims] 1. 10W of Ni-Cu-Zn-based ferrite is added to crystallized glass containing SiO_2, Al_2O_3, CaO, etc.
An insulating material used as a dielectric material for capacitors and a base material for air-core coils, characterized by containing an amount of t% or less. 2 The Ni-Cu-Zn ferrite is 1 to 10 wt.
Claim 1 characterized in that it contains %
An insulating material used as a dielectric material for capacitors and a base material for air-core coils as described in 2.
JP57055156A 1982-04-02 1982-04-02 insulation material Expired JPS6022443B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57055156A JPS6022443B2 (en) 1982-04-02 1982-04-02 insulation material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57055156A JPS6022443B2 (en) 1982-04-02 1982-04-02 insulation material

Publications (2)

Publication Number Publication Date
JPS58172803A JPS58172803A (en) 1983-10-11
JPS6022443B2 true JPS6022443B2 (en) 1985-06-01

Family

ID=12990881

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57055156A Expired JPS6022443B2 (en) 1982-04-02 1982-04-02 insulation material

Country Status (1)

Country Link
JP (1) JPS6022443B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS628512A (en) * 1985-07-04 1987-01-16 株式会社村田製作所 Ic composite part
JP2691715B2 (en) * 1987-07-01 1997-12-17 ティーディーケイ株式会社 Ferrite sintered body, chip inductor and LC composite parts
JPH01189106A (en) * 1988-01-25 1989-07-28 Tdk Corp Chip component and electronic component
JP2611063B2 (en) * 1990-07-24 1997-05-21 ティーディーケイ株式会社 High frequency circuit
JPH0787149B2 (en) * 1990-11-15 1995-09-20 太陽誘電株式会社 Multilayer chip impedance element

Also Published As

Publication number Publication date
JPS58172803A (en) 1983-10-11

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