JPS60216988A - High-output laser beam machining device - Google Patents
High-output laser beam machining deviceInfo
- Publication number
- JPS60216988A JPS60216988A JP59072706A JP7270684A JPS60216988A JP S60216988 A JPS60216988 A JP S60216988A JP 59072706 A JP59072706 A JP 59072706A JP 7270684 A JP7270684 A JP 7270684A JP S60216988 A JPS60216988 A JP S60216988A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- laser beam
- light
- mirror
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/035—Aligning the laser beam
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は不安定形共振器を備えたレーザ加工装置に係シ
、特に、レーザ光の光軸監視および被加工物の位置決め
に好適なレーザ加工装置に関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a laser processing device equipped with an unstable resonator, and particularly to a laser processing device suitable for monitoring the optical axis of a laser beam and positioning a workpiece. Regarding.
近年、高出力で比較的集束性の良いレーザビームを発生
させることのできるものとして不安定形の共振器をもつ
レーザ発振装置が開発されている。In recent years, a laser oscillation device having an unstable resonator has been developed as a device capable of generating a high-output laser beam with relatively good focusability.
従来の安定形弁振器を持つレーザ発振器では、そのレー
ザビーム光は、中実ビームとして14!2.シ出され、
加工等に利用されているが、不安定形共振器の場合、レ
ーザビームは、リング状ビームとなる。In a conventional laser oscillator with a stable valve oscillator, the laser beam light is 14!2. It was released,
It is used for processing, etc., but in the case of an unstable resonator, the laser beam becomes a ring-shaped beam.
この点が、安定形弁振器と不安定形共振器における大き
な違いである。従来の安定形弁振器を備えし鏡および集
光鏡では、レーザビームが中実であるため、孔開き鏡を
用いることは不可能であった。This point is the major difference between stable valve resonators and unstable resonators. With conventional stabilized oscillator mirrors and condensing mirrors, the use of apertured mirrors was not possible due to the solid nature of the laser beam.
又、C02レーザ光の様に非可視光のレーザビームの光
軸を監視したシ、被加工物上のビーム位置、焦点位置を
確認するためには、CO2レーザビームの光軸をしゃ断
して、可視光であるHeNeレーザ光をCO2レーザビ
ーム光軸と一致する様に配置したシ、ビームスプリッタ
−を配置しなければならないという問題を生じていた。In addition, when monitoring the optical axis of a non-visible laser beam such as a CO2 laser beam, in order to check the beam position and focal position on the workpiece, the optical axis of the CO2 laser beam must be cut off. When the HeNe laser beam, which is visible light, is arranged so as to coincide with the optical axis of the CO2 laser beam, a problem arises in that a beam splitter must be arranged.
本発明の目的は、非可視光である加工用レーザ光路をし
ゃ断することなく、被加工物面上の加工用レーザ光のビ
ーム位置、焦点位置を確認することのできる、高出力レ
ーザ加工装置を提供するにある。An object of the present invention is to provide a high-power laser processing device that can confirm the beam position and focal position of a processing laser beam on a workpiece surface without interrupting the processing laser beam path, which is invisible light. It is on offer.
不安定共振器形レーザ装置から発振するレーザビームは
、リング状レーザビームであることから、折り返し鏡お
よび集光鏡を孔開き鏡とすることができる。本発明の要
点はその孔開き部を利用し、折シ返し鏡および集光鏡の
裏面側より、リング状レーザビームと同軸上に可視光を
入射させることにある。Since the laser beam oscillated from the unstable resonator laser device is a ring-shaped laser beam, the folding mirror and the condensing mirror can be perforated mirrors. The key point of the present invention is to make use of the hole to allow visible light to enter coaxially with the ring-shaped laser beam from the back side of the folding mirror and the condensing mirror.
第1図には不安定形共振器をもつレーザ装置の概略を示
す。図中4は不安定形共振器凸面鏡で、この凸面鏡4の
前方にはレーザビームを取り出すための不安定形共振器
凸面鏡5とレーザビームを反射する不定形共振器凹面鏡
3とが配置さnておシ、それぞれは共振器外壁2人に取
シ付けられている。励起されたレーザ媒質1(CO2レ
ーザでハ、C’021N21 He等ン中を凸面鏡4と
凹面鏡3の間をレーザ光6が結合*5の孔部7を通って
増幅し、結合鏡5の鏡面8に入射したレーザビームは、
リング状ビーム6aとなり、外壁2Bに取シ付けられた
出力取り出し思9を通過して、リング状ビーム6bとな
って外部に取力出される。その時のリング状レーザビー
ムの形状図全第2図に示す。FIG. 1 schematically shows a laser device with an unstable resonator. In the figure, 4 is an unstable resonator convex mirror, and in front of this convex mirror 4, an unstable resonator convex mirror 5 for taking out the laser beam and an irregular resonator concave mirror 3 for reflecting the laser beam are arranged. , each attached to two outer walls of the resonator. Laser light 6 is amplified in the excited laser medium 1 (CO2 laser, C'021N21 He, etc.) between the convex mirror 4 and the concave mirror 3 through the hole 7 of the coupling*5, and the mirror surface of the coupling mirror 5 is amplified. The laser beam incident on 8 is
The beam becomes a ring-shaped beam 6a, passes through an output extractor 9 attached to the outer wall 2B, and is outputted to the outside as a ring-shaped beam 6b. A complete diagram of the shape of the ring-shaped laser beam at that time is shown in FIG.
リング状レーザビームをレーザ加工に用いる場合の本発
明の一実施例を第3図にょシ説明する。An embodiment of the present invention in which a ring-shaped laser beam is used for laser processing will be described with reference to FIG.
リング状レーザビーム6bは、支持具11に止金具12
よって固定された孔開き平面鏡13の反射面13aに入
射し、反射光6Cは、集光レンズホルダー14に固定さ
れた集光レンズ15を通シ、集光ビーム6dとなって被
加工物16に照射され、被加工物16を切断、溶接等の
レーザ加工を行なう。支持具11には可視光であるH
e N eレーザ発振器10が固定されておシ、その光
軸は、孔開き平面鏡13によシ折り返し反射されたリン
グ状レーザ光6Cと同一軸となる様に配置され、HeN
eレーザ発振器10よシ出たH e N eレーザ光1
7aヶよ、孔開き平面鏡13の孔部13bを通過し、集
光レンズを通って集光ビーム17bとなって被加工物1
6に照射される。The ring-shaped laser beam 6b is attached to the support 11 by the stopper 12.
Therefore, the reflected light 6C enters the reflecting surface 13a of the fixed perforated plane mirror 13, passes through the condensing lens 15 fixed to the condensing lens holder 14, becomes a condensed beam 6d, and hits the workpiece 16. The laser beam irradiates the workpiece 16 and performs laser processing such as cutting and welding. The support 11 is equipped with visible light H.
The eN e laser oscillator 10 is fixed and arranged so that its optical axis is coaxial with the ring-shaped laser beam 6C that is reflected back by the apertured plane mirror 13.
H e N e laser beam 1 emitted from the e laser oscillator 10
7a, it passes through the hole 13b of the perforated plane mirror 13, passes through the condensing lens, becomes a condensed beam 17b, and emits the workpiece 1.
6 is irradiated.
本構成では加工用レーザ光6cを集光するレンズとHe
Neレーザ光17aを集光するレンズを1枚の集巻レン
ズ15で共用することができるため、安価な方法で加工
用レーザ光6dとHeNeレーザHeNeレーザ発振器
10のレーザ光の発散角が大きい場合には、ビーム径お
よび、発散角を任意に変更できるコリメータをHeNe
レーザ10に具備することで、さらに、高精度の焦点位
置の確認が可能となる。本実施列では、集光レンズによ
るレーザ加工に本発明を適用した場合について、説明し
声が。集光凹面鏡もしくは、集光放電面鏡を用いた構成
でも本発明は適用でき、その実施例を第4図に示す。リ
ング状レーザビーム6bは、支持具・18に固定金具2
2によって取り付けられた集光用孔開き凹面鏡21に入
射し、反射面21aよシ集光され、集光ビーム6dとな
って被加工物16に照射される。一方、支持具18に光
軸が集光ビーム6dと同一光軸になる様に配置されたH
eNeレーザ光発振器10より出たH e N eレー
ザ光17aは、集光ビーム6dの焦点位置と同一焦点位
置になるように支持具18内に固定金具20によって配
置されたHeNeレーザ光集光レンズ19を通り孔部2
1bを通って、集光ビーム17bJ−4:t、2 f)
”1 r l−Iff F h +n丁FE <h 専
J t−4パとHeNe集光ビーム17bは同一点で焦
点となる。In this configuration, a lens for condensing the processing laser beam 6c and a He
Since the lens for condensing the Ne laser beam 17a can be shared by one condensing lens 15, it is possible to use an inexpensive method when the divergence angle of the processing laser beam 6d and the laser beam of the HeNe laser oscillator 10 is large. For this purpose, a collimator that can arbitrarily change the beam diameter and divergence angle is installed in HeNe.
