JPS60221713A - Photoelectric module casing - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to optoelectronic module casings, for example gas-tight module casings for receiving light.

In this case, the optoelectronic module casing is provided with a glass fiber connector part, for example a glass fiber sleeve, for transmitting and receiving light modulated with information, and this glass fiber connector part is spaced apart from the glass fiber end by a predetermined distance. An adjustment frame is provided, which preferably has an adjustment surface perpendicular to the axis of the glass fiber and is fixed to the adjustment surface, and a photoelectric element for transmitting and receiving light is provided in the adjustment frame.

PRIOR ART Such a module casing is known, for example from US Pat. No. 3,950,075. However, in the case of a known module casing, it is often not the case that L + F is not the same. In this regard, the invention described in Japanese Patent Application No. 59-212770 (German Patent Application Publication No. P3137131.8) has been proposed.

Problems to be Solved by the Invention An object of the present invention is to accurately and easily determine the optimum adjustment position for maximizing the degree of optical coupling between the photoelectric element and the end of the glass fiber in the photoelectric module casing mentioned at the beginning. The key is to fix the photoelectric element in this optimal adjustment position.

The present invention provides a 2DDMb for glass fiber communication system, for example.
Developed for IT/S photoelectric transceiver module. However, the invention should be applicable to all optoelectronic module casings that transmit and receive optical signals via the glass 7 eye/glue.

Means for Solving the Problem According to the present invention, this problem is solved by the invention set forth in claim 1.

゛According to the present invention, glass fiber? f end and photoelectric terminal 2 43+/7″IM/s #lli hnecessary6h 41~
TS6h PAν Lu - Self-transformation becomes algae and becomes 1 μm
The following extremely high accuracy can be obtained. Therefore, the maximum degree of optical coupling between the glass fiber and the photoelectric element can be obtained. In this case, the glass fiber ends are not damaged or soiled while measuring the degree of optical coupling and when fixing the plate to the adjustment frame and the adjustment frame to the adjustment surface.

Conventional module casings, such as those described in European Patent Application No. g-A2-31146, present considerable difficulties in assembly. This is because, during assembly of the module casing, the fragile ends of the glass fibers were very easily damaged or contaminated with resin or the like.

In the present invention, the glass fiber is a single mode fiber whose end is tapered and pointed, but will not be damaged during assembly of the casing.

The configuration described in the embodiment section provides the following advantages, for example; According to the configuration described in claim 2, the casing of the present invention is stably constructed and the material is appropriately selected. Therefore, even if a factor that causes an obstacle is added after assembly, the optimal adjustment position will not be reached. For example, there is almost no effect of deformation due to heat or bending due to vibration. Therefore, it is stable over long periods of time even under harsh operating conditions.

According to the structure recited in claim 6, the light flux entering and exiting between the glass fiber end and the photoelectric element has an antenna-like shape, and optical coupling without loss is possible, so that the photoelectric element can be accurately connected. And the position can be easily adjusted.

According to the configuration described in claim 4, since the portion of the photoelectric element that performs optical coupling faces the plate, damage to the photoelectric element can be prevented during adjustment.

According to the configuration described in claim 5, the plate can be configured to have any shape and size. For example, very small plates can be used. Alternatively, only the photoelectric element can be mounted on a dedicated plate. Thus, for example, the optoelectronic element can be arranged at a distance from the potential of the inner surface of the module casing in order to prevent high-frequency interference. Furthermore, even if the optoelectronic element is mounted on the back side of the plate, the adjustment frame and the guide member can be grounded accordingly (and if necessary, both can be metallized) to shield the optoelectronic element against high frequencies.

According to claim 6, the degree of optical coupling can be increased, that is, the loss can be extremely reduced.

According to the structure recited in claim 7, plates, adjustment frames, etc. can be mounted more quickly and firmly than when only adhesive is used.

According to the configuration described in claim 8, the line length is shortened, which is advantageous in terms of high frequency technology.

According to claim 9, feedback coupling between the amplification element and the amplifier components, for example an amplifier and a postamplifier, can be prevented by effective shielding.

Embodiments Next, the present invention will be described in detail with reference to embodiments with reference to the drawings.

FIG. 1 is a plan view showing an embodiment of a bulletin board having a photoelectric element and an amplification element, and FIG. 2 is a sectional view of a photoelectric module casing according to the present invention using the thin plate of FIG.

The gas-tight casing G/W shown in FIG. 2 has a casing G and a lid W. The lid W is advantageously removable in a light-tight and gas-tight manner, so that the interior of the casing A/W can be easily accessed for assembly, final adjustment and final inspection.

At the bottom of the housing G, a glass fiber connector part is provided - again preferably in a light-tight and gas-tight manner. In this case it is a glass fiber sleeve, in which the jacket (M) can be screwed onto the sleeve, S, by means of a jacket X and a stopper Y. In the case of a receiving module casing, this glass fiber connector section connects light modulated with information from the outside to the casing casing G.
and, in the case of the transmitting module casing, for guiding the light. A photoelectric element is provided in the axial direction of a light guide made of glass fibers which passes through a glass fiber jacket M. The photoelectric element is, for example, a GaAs-PIN photodiode or a Ray f diode, and receives or transmits light.

In this embodiment, the actual module casing s/E/P is housed in the outer casing G/W, which includes the glass fiber connector part, the adjustment frame E
and plate P.

In principle, other elements,
For example, a preamplifier or a postamplifier can also be accommodated.

A plan view of plate P, which is shown in cross-section in FIG. 2, is illustrated in FIG. In practice, after being adjusted, the plate P is at least partially fitted into the adjustment frame E, 9, so that at least a portion of the surfaces H and C are in contact. That is, FIG. 2 shows the state before adjustment or the state in which the adjusted plate P and adjustment frame E are separated.

Also, at least a portion of the surface B of the adjustment frame E contacts the adjustment surface A of the fiberglass connector portion after adjustment.

However, the glass fiber connector section in this case consists of a glass fiber sleeve S1, a glass fiber jacket M, and a glass fiber L.

The plate P can be freely moved in the axial direction of the glass fiber L. Further, the adjustment frame E can also be moved on the adjustment surface A in two other directions perpendicular to the axial direction. Therefore, plate P
The photoelectric element mounted with can be adjusted arbitrarily and precisely in all three directions with respect to the glass fiber end N. Once this adjustment has been completed, the adjustment frame E is attached to the adjustment surface A of the fiberglass sleeve and thus to the housing A.
Installed definitively and permanently. Before or after this mounting (advantageously subsequent to mounting) the plate P and the surfaces H, C of the adjustment frame E can be brought into contact and fixed together. The optoelectronic element can therefore be fixed in its optimal adjustment position, for example by means of clarification, gluing, welding, brazing, etc. This adjustment process and the attachment of the gauze to the adjustment surface A or to the housing G are preferably carried out while continuously observing or measuring the degree of optical coupling between the glass fiber end N and the photoelectric element. Therefore, by repeatedly finding the optical adjustment position and performing installation at this position,
It is possible to obtain the maximum degree of optical coupling between the photoelectric element and the glass fiber L in the module casing s/E/p, that is, to achieve optimal optical coupling.

Instead of using a glass fiber sleeve S and a glass fiber jacket M inserted therein as shown,
And instead of making it removable by screwing members X and Y, for example, a glass fiber connector part simulator casing S/E/P with glass fiber L,
In other words, it can be fixedly attached to the control panel.

In this way, tolerances due to attachment and detachment are avoided, and the end N of the glass fiber can be fixedly attached close to the module casing or the member having the adjustment surface A. The position of the end portion N can be adjusted accurately and stably over a long period of time.

The adjustment frame E shown in FIG. 2 is a substantially circular ring into which the circular plate P shown in FIG. 1 is inserted.

However, the plate P and the adjustment frame E may have other mutually matching shapes. For example, if the internal opening C of the adjustment frame E has a square shape, the plate P may also have a square shape instead of a circle.

In order to stabilize the position of the glass wire ends N with respect to the adjustment surface A over a long period of time, all the members between the two should be made of stable materials that do not undergo thermal expansion that would cause problems. good.

In the embodiment shown in FIG. 2, the first direction in which the plate P moves within the adjustment frame E to adjust the position of the photoelectric element is
The axial direction of the glass fiber L and the direction in which the photoelectric element is most optically active substantially coincide. Therefore, when the adjustment frame E, movable in the other two directions, is at least approximately adjusted, i.e. when the optimum position has been reached, and finally on the adjustment surface A, for example in the casing a/W. Optimum optical coupling can be easily obtained if the optical coupling is fixed. In other words, the final position of the board P can be adjusted easily. Since the axis of the glass fiber L and the photoelectric element are substantially aligned, the process of finally moving and attaching the plate P to the adjustment frame E can be performed at a relatively later stage. &P is attached to the adjustment frame E after moving the frame E and fixing it on the adjustment surface A, thereby temporarily optimizing the degree of optical coupling between the photoelectric element on the plate P and the glass fiber L. Become. As is often the case with single-mode glass fibers, the final positional tolerance of the optoelectronic element in the direction perpendicular to the axis of the glass fiber L is limited by the axial tolerance (e.g. +-0,5
μm) (for example, 10.05 μm), adjust the adjustment frame E and plate P in the above order and adjust the adjustment surface A.
It is very advantageous to install it on

In the embodiment shown in FIG. 2, a lens system K is provided between the glass fiber connector section and the photoelectric element. The lens system consists of at least one single lens which is a converging lens. This converging lens can be, for example, a spherical lens or a cylindrical lens, which is very simple to manufacture. These lenses make it possible to optically couple the optically active part of the optoelectronic element with the glass fiber end N. Spherical or cylindrical converging lenses that are coupled with the ends of glass fibers in order to focus the light and thus improve the degree of light coupling at the ends of the glass fibers are known from the following documents: US Pat. Patent No. 3950075, German Patent Application No. 3012118, British Patent No. 2002136, German Patent Application No. 2831935, German Patent Application No. 2703887.

In the present invention, the photoelectric element and the glass fiber end N
By placing an optical system consisting of a single converging lens or multiple lenses between the two, the following major advantages can be obtained; It has the optical property of providing a wide luminous flux. In other words, the photoelectric element emits a wide and divergent beam of light and receives a similarly wide beam of light. On the other hand, the light incident on or emitted from the glass fiber end N becomes an extremely narrow and sharply directional light beam. These differences in optical properties between the two members N and D, as well as the difference in the size of their optically active surfaces, are caused by the above-mentioned lens system K (the surface of the lens may be coated) or simply by Spherical lenses allow mutual alignment. Therefore, even if the tolerance of the optimum adjustment position is quite large, it is possible to optically couple the optoelectronic element and the glass fiber end N with reduced losses and reflections. Moreover, in this case, there is a large margin for allowable deviation from the ideal adjustment position to the positions of the two members N and D.

Therefore, if the photoelectric element is a light receiving element such as a Ga, As-PIN diode, there is little risk of failure even if the insertion depth of the glass fiber jacket M is inaccurate and changes over time. . This is because the narrow beam of light emanating from the glass fiber end N is always incident on the wide photoactive surface of the diode D located in its focal plane by means of a corresponding lens K mounted on the housing. In this case, the diameter of the lens system (or its diameter if a spherical lens is used as the lens)
Is it glass fiber? If the distance between the glass fiber end N and the fixedly adjusted lens is considerably larger than the diameter of the
It has an extremely large margin for the optical system. This principle applies to both single mode glass fibers and multimode class fibers.

On the other hand, if the photoelectric element adjusted in the casing emits light, that is, for example, if it is a laser diode emitting a wide beam, then the fertile lens K is arranged in the immediate vicinity of the photoelectric element. (However, the refractive index of the lens should be selected accordingly.) Then, all the light beams emitted from the photoelectric element will enter the incident surface of the lens, will be converged by the lens, and will become a narrow light beam from the exit surface. In this way, the wide beam of the light emitting element is also matched by the ball lens K to the narrow aperture of the glass fiber end N, so that the reflectance and imaging distortion are reduced. If this is selected, the distance between the glass fiber end N and the lens surface of the lens system closest to it can be made arbitrary, allowing a large tolerance for the optical system.

As can be seen from Figure M1 and Figure 2, the plate PK has several elements attached to it in addition to the photoelectric element. First of all, in the vicinity of the photoelectric element at least one amplification element V1, for example a preamplifier, is provided. The amplifying element (2) is connected to the photoelectric element (2) so as to transmit high frequency waves. This connection is made, for example, by a very short Bowden wire with low capacitance or inductance, which is not shown in the figure for reasons of simplicity. Regarding the carrier T on which the pixel elements are mounted, the patent application No. 34091 of the Federal Republic of Germany
It is described in Publication No. 46. Also, for example, GaAs
-A further high-frequency element F, for example a GaAs FET, is arranged next to the photoelectric element 1, which is a PIN photodiode, and to the preamplifier. The high frequency element F is used to match the voltage level of the diode D to the voltage or current level of the preamplifier II.

The connection relationship between the high frequency element F and other elements (2) is also not shown to simplify the diagram. Furthermore, further elements, such as photoelectric elements or a preresistor R, are also provided. This preresistor R can be, for example, a printed thick-film resistor if T is a corresponding carrier, for example a ceramic carrier. The above-mentioned elements R, 'F, and V together with the photoelectric element -
Preferably in a "step-by-step" manner, one carrier T (or plate P>, lc) is mounted, inspected and connected at high frequency. If necessary, the carrier T on which the photoelectric element is placed is connected to the plate. 1 before mounting on P or before mounting plate P on module casing s/E/p.
The aforementioned elements R and F.

The positions of V and D may be adjusted. In this way, the incidence of defective products during module casing manufacturing can be kept low.

In this case, it is advantageous to arrange the optoelectronic element in the center of the plate P and thus in the center of the carrier T. This is because such a rotary culm configuration simplifies the later step of attaching the adjustment frame E to the adjustment surface A, and therefore the final adjustment of the position of the photoelectric element with respect to the end of the glass fiber. This is because it becomes

The plate P is made of standardized inexpensive material, for example, diameter 6III.
It is a T'O casing f socket of I and has an introduction pin 2 fused into the glass insulation part I. Here, the external terminals of the elements, V, F, and H, together with the power supply terminal and the ground terminal, are led to the back side of the plate P via normal standard lead wires 2. Therefore, these terminals can be used for disconnection tests and connections with external circuit parts after adjusting the position of the plate P and attaching it to the adjustment surface, or after removing the casing lid W. . Therefore, even if the module casing 87'E/P is extremely small, after the installation on the adjustment surface A, the above-mentioned elements V, F.

R can be accommodated in a very small space, accurately adjusted and protected at low cost. In that case, these elements can be electrically accessed via the introduction bottle 2.

In general, almost the entire module casing S/E/'P, that is, the plate P1 adjustment frame E and the glass fiber connector part, together with the adjustment surface A provided on the member directly or indirectly connected to this connector part, formed from a metallic material that is electrically connected to and grounded. The components V, F, R, which are housed in the module housing S/E/P and are sensitive to high frequencies and stray capacitances, are therefore well shielded from high frequencies. Further, in order to protect the terminal or lead-in pin Z when another element is connected from the outside, an external casing consisting of members G and W, for example, is provided. At this time, the plate P and the photoelectric element are easily cooled due to the thermal conductivity of the metal material constituting the outer casing. This effect becomes particularly noticeable when cooling fins are provided on the outer surface of the glass fiber connector portion or the casing G/W. Therefore,
A photoelectric element D1 that generates a large amount of heat, such as a laser diode P
It is possible to effectively cool a light emitting element such as from the outside. In the present invention, the casing cooling method described in the following documents can be used;
No. 6429269.

The plate P is made of metal or metal laminated and is grounded, but its surface area is very small. For this reason, and also to avoid the influence of stray capacitances, at least the amplifier component U is mounted on the back side of the plate P, that is to say on the side opposite to the optoelectronic element. This amplifier component U is
It is connected at high frequency to the photoelectric element 1 or the amplifying element 2/F via at least one insulated line, for example, an inlet Z of the plate P. If the optoelectronic element is a light emitting element, the amplifier component U is used as a preamplifier. When the optoelectronic element is a light receiving element, the amplifier component U is a postamplifier. High-frequency feedback coupling between the amplifier component U and the elements V, F, R on the other side is therefore suppressed or attenuated. If the outer casing a/W also consists of metal (or is metallized) and is earthed, the amplifier component U is shielded towards the outside.

External terminals can also be attached to the external casing G/W. FIG. 6 shows an embodiment in such a case, in which a connecting pin ZG is attached to the lid W at the bottom of the outer casing G/W. This connecting pin ZG supplies a necessary potential to each lead-in pin Z via a connection line (not shown) or extracts the potential from the lead-in pin. In addition, by this connecting pin ZG, the casing a/
W can be inserted into the hole of the conductor plate and brazed.

In order to finally attach the plate P to the adjustment frame E and fix the adjustment frame E to the adjustment surface A, the above steps may be performed in the above order.

In order to carry out the above-mentioned mounting and fixing work, it is advantageous to use a hardening adhesive. In general, the risk of displacement of the adjustment position due to curing stresses after bonding is small. This risk is further reduced, especially if an adhesive material is used that does not deteriorate due to aging or operating heat during its set life.

It is also possible to use brazing for attachment. However, careless brazing may cause the adjustment position to be incorrect. This is because the heat of brazing causes the module casing, or at least the adjustment frame therein, to expand considerably, so that the adjustment position may change after cooling. Suitable brazing materials are those that recrystallize rapidly. .

However, considering the impact on strength and adjustment position, no material can be used to provide a stable braze over a long period of time to meet the highest precision requirements.

Furthermore, spot welding, in particular Rede spot welding, can be used alone or in conjunction with gluing or the like for attachment. In this case, it is necessary to prevent distortion from occurring due to welding. Therefore, relatively low-energy laser beams must be used only when necessary for installation. This is because if an excessively large lede beam is used for a long time and parts unnecessary for welding are melted, the adjustment position will be incorrect after this part has solidified. Also the second
When only adhesive is used as shown in FIG. 6, the shielding effect is small.

Figure 4.5.6 shows that after adjusting the plate P in two directions and adjusting the adjustment frame E in the Xl'l' direction, the laser beam L'
An example is shown in which both are fixed at the fixing point LF by spot welding using S. If the members P, E, and S mechanically connected by spot welding are themselves electrically conductive, they are also connected in a DC conductive manner via the fixing point LF, which is a welding point. Therefore, compared to the example of FIG. 2.3, the shielding effect against high frequency interference is improved or more reliable. It is necessary to shield the internal module casing S/E/P well from the space outside it for the following reasons; the input terminals of the amplifier component U or the amplifier component ■ receive interference pulses from the outside space. It acts as a powerful antenna that emits interference pulses or as a transmitting antenna that emits interference pulses. In this case, the amplification elements U, V are operated digitally by steep current pulses with a pulse repetition frequency of several 100 Mbis/s, for example. If spot welding or Rede welding is used, it is possible to omit a shielding plate for shielding the amplifying members U, V, which perform the above-mentioned functions, inside the module casing. Also, the photoelectric element is not a photodiode for receiving light, but an IRED, for example.
In the case of a light emitting diode made of a diode, a large amount of heat loss is generated during welding and is dissipated to an external cooling medium via the fixing point LF. In this case, the heat loss generated is, for example, 200 mW, but since the heat transfer resistance between the photoelectric element and the module casing S/E/P or casing S/a/W is sufficiently small, it is easily transferred to the outside. Dissipate. The lifetime of an I RED light emitting diode becomes shorter as the temperature of the depletion layer during operation is higher. Therefore, if good cooling efficiency can be obtained by spot welding, the life of the diode will also be extended.

Next, the process of laser welding, particularly spot welding, will be explained with reference to FIG. In this case, a rotatable laser beam deflection device and a piezoelectric micromanipulator adjustable with an accuracy of 0°05 μm are used. As shown in the figure, the manipulator includes an arm Jus, z that adjusts the position of the plate P, and an arm Jus that adjusts the adjustment frame E.
, xy. In the welding operation, the members P, E, and S to be welded together are first wetted with a liquid adhesive material and their positions relative to each other are adjusted. after that,
Welding is performed smoothly and without contact using the laser fLf13. If sufficient cooling is performed during this time, there is almost no possibility that the welding operation will cause the adjustment position to be incorrect.

Welding spora) The number of LFs can be selected arbitrarily. In FIG. 5, 12, 16 or 20 welding sporaes LF with a diameter of 0°6 are thrown between the plate P and the adjustment frame E. For example, by providing 20 welding spora (LF) and overlapping each other, the optimum heat dissipation efficiency can be obtained.

The number of welding spots LF may be reduced.

However, as the number of welding spots LF increases, the heat conduction resistance at the welding groove between the plate P and the adjustment frame E and at the transition area between the two becomes smaller. Advantageously, the welding spot LF is provided between the glass insulation parts of the lead-in pin Z, as shown in FIG.

In other words, in order to protect the glass insulating part (2), there is no welding spot LF near it. In addition, the glass insulation part I is not only an electrical insulation member, but also does not conduct heat.

Therefore, the heat generated by the photoelectric element flows through the portion of the plate P between the glass insulation parts 1 and is dissipated to the adjustment frame E via the welding spora) LF. This heat flow is influenced by the material and thickness of the plate P and the adjustment frame E.

In the example shown in FIG. 6, the arm Jus is for two directions.

2 is also used to supply potential to the photoelectric element. It is therefore possible to supply the optoelectronic element and the amplification elements U, V with an operating voltage during the adjustment, ie during the welding process. Therefore, position adjustment and welding are performed while optimally controlling the degree of optical coupling between the optoelectronic element and the glass fiber end N under operating conditions. Arm Jus' for two directions, z and arm Jus for x-y directions, x-y
is part of an automatically controlled micromanipulator. The micromanipulator automatically and repeatedly
Find the optimal adjustment position and monitor the installation work. This function remains the same even when other methods of attachment, such as adhesive, are used instead of laser welding.

According to another embodiment of the invention, the plate P, which can move in two directions within the adjustment frame E, does not have to be fixed directly to this frame E. In this embodiment, the plate P is fixed directly or indirectly to the guide member. This guide member is guided into the adjustment frame E, moves to the optimum adjustment position, and moves in two directions. After the guide element has been adjusted, that is to say that the optoelectronic element has been brought into the optimal adjustment position by, for example, repeated movements of this guide element, it is finally attached to the adjustment frame E, for example by laser welding as shown in FIG. Installed. Thereby, the plate P and the photoelectric element are fixed in the optimal adjustment position.

Next, according to FIGS. 7 to 11, the guide member C as described above is
) An example of a module casing having K will be described. In this example, the photoelectric element and the plate P are not directly fixed to the metal guide member GK, but are attached at a certain interval, that is, via the lead-in pin Z.

Therefore, the potential of the photoelectric element D (and the plate P if necessary) and the potential of the guide member GK are separated from each other.

In this example, the photoelectric element is, for example, a PIN photodiode with terminals An+Ka.

As can be seen from FIGS. 7 and 8, light enters the photoelectric element from the back side thereof. This is to minimize the input capacitance of the amplification element (3) shown in FIG.

In the example of FIG. 10, the amplifying element V is placed near a photoelectric element, which is a PIN photodiode. However, the amplifying element V may also be constructed integrally with a diode, as described, for example, in German Patent Application No. 3409146. By reducing the input capacitance of the amplification element V and making the high frequency line between the amplification element and the photoelectric element extremely short as in this example, the pit rate measured in Mbit/s can be extremely increased. I can do it.

For example, if the input capacitance acting on the amplification element (2) is 0.5. It is advantageous to construct and arrange the photoelectric element, which is a photodiode, so that it is as small as possible than , F. Unless another surface with no potential is provided on the anode side,
The PIN photodiode itself has a capacitance of, for example, 0.3 pF between its pn junction and the contact pad.

According to such a configuration, when the photoelectric element is operated, 50
Bit rates of Mbit/s or higher can be obtained.

As can be seen in FIG. 7.8.11, the photoelectric element is arranged on the back side of the stepped hole LO in the plate P. This is to prevent the phenomenon of vignetting from occurring. However, instead of the stepped LOO as shown in the figure, a circular hole may be used, for example. The plate P with the circular light beam-guiding holes O can be sintered, for example, by a continuous process. Further, the light beam itself forms an angle of 60 degrees with respect to the photoelectric element when it is emitted from a spherical lens K having a refractive index of 1.5, for example. Further, in order to form the above-mentioned hole LO, it is possible to use a method other than the continuous method, and for example, the hole may be formed using a Lede beam, an ultrasonic wave, a diamond drill, or the like. In this case, when the shape of the hole LO is circular, care must be taken to ensure that the angle is accurate. It is also necessary to avoid the inclination of the hole axis and the sharpness of the ridge line at the transition to the plate surface. In any case, hole LO
must be constructed as follows: This means that, from all points of view, there is an optimum optical coupling between the glass fiber end N and the photoactive part of the optoelectronic element, and an optimum adjustment position is obtained without vignetting.

Plate P is unfired ceramic, Al2O3+'
It is manufactured from BeO or the like by, for example, sintering or punching. In the case of sintering, for example, a continuous method is used. Alternatively, it can be produced by pressing a thick film paste or by superposing two layers, for example 200 microns thick, as shown in FIG. Regardless of whether continuous sintering or pressing techniques are used, circular or stepped holes LO with accurate shape and dimensions can be obtained. To form such a hole,
It is possible to use a combination of a plurality of methods such as pressing, Ledebeam drilling, ultrasonic drilling, and diamond drilling, which is also advantageous in terms of cost. However, the plate P can also be formed only by pressing technology.

This method is more economical and advantageous when the production quantity is extremely large.

A circuit as shown in FIG. 9, for example, is provided on the board P. This circuit has an amplification element V which is a preamplifier,
Its outputs Q, Q are connected to a postamplifier v2 located outside the shield As. At this time, if the plate P is made up of two insulated layers as shown in Figure 7.8 (such a configuration is also possible in principle in the embodiment shown in Figure 2.6). ), an additional electrically shielding metal surface MS is provided inside the plate P (see FIG. 8). If necessary, this metal surface MS can also be designed, for example, as an electrode of a capacitor, in order to conduct a potential. The metallized layer MLX (FIG. 8) provided on the metal surface MS and the surface of the plate P is used for other elements,
For example, it can also be used to attach capacitors. As such an element, for example, No. 7.8.9.1
Capacitor CK shown in Figure 1.

CB and its electrodes as shown in Figure 9.10.11.

Therefore, on both sides of the plate P, there is almost no room for attaching other elements such as capacitors. For example, a metallized surface MS with a size quantity of 2.

For example, if MLX is provided at intervals of 0.2, for example, 0.2.
A capacitance of 3 pF results. This capacitance can be utilized based on high frequency technology.

In addition to the photoelectric elements, additional electronic elements such as the above-mentioned capacitors and their connecting lines are provided on both sides of the plate P (see FIG. 10.11).

Such a configuration can be easily realized using unfired ceramic.

On the back side of the plate P, the mounting portion of the introduction tube 2 which is fused to the guide member GK is configured as a bottomed hole (No. 7.
8. (See Figure 10). A good contact portion ML is provided from this bottomed hole to the surface of the plate P, and this contact portion and the introduction pin Z are fixed to each other by brazing or a silver conductive adhesive material L. Therefore, sufficient mechanical strength can be obtained. The introduction pin 2 can also be directly fixed to the surface of the plate P without providing such a bottomed hole. However, in this case, although a sufficient electrical contact relationship can be obtained, mechanical strength is insufficient.

In other words, it is not strong enough to withstand vibration tests or ioooy mechanical shock tests.

When a bottomed hole is used, the surface parallel to the axis of the introduction pin 2 can also be used for attachment, and the tolerances are also sufficiently small. in this case,
Both the end and surface of the lead-in pin are used for electrical contact.

After the plate P has been attached to the introduction pin 2 and thus to the guide member GK, it is almost impossible to mechanically touch the photoelectric element, for example a PIN diode. Therefore, the photoelectric element is mechanically protected except for the hole LO. However, the photoelectric device, which is a PIN photodiode, for example, can be electrically inspected, defect analyzed, etc. via the introduction pin Z. Such a function can be achieved, for example, by the diode “
This is necessary for burn-in, retention tests, quality tests, etc. In that case, if necessary, such a test can be carried out independently of the function of the amplifier element (2).

Effects of the Invention According to the photoelectric module casing of the present invention, the optimum adjustment position where the degree of optical coupling is maximized between the photoelectric element and the end of the glass fiber can be found accurately and easily, and the photoelectric element can be placed at this optimum adjustment position. can be fixed.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing an embodiment of a plate provided with a photoelectric element and an amplification element, FIG. 2 is a sectional view of an embodiment of a photoelectric module casing according to the present invention using the plate of FIG. 1, and FIG.
The figures show another embodiment of the module casing according to the invention, which is inserted into the conductor plate via the connection pin and brazed. Figure 5 shows an example of mounting with good heat conduction using many spot welds, Figure 6 shows an example of mounting by Rede welding, such as spot welding, and Figure 7 shows an example of mounting by spot welding. FIG. 8 is an enlarged view of FIG. 7; FIG. 9 is an enlarged view of FIG. 7; The figure shows a circuit device having the photoelectric element shown in FIG. 8 and attached to the plate P, FIG. 10 is a plan view showing the front side of the plate on which the circuit device shown in FIG. 9 is installed, and FIG. is a plan view showing the back side of the board. G...Housing, W...Lid, S...Glass fiber connector part, M...Glass fiber jacket, X
...Sheath, Y...Stopper, L...Glass fiber/'e1E...Adjustment frame, P...Plate, A...
Adjustment surface, K...lens system, N...glass fiber end, ■...amplification element, T...carrier, F...high frequency element, R...pre-resistance, engineering...・Glass insulation part, 2・
...Introduction pin, U...Amplifier component, zG...Connection pin, LS...Laser beam, LF...Fixing point, Jus, z, Jus, x-y -...Arm,
GK...guide member, LO...hole. IG9 1 Cao 1-V2 Seal ■ ■ Continuation of 1st page Priority claim @1984￥-August 8 [Phase] West Toy @ Inventor Hans-Georg Rosen [Phase] Inventor Lothar Schweta @ Inventor Werner Schwedt 0 Inventor Bernd Seibert @ Inventor Helmuth Hanchnorton (DE) [Phase] P3429282.9 Federal Republic of Germany Hohenschieftraan-Vuidennjutrasse 72 Federal Republic of Germany Anveiler am Klingel Berg 21 Holzkirche-Burgstalerstrasse, Federal Republic of Biiso lO Otztobrunn-Putzbruner-Strasse, Federal Republic of Jiso 78 Munich, Federal Republic of Jiso 50 Wuernerfriedma/-Bogen 18

