JPS6021534A - Circuit mounting structure - Google Patents

Circuit mounting structure

Info

Publication number
JPS6021534A
JPS6021534A JP58128959A JP12895983A JPS6021534A JP S6021534 A JPS6021534 A JP S6021534A JP 58128959 A JP58128959 A JP 58128959A JP 12895983 A JP12895983 A JP 12895983A JP S6021534 A JPS6021534 A JP S6021534A
Authority
JP
Japan
Prior art keywords
substrate
solder
chip
thickness
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58128959A
Other languages
Japanese (ja)
Inventor
Kunio Sakuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP58128959A priority Critical patent/JPS6021534A/en
Publication of JPS6021534A publication Critical patent/JPS6021534A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Abstract

PURPOSE:To realize reduction in thickness of a wrist watch while keeping the reliability level of a circuit block thereof by face down bonding of integrated circuit element having a solder bump to a flexible circuit substrate with copper foil and keeping an interval between substrate conductor pattern surface and integrated circuit element surface to the particular range. CONSTITUTION:An IC chip with a side of 2-4mm. having a solder bump 3 comprising a nickel core 2 in the thickness of about 15mum is used and a flexible circuit substrate with copper foil is used as a substrate 5. The IC chip 1 and substrate lead is aligned in position and are heated for joining. On the occasion of such heating, the IC chip is heated from the rear surface. Thereby, the surface of nickel core 2 in the solder bump 3 and substrate lead surface are forced to join in such a condition as they are in contact and clearance between the IC chip and substrate is always kept at 10-20mum. The solder perfectly surrounds the substrate lead up to the side surface by setting amount of solder of bump to the thickness of about 40mum and the joining condition where edge short-circuit by flow of solder is not generated can be obtained.
JP58128959A 1983-07-15 1983-07-15 Circuit mounting structure Pending JPS6021534A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58128959A JPS6021534A (en) 1983-07-15 1983-07-15 Circuit mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58128959A JPS6021534A (en) 1983-07-15 1983-07-15 Circuit mounting structure

Publications (1)

Publication Number Publication Date
JPS6021534A true JPS6021534A (en) 1985-02-02

Family

ID=14997639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58128959A Pending JPS6021534A (en) 1983-07-15 1983-07-15 Circuit mounting structure

Country Status (1)

Country Link
JP (1) JPS6021534A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0489045A (en) * 1990-07-30 1992-03-23 Agency Of Ind Science & Technol Sterilizing/cleaning method for intra-body insertion medical apparatus
JPH0766242A (en) * 1993-08-20 1995-03-10 Internatl Business Mach Corp <Ibm> Electronic element assembly, and reprocessing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5023977A (en) * 1973-07-04 1975-03-14
JPS5660025A (en) * 1979-10-19 1981-05-23 Sharp Corp Bonding method for semiconductor element

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5023977A (en) * 1973-07-04 1975-03-14
JPS5660025A (en) * 1979-10-19 1981-05-23 Sharp Corp Bonding method for semiconductor element

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0489045A (en) * 1990-07-30 1992-03-23 Agency Of Ind Science & Technol Sterilizing/cleaning method for intra-body insertion medical apparatus
JPH064077B2 (en) * 1990-07-30 1994-01-19 工業技術院長 Method for sterilizing and cleaning medical instruments inserted into the body
JPH0766242A (en) * 1993-08-20 1995-03-10 Internatl Business Mach Corp <Ibm> Electronic element assembly, and reprocessing method thereof

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