By equipping the laser 10, it becomes possible to confirm the focal position with even higher accuracy. In this implementation column, we will explain the case where the present invention is applied to laser processing using a condensing lens. The present invention can also be applied to a structure using a condensing concave mirror or a condensing discharge mirror, and an example thereof is shown in FIG. The ring-shaped laser beam 6b is attached to the fixture 2 by the support 18.
The light enters the concave concave mirror 21 with a hole for focusing, which is attached by the lens 2, is focused on the reflecting surface 21a, and is irradiated onto the workpiece 16 as a focused beam 6d. On the other hand, a H
The H e Ne laser beam 17a emitted from the eNe laser beam oscillator 10 is passed through a HeNe laser beam condensing lens that is placed in the support 18 by a fixing fitting 20 so that the focal position is the same as that of the condensed beam 6d. 19 through hole 2
1b through the focused beam 17bJ-4:t, 2f)
``1 r l-Iff F h +n FE <h Special J t-4 and the HeNe focused beam 17b are focused at the same point.
本構成では、HeNeL’−ザ発生装置10、HeNe
V−ザ集光レンズ19、加工レーザ集光用孔開き凹面鏡
21が支持具18に一体に固定されているので、加工用
集光ビーム6dとHeNe集光ビーム17bの焦点位置
は常に同一点にすることができる。In this configuration, the HeNeL'-the generator 10, the HeNe
Since the V-za focusing lens 19 and the apertured concave mirror 21 for processing laser focusing are integrally fixed to the support 18, the focal positions of the processing focused beam 6d and the HeNe focused beam 17b are always at the same point. can do.
本発明によれば、非可視光である、加工用レーザ光と、
可視光であるHeNeレーザ光の焦点位置を同一点にす
ることができるので、被加工物上における加工用レーザ
光の、ビーム位置および焦点位置をHeNeレーザ光で
確認できる様になシ、被加工物の位置決め精匿が高くな
シ、被加工物のセット時間を短くできる効果がある。According to the present invention, processing laser light, which is invisible light,
Since the focal position of the HeNe laser light, which is visible light, can be set to the same point, it is possible to check the beam position and focal position of the processing laser light on the workpiece using the HeNe laser light. The accuracy of positioning the object is high, and the setting time for the workpiece can be shortened.
第1図は不安定形共振器をもつレーザ発振器の概略図、
第2図は、不安定形共振器よシ発振するリング状レーザ
ビームの形状図、第3図は本発明の一実施例における縦
断面図、第4図は本発明の応用例の縦断面図である。
6b・・・リンク状レーザビーム、1o・・・HeNe
レーザ光、13・・・折シ返し孔開き平面鏡、19・・
・HeNeレーザ集光レンズ、21・・・集光用孔開き
凹面鏡。
代理人 弁理士 高橋明夫
弔1図
県2図
も3図
も4図Figure 1 is a schematic diagram of a laser oscillator with an unstable resonator.
Fig. 2 is a diagram showing the shape of a ring-shaped laser beam oscillated by an unstable resonator, Fig. 3 is a longitudinal cross-sectional view of an embodiment of the present invention, and Fig. 4 is a longitudinal cross-sectional view of an application example of the present invention. be. 6b...link-shaped laser beam, 1o...HeNe
Laser light, 13... Folded hole-opening plane mirror, 19...