Claims (1)

[Claims] 1. A glass fiber connector part (S) for transmitting and receiving light modulated with information is provided, and the glass fiber connector part is separated from the glass fiber end part (N) by a predetermined distance. An adjustment frame (E) is provided which has an adjustment surface (A) and is fixed to the adjustment surface (A), and a photoelectric element (E) for transmitting and receiving light is provided in the adjustment frame (E).
In the photoelectric module casing provided with D), the photoelectric element (D) is mounted on the plate (P), and the degree of optical coupling between the photoelectric element (D) and the glass fiber (L) is measured. while determining the optimum adjustment position of the photoelectric element; - the plate (p) moves the inside (c) of the adjustment frame (E) in the first of three three-dimensional coordinate directions perpendicular to each other; Direction <
2>, and the plate (p) is finally fixed to the adjustment frame (E) at the optimum adjustment position, and the adjustment frame (E) also measures the degree of optical coupling. While the photoelectric element (D) is being adjusted, the optimum adjustment position of the photoelectric element (D) is determined, and the adjustment surface (A) is moved in two directions (X+) perpendicular to the first direction (, Z').
A photovoltaic module casing, characterized in that it is freely movable in y) and is fixed to the adjustment surface (A) in the optimum adjustment position. 2. The distance from the glass fiber end (N') to the adjustment surface (A) is substantially the same as the glass fiber connector part (S).
2. A device according to claim 1, which is formed of one or more rigid sections between the glass fiber end (N) and the adjustment surface (A), which section expands only slightly even at high temperatures. Photoelectric module casing. 3. The first direction (2) of the three-dimensional coordinates in which the plate (P) moves is
The axial direction of the glass fiber (L) and the photoelectric element (D
3. The optoelectronic module casing according to claim 1 or 2, which at least substantially coincides with the photoactive direction of ). 4. The photoelectric element (D) is fixed to the plate (P) on the opposite side to the glass fiber end (N), and
4. The photovoltaic module casing according to claim 1, wherein the photovoltaic module casing is arranged after the hole (LO) of the plate (p) when viewed from N). 5. The plate (P) is indirectly or directly connected to the guide member (GK)
the first position in the adjustment frame (E).
The photoelectric module according to any one of claims 1 to 4, wherein only the guide member (GK) that moves in the three-dimensional coordinate direction (Z) is finally fixed to the adjustment frame (E). casing. 6. Any one of claims 1 to 5, wherein at least one lens is provided between the glass fiber end (, N) and the optimal adjustment position of the photoelectric element (D).
Photoelectric sojoule casing as described in section. Z-plate (p) is fixed directly or indirectly in its optimal position by Rede welding into the adjustment frame (g), which adjustment frame (E) is also fixed to the adjustment surface (A) in its optimal position by laser welding. Claim 1 to be fixed
The photoelectric module casing according to any one of Items 7 to 7. 8. Claims in which at least one amplification element (V) is provided near the photoelectric element (D) on the plate (P), and the amplification element is connected to the photoelectric element (D) at high frequency. The photoelectric module casing according to any one of items 1 to 7. 9. The plate (p) has or forms a grounded metal surface, and at least one amplifier component (U) is provided on the side of the plate opposite the optoelectronic element (D), and the amplifier component (U) 9. The photovoltaic device according to claim 1, wherein the component is connected indirectly or directly to the photovoltaic element (D) via at least one insulated line (Z). module casing.