JPS60208318A - Production of improved phenolic resin - Google Patents

Production of improved phenolic resin

Info

Publication number
JPS60208318A
JPS60208318A JP6532484A JP6532484A JPS60208318A JP S60208318 A JPS60208318 A JP S60208318A JP 6532484 A JP6532484 A JP 6532484A JP 6532484 A JP6532484 A JP 6532484A JP S60208318 A JPS60208318 A JP S60208318A
Authority
JP
Japan
Prior art keywords
phenolic resin
resin
production
compound
reacting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6532484A
Other languages
Japanese (ja)
Inventor
Saburo Amano
天野 三郎
Junichi Kuno
久野 純一
Yoshitsugu Ishizuka
石塚 義次
Yuji Baba
裕二 馬場
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Asahi Denka Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Denka Kogyo KK filed Critical Asahi Denka Kogyo KK
Priority to JP6532484A priority Critical patent/JPS60208318A/en
Publication of JPS60208318A publication Critical patent/JPS60208318A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain the titled resin having improved heat resistance without deteriorating strength, electrical characteristics, adhesive property, processability, etc., by adding or reacting a dialkyl N-alkylaminomethyl phosphonate compound with a phenolic resin. CONSTITUTION:Phenol and formalin are reacted under heating to produce a phenolic resin. In the process, a compound expressed by the formula (R<1> and R<2> are 1-4C alkyl; R<3> is 4-18C alkyl), e.g. diethyl N-octylaminoethyl phosphonate, is added or reacted with the phenolic resin to give the aimed resin. The compound expressed by the formula can be synthesized by reacting a primary amine with formaldehyde or a derivative thereof and a trialkyl phosphite.

Description

【発明の詳細な説明】 本発明は改良されたフェノール樹脂の製造法に関するも
のである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improved method for making phenolic resins.

絆しくけ、フェノール樹脂の諸物性、特に耐燃性につい
ての改良法に関するものである。
This paper relates to methods for improving the physical properties of phenolic resins, especially flame resistance.

これまで行なわれてきたフェノール樹脂の耐燃化け、テ
トラブロムビスフェノールAsF’)クレジルホスフェ
ート、トリフェニルホスフェート、リン酸アンモン等の
ハロゲンあるいはリン化合物を添加する方法によってい
たが、充分な耐燃性を得るには、その添加−が増加し機
械的強度、短気特性の低下、層間接着力、打抜加工性の
低下等、諸物性、加工性の低下はさけられなかった。
Up until now, the flame retardant of phenol resin has been achieved by adding halogen or phosphorus compounds such as tetrabromobisphenol (AsF') cresyl phosphate, triphenyl phosphate, ammonium phosphate, etc., but it has not been possible to obtain sufficient flame resistance. As its addition increases, various physical properties and processability are unavoidable, such as a decrease in mechanical strength, short-temperature properties, interlayer adhesion, and punching processability.

これらを改良するものとして、ジエチル−N、N−ビス
(2−ヒドロキシエチル)アミンメチルホスホネートを
添加反応させる方法(%開昭56−49722号公報)
があるが、この化合物とフェノール類、アルデヒド類と
の反応性は低く、根本的な解決には至っていない。
As a method for improving these, a method of adding and reacting diethyl-N,N-bis(2-hydroxyethyl)amine methylphosphonate (% JP-A-56-49722)
However, the reactivity of this compound with phenols and aldehydes is low, and no fundamental solution has been reