JPS6022338A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS6022338A
JPS6022338A JP13144183A JP13144183A JPS6022338A JP S6022338 A JPS6022338 A JP S6022338A JP 13144183 A JP13144183 A JP 13144183A JP 13144183 A JP13144183 A JP 13144183A JP S6022338 A JPS6022338 A JP S6022338A
Authority
JP
Japan
Prior art keywords
channel
domains
lines
integrated circuit
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13144183A
Other languages
Japanese (ja)
Inventor
Kenji Chijiya
千々谷 兼児
Yukihiko Ishikawa
幸彦 石川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC IC Microcomputer Systems Co Ltd
Original Assignee
NEC IC Microcomputer Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC IC Microcomputer Systems Co Ltd filed Critical NEC IC Microcomputer Systems Co Ltd
Priority to JP13144183A priority Critical patent/JPS6022338A/en
Publication of JPS6022338A publication Critical patent/JPS6022338A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain a square shape and improve an integrity by a method wherein P-channel domains and N-channel domains are arranged alternately and common source lines and common ground lines are arranged in both channel domains in parallel and internal common lines are provided to the edges of the channel domains vertically. CONSTITUTION:P-channel domains 1 and N-channel domains 2 are arranged alternately and common source lines 3 and common ground lines 4 are provided to the domains 1 and the domains 2 respectively. Internal signal common lines 6 are provided to the edges of the domains 1, 2 and logic circuits A, B, E, F, C' and D' are formed between the domains 1 and the domains 2. The logic circuits, the signal lines and the common source lines are connected to each other properly. Because the internal signal common lines 6 are provided, signal common lines 5 need not be provided to the inside of the domains 1, 2 so that a square shape of the integrated circuit can be obtained and a high density integration can be realized.

Description

【発明の詳細な説明】 〔発明の属する技術分野〕 本発明は、半導体集積回路装置に関し、特に0MO8)
ランジスタから構成された高密度集積化が可能な半導体
集積回路装置にI’dする。
[Detailed Description of the Invention] [Technical field to which the invention pertains] The present invention relates to a semiconductor integrated circuit device, and in particular to a semiconductor integrated circuit device (0MO8).
I'd like to focus on a semiconductor integrated circuit device composed of transistors and capable of high-density integration.

〔従来技術〕[Prior art]

周知の通り、0MO8)ランジスタを用いた論理回路は
実質的に同数のPチャンネルMO8)ランジスタとNチ
ャンネルMOS)ランジスタから構成され、これを半導
体集積回路装置に実現する場合には、一般にPチャンネ
ルMOSトランジスタを配置する領域(以後Pチャンネ
ル領域と記す)とNチャンネルNO8)ランジスタを配
置する領域(以後Nチャンネル領域と記す)とを互いに
近接させて並列に設定し、それぞれの領域に同数のMO
S)ランジスタを配置しC個々の論理回路を構成し′C
いる。
As is well known, a logic circuit using 0MO8) transistors consists of substantially the same number of P-channel MO8) transistors and N-channel MOS) transistors, and when implementing this into a semiconductor integrated circuit device, it is generally a P-channel MOS transistor. A region where a transistor is arranged (hereinafter referred to as a P-channel region) and a region where an N-channel transistor is arranged (hereinafter referred to as an N-channel region) are set close to each other in parallel, and the same number of MOs are placed in each region.
S) Arrange transistors to configure C individual logic circuits'C
There is.

第1図は従来の半導体集積回路装置の一例をブロック的
に示した説明図で、1はPチャンネル領域、2はNチャ
ンネル領域、3は電源共通線、4は、グラウンド共通線
、5は信号共通線、A−Fは個々の論理回路である。
FIG. 1 is an explanatory block diagram showing an example of a conventional semiconductor integrated circuit device, in which 1 is a P channel region, 2 is an N channel region, 3 is a power supply common line, 4 is a ground common line, and 5 is a signal The common lines, A-F, are individual logic circuits.

論理回路A−FはそれぞれCMOSトランジスタから成
り、PチャンネルトランジスタはPチャンネル領域lの
内部に、NチャンネルトランジスタはNチャンネル領域
2の内部に配置されている。
Logic circuits A to F each consist of CMOS transistors, with a P-channel transistor arranged inside a P-channel region 1 and an N-channel transistor arranged inside an N-channel region 2.

第1図では、簡単なために、論理回路A−F相互間の接
続および信号共通線との間の接続は省略しCある。
In FIG. 1, for the sake of simplicity, the connections between the logic circuits A and F and the connection between the signal common lines are omitted.

第1図かられかるように、第1図に示した構成の半導体
乗積回路装置は形状が細長くなり、半導体チップ設計1
常に許されるとは限らない。
As can be seen from FIG. 1, the semiconductor multiplication circuit device having the configuration shown in FIG.
It's not always allowed.

第2図は、論理回路A −Fに与えられる寸法が正方形
に近い場合の構成を示した説明図で、この場合には、電
源共通線3、グラウンド4および信号共通線5が多数個
使用されることになり、これにより、各共通相互間の接
続が余分に必要になっ°C1全体としての所要面積が増
大する欠点がある。
FIG. 2 is an explanatory diagram showing a configuration in which the dimensions given to logic circuits A to F are close to square; in this case, a large number of power supply common lines 3, ground 4, and signal common lines 5 are used. As a result, an additional connection between the common terminals is required, which increases the area required for the entire C1.

〔発明の目的〕[Purpose of the invention]

本発明の目的は上記欠点を排除(2、より重密度のレイ
アウト構成になる半導体集積回路装置を1)、供するこ
とにある。
An object of the present invention is to eliminate the above-mentioned drawbacks (2) to provide a semiconductor integrated circuit device having a more dense layout configuration.

〔発明の構成〕[Structure of the invention]

本発明の半導体集積回路装置は、検数のトランジスタが
配列して形成されるPチャンネルMO’8トランジスタ
領域と、NチャンネルMO8トランジスタ領域とが交互
に並列配置され、前記両領域並びに他領域とを結ぶ配線
とを有する半導体集積回路装置において、前記端部を除
くPチャンネルMO8)ランジスタ領域の中央部付近に
配置された第1の電位の共通線と、端部を除くペチャン
ネルMOSトランジスタ領域の中央部付近に配置された
第2の電位の共通線と、端部の領域に於てPチャンネル
MOSトランジスタ領域又1dNチャンネルMO8トラ
ンジスタ領域かにより前記領域のそれぞれの外側付近に
配置された第1又は第2の電位の共通線と、前記各種共
通線の外側部分に配置された他の回路ブロックへの接続
配線とを含んで構成される。
In the semiconductor integrated circuit device of the present invention, P-channel MO'8 transistor regions formed by arranging a plurality of transistors and N-channel MO8 transistor regions are alternately arranged in parallel, and these regions and other regions are connected to each other. In a semiconductor integrated circuit device having a first potential common line arranged near the center of the P-channel MOS transistor region excluding the end portions and the center of the P-channel MOS transistor region excluding the end portions, A second potential common line disposed near the end region and a first or first potential common line disposed near the outside of each region depending on whether it is a P channel MOS transistor region or a 1dN channel MO8 transistor region in the end region. 2, and connection wiring to other circuit blocks arranged outside the various common lines.

〔実施例の説明〕[Explanation of Examples]

次に本発明の実施例について、図面を参照して説明する
Next, embodiments of the present invention will be described with reference to the drawings.

第3図は本発明の一実施例のブロック的説明図である。FIG. 3 is a block diagram of an embodiment of the present invention.

