JPS60216600A - Containing jig - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in jigs for housing semiconductor devices such as ICs and LSIs.

For example, Japanese Patent Publication No. 140681/1987 discloses a cylindrical magazine for electronic components.

Conventionally, in the manufacturing process of IC'PL S I, in the process after the sealing process (resin mold or glass sealing),
A storage jig called a magazine made of K, such as metal or glass stick, is used to transfer between machines for post-process processing and inspection processes, to transport between processes, and to ship products. ing.

As shown in Fig. 1, this magazine has a relatively long and cylindrical shape, with both ends of the main body being open (only one end opening 10B is shown), and the upper part being provided with an IOA extending in the longitudinal direction. A semiconductor device, for example, an in-line type IC 20 having leads 20A and 20B is placed on the internal platform 11. However, the shape and constituent materials of the semiconductor device mounting portion 11 (problems may occur if the frictional resistance is large) may cause problems with semiconductor products (such as 20).
Frictional resistance between the two often reduces the workability of product transfer, which allows the product to slide satisfactorily. Also, under the product packaging i! In cases where iK markings are applied, surface contact between the surfaces of the mounted m1lK packages often causes mark erasure failure.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a novel magazine for semiconductor devices that allows efficient product transfer work and prevents the occurrence of mark erasure defects.

Figures 2 to 4 show various rail-like protrusions made of the same material (all set or plastic) as the magazine's constituent material on the internal semiconductor device mounting portion 11 of the magazine shown in Figure 1 above. The second example shows the examples provided.
The figure shows an example in which a pair of rail-like protrusions 12 a s l 2 b are formed so as to cut out from both sides of the mounting part 11, and FIG. .

13c1 shows an example in which it is formed on the upper surface of the placing part 11, and
The figure shows an example in which a large number of rail-like protrusions 14 having a sawtooth cross section are formed on the upper surface of the mounting portion 11.

In any of the examples shown in FIGS. 2 to 4, products such as the IC20 come into point contact with the rail-like protrusions, so there is little frictional resistance and they can slide smoothly. Since the contact area is small, marks made on the package surface are unlikely to disappear as the product slides.

However, with the protrusion structure that supports the bottom surface as described above, the cross-sectional area increases by the amount of the protrusion, and there are also problems such as making it unstable for ICs etc. to sit inside the magazine. be.

The present invention has been made to solve these problems, and the gist thereof is to provide a substantially cylindrical structure that accommodates a large number of dual in-line electronic components arranged in a row. A storage jig characterized in that the storage jig has two supporting protrusions extending in the longitudinal direction and corresponding to the leads in both directions for supporting the leads of the electronic component from one side. That is.

The present invention will be described below with reference to embodiments shown in the accompanying drawings.

5 and 6 show an example in which the rail-like projections are made of a material different from that of the mounting portion 11. FIG. In the structure shown in FIG. 5, a rail-shaped projection 15a is provided on the upper surface of the mounting portion 11 made of plastic, for example.

The metal piece 15 having the metal piece 15b is fixed with adhesive, and the leads of a product such as an IC 20 are supported by the rail-like protrusions 15a and 15b. In the case of FIG. 6, metal pieces 16A and 16B each having an angular cross-section are embedded and fixed in a plastic mounting portion 11, and a rail-like protrusion 16a constituted by the upward protrusion of these metal pieces is formed. IC2 with e 16 b
It is now supporting the lead of products such as 0.

According to the configuration shown in FIGS. 5 and 6, the rail-like protrusions hold and slide the leads, so the product can be moved extremely smoothly, and the package surface of the product is Since it does not come into direct contact with the rail-like protrusions, it is completely prevented from erasing the mark due to product sliding.

As is clear from the above, in the magazine according to the present invention, since the rail-like protrusion is attached to the semiconductor device mounting section, sliding movement of the product is extremely easy, and the product and the mounting section are easily connected. Since the contact area is extremely small, it is extremely useful for efficient product transfer operations and for preventing marks from disappearing.

In addition, since the lead itself is supported by the 5) CL, deformation of the lead due to I-ndling can be minimized. Furthermore, it is possible to provide a magazine that is more compact than conventional magazines.

[Brief explanation of the drawing]

FIG. 1 +-i1 A perspective view showing a part of a magazine storing ICs to which the present invention is applied, and FIG. 2 to FIG. 4 show various semiconductor device mounting parts in the magazine shown in FIG. FIGS. 5 and 6 are cross-sectional views of a magazine according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 10... Magazine main body, 11... Semiconductor device mounting part, 12a*12bs13a-13cm14s15a. 15b, 16a, 16b - rail-like projections, 20...
C0

Claims (1)

[Claims] 1. It is a storage jig with a mysterious cylindrical shape that accommodates a large number of in-line electronic components arranged in a row, and is a lead for the electronic components mentioned above! A storage jig characterized by having two supporting protrusions corresponding to the leads in both directions extending in the longitudinal direction for supporting from one side.