- HeNe laser condensing lens, 21... concave mirror with a hole for condensing light. Agent Patent Attorney Akio Takahashi Figure 1 Prefecture Figure 2, Figure 3, Figure 4
Claims (1)
されたリング状のレーザビームを折す返えす孔開き鏡を
備えたレーザ加工装置において、前記折シ返えし孔開き
鏡によって反射される前記リング状レーザビームの光軸
と同一光軸上に入射する可視レーザ光発生装置を備えた
ことを特徴とする高出力レーザ加工装置。 2、特許請求の範囲第1項において、 前記折シ返えし孔開きv#、を前記リング状レーザビー
ムの集光用の前記孔開き折シ返し鏡としたことを特徴と
する高出力レーザ加工装置。 3、特許請求の範囲第2項において、前記リング状レー
ザビームと同一光軸上を通過する様に配設された前記可
視レーザ光発生装置との間に可視レーザ光集光用レンズ
を備えたことを特徴とする高出力レーザ加工装置。 おいて、 前記可視レーザ光の発散および集光角度、および〈−ム
・径を任意に変えられるコリメータを備えたことを特徴
とする高出力レーザ加工装置。[Claims] 1. In a laser processing device equipped with an apertured mirror that folds back a ring-shaped laser beam taken out from a laser processing device equipped with an unstable resonator, the folding A high-output laser processing apparatus characterized by comprising a visible laser beam generating device that is incident on the same optical axis as the optical axis of the ring-shaped laser beam reflected by the perforated mirror. 2. A high-output laser according to claim 1, wherein the folded folded aperture v# is the folded folded mirror for condensing the ring-shaped laser beam. Processing equipment. 3. In claim 2, a lens for condensing visible laser light is provided between the ring-shaped laser beam and the visible laser light generator disposed so as to pass on the same optical axis. High-power laser processing equipment characterized by: A high-power laser processing apparatus characterized by comprising a collimator that can arbitrarily change the divergence and convergence angle of the visible laser beam, as well as the diameter and diameter of the visible laser beam.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59072706A JPS60216988A (en) | 1984-04-13 | 1984-04-13 | High-output laser beam machining device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59072706A JPS60216988A (en) | 1984-04-13 | 1984-04-13 | High-output laser beam machining device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60216988A true JPS60216988A (en) | 1985-10-30 |
Family
ID=13497060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59072706A Pending JPS60216988A (en) | 1984-04-13 | 1984-04-13 | High-output laser beam machining device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60216988A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7605979B2 (en) | 2005-04-19 | 2009-10-20 | Koninklijke Philips Electronics N.V. | Device for directing radiation to a layer, apparatus with such device and method using such apparatus |
CN114523207A (en) * | 2022-03-02 | 2022-05-24 | 河北科技大学 | Laser welding device, laser welding equipment and laser welding method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5843420A (en) * | 1981-09-08 | 1983-03-14 | Matsushita Electric Ind Co Ltd | External optical device for laser |
-
1984
- 1984-04-13 JP JP59072706A patent/JPS60216988A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5843420A (en) * | 1981-09-08 | 1983-03-14 | Matsushita Electric Ind Co Ltd | External optical device for laser |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7605979B2 (en) | 2005-04-19 | 2009-10-20 | Koninklijke Philips Electronics N.V. | Device for directing radiation to a layer, apparatus with such device and method using such apparatus |
CN114523207A (en) * | 2022-03-02 | 2022-05-24 | 河北科技大学 | Laser welding device, laser welding equipment and laser welding method |
CN114523207B (en) * | 2022-03-02 | 2024-03-29 | 河北科技大学 | Laser welding method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH11347758A (en) | Super precision machining device | |
US4391519A (en) | Axis-monitoring apparatus for a laser beam | |
US3622739A (en) | Device for the production of a laser beam for drilling watch jewels | |
WO1990013390A1 (en) | Laser beam machining device | |
JPS60216988A (en) | High-output laser beam machining device | |
JPH01245992A (en) | Multiwavelength laser beam machine | |
JPH0332484A (en) | Laser beam machine | |
JP2000227576A (en) | Emission optical system for laser processing device | |
JPH0722685A (en) | Focus composition method of beam and its focus composition device | |
JPS61163681A (en) | Laser device for forming micro-beam | |
JP3177775B2 (en) | Photosynthesis method and synthetic emission optical system | |
JPH01192492A (en) | Laser processing device | |
JP2000126886A (en) | Laser beam irradiation device | |
JP3499345B2 (en) | Laser processing equipment | |
JPH01233085A (en) | Laser welding method | |
JPS60239078A (en) | Solid-state laser oscillator | |
JPH0126198B2 (en) | ||
JPH0727994A (en) | Beam distribution uniformizing device | |
JPH0241607Y2 (en) | ||
JPH06314832A (en) | Laser device | |
JPH0259038B2 (en) | ||
JPS58122195A (en) | Laser working method | |
JP3383217B2 (en) | Solid state laser device | |
JPH09223834A (en) | Laser processing apparatus | |
JPH0369180A (en) | Semiconductor laser excitation solid laser |