図において論理回路A、B、E、Fは第2図におけるA
 、 B 、 E 、 )’と同一であるが、第3図に
おける論理回路C/ 、 D’は第2図の論理回路C,
DのPチャンネルトランジスタの配置とNチャンネルト
ランジスタの配置を逆にしたものである。この結果、第
2図に示した従来品よりもPチャンネル領域1.Nチャ
ンネル領域2の数を減らずことができる。従って第2図
と第3図を比較して容易に理解できるように、電源共通
線3.グラウンド共通線4の所要本数がそれぞれ3本か
ら2本へと減少しCいる。6はブロック内部の各回路を
接続するための信号共通線で、信号共通線5と区別する
ために内部信号共通線と呼ぶ。内部イぎ号共通線6は電
源共通線3、グラウンド共通線4とは別の層を使用して
、直交配線を可能にしCいる。
In the figure, logic circuits A, B, E, and F are A in Figure 2.
, B, E, )', but the logic circuit C/, D' in FIG. 3 is the same as the logic circuit C, D' in FIG.
The arrangement of the P-channel transistors and the arrangement of the N-channel transistors in D are reversed. As a result, the P channel area 1. This can be done without reducing the number of N channel regions 2. Therefore, as can be easily understood by comparing FIG. 2 and FIG. 3, the power supply common line 3. The required number of ground common lines 4 is reduced from three to two. Reference numeral 6 denotes a signal common line for connecting each circuit within the block, and is called an internal signal common line to distinguish it from the signal common line 5. The internal signal common line 6 uses a layer different from the power supply common line 3 and the ground common line 4 to enable orthogonal lines.

第3図においても、論理回路相互間の接続、論理回路と
内部信号共通線間の接続、内部信号共通線6と信号共通
線5との間の接続は容易のため省略通線4の間に配置さ
れた信号共通線を置きかえであるためブロック内部の信
号共通線を無くすことが可能になり、縦方向の面積を減
小させることができるようになった。
In FIG. 3, connections between logic circuits, connections between logic circuits and internal signal common lines, and connections between internal signal common lines 6 and signal common lines 5 are omitted because they are easy. Since the arranged signal common lines are replaced, it becomes possible to eliminate the signal common lines inside the block, and it becomes possible to reduce the vertical area.

第4図は本発明の他の実施例の説明図で、電源共通線3
が両端部と中央にあり計3本、グラウンド共通線4は中
央部に2本あり、両共通線の本数が同一でない場合を示
しCいる。0’ 、 H’は論理回路である。
FIG. 4 is an explanatory diagram of another embodiment of the present invention, in which the power supply common line 3
There are three in total at both ends and in the center, and there are two ground common lines 4 in the center, indicating the case where the numbers of both common lines are not the same. 0' and H' are logic circuits.

図から明らかなように、従来方式では電源共通線3並び
にグランド共通線4共に各4本必要であったが、本実施
例では電源共通線が3本、グランド共通線が2本とそれ
ぞれ1本及び2本の813本が減小している。
As is clear from the figure, in the conventional system, four power supply common lines 3 and four ground common lines 4 were required, but in this embodiment, there are three power supply common lines, two ground common lines, and one each. and two 813 items decreased.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明によれば、半導体集積回路装
置を正方形に近い形状に配置することができ、しかも、
共通線の占める面積やそれの相互接続に喪する面積を節
減することができ烏密度集積化の進んだ半導体集積回路
装置が得られる。
As explained above, according to the present invention, semiconductor integrated circuit devices can be arranged in a shape close to a square, and moreover,
The area occupied by common lines and the area lost for interconnection thereof can be reduced, and a semiconductor integrated circuit device with advanced density integration can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の構成方法による半導体集積回路装置の一
例のブロック的説明図、第2図は従来の構成方法による
半導体集積回路装置の他の例のブロック的説明図、第3
図は本発明の一実施例のブロック的説明図、第4図は本
発明の他の実施例のブロック的説明図 である。 1・・・・・・Pチャンネル領域、2・・・・・・N−
チャンネル領域%3・・・・・・電源共通線、4・・・
・・・グランド共通線、5・・・・・・信号共通線、6
・・・・・・内部信号共通線。 代理人 弁理士 内 原 晋(:パ、、7H7◇)篤3
 図 z 4 閉
FIG. 1 is a block explanatory diagram of an example of a semiconductor integrated circuit device according to a conventional configuration method, FIG. 2 is a block explanatory diagram of another example of a semiconductor integrated circuit device according to a conventional configuration method, and FIG.
The figure is a block explanatory diagram of one embodiment of the present invention, and FIG. 4 is a block explanatory diagram of another embodiment of the present invention. 1...P channel area, 2...N-
Channel area %3...Power supply common line, 4...
...Ground common line, 5...Signal common line, 6
...Internal signal common line. Agent: Patent Attorney Susumu Uchihara (:Pa,, 7H7◇) Atsushi 3
Figure z 4 closed

Claims (1)

【特許請求の範囲】[Claims] 複数のトランジスタが配列して形成されるPチャンネル
MOSトランジスタ領域とNチャンネルMOSトランジ
スタ領域とが交互に並列配置されてなる回路ブロックと
、該回路ブロック内並びに外部回路ブロックとの接続を
する配線とを有する半導体集積回路装置において、前記
端部を除くPチャンネルMOSトランジスタ領域の中央
部付近に配置された第1の電位の共通線と、端部を除く
ヘチャンネルMO8)ランジスタ領域の中央部付近に配
置された第2の電位の共通線と、端部の領域に於−UP
チャンネルMOSトランジスタ領域又はNチャンネルM
OS)ランジスタ領域かにより前記領域のそれぞれの外
側付近に配置された第1又は第2の電位の共通線と、前
記各種共通線の外側部分に配置された他の回路ブロック
への接続配線とを含むことを特徴とする半導体集積回路
装置。
A circuit block in which P-channel MOS transistor regions and N-channel MOS transistor regions formed by arranging a plurality of transistors are arranged alternately in parallel, and wiring for connection within the circuit block and with external circuit blocks. In a semiconductor integrated circuit device having a first potential common line arranged near the center of the P-channel MOS transistor region excluding the ends, and a first potential common line arranged near the center of the P-channel MOS transistor region excluding the ends; -UP in the common line of the second potential and the end area
Channel MOS transistor region or N channel M
OS) A first or second potential common line placed near the outside of each transistor area, depending on the transistor area, and connection wiring to other circuit blocks placed outside the various common lines. A semiconductor integrated circuit device comprising:
JP13144183A 1983-07-19 1983-07-19 Semiconductor integrated circuit device Pending JPS6022338A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13144183A JPS6022338A (en) 1983-07-19 1983-07-19 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13144183A JPS6022338A (en) 1983-07-19 1983-07-19 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS6022338A true JPS6022338A (en) 1985-02-04

Family

ID=15058029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13144183A Pending JPS6022338A (en) 1983-07-19 1983-07-19 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6022338A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58169937A (en) * 1982-03-31 1983-10-06 Hitachi Ltd Semiconductor integrated circuit device
JPS5929440A (en) * 1982-08-11 1984-02-16 Hitachi Ltd Semiconductor integrated circuit device
JPS5968944A (en) * 1982-10-13 1984-04-19 Hitachi Ltd Semiconductor integrated circuit device
JPS5972742A (en) * 1982-10-20 1984-04-24 Hitachi Ltd Master method of master slice lsi
JPS59163837A (en) * 1983-03-09 1984-09-14 Toshiba Corp Semiconductor integrated circuit
JPS59225557A (en) * 1983-06-06 1984-12-18 Toshiba Corp Complementary mos integrated circuit device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58169937A (en) * 1982-03-31 1983-10-06 Hitachi Ltd Semiconductor integrated circuit device
JPS5929440A (en) * 1982-08-11 1984-02-16 Hitachi Ltd Semiconductor integrated circuit device
JPS5968944A (en) * 1982-10-13 1984-04-19 Hitachi Ltd Semiconductor integrated circuit device
JPS5972742A (en) * 1982-10-20 1984-04-24 Hitachi Ltd Master method of master slice lsi
JPS59163837A (en) * 1983-03-09 1984-09-14 Toshiba Corp Semiconductor integrated circuit
JPS59225557A (en) * 1983-06-06 1984-12-18 Toshiba Corp Complementary mos integrated circuit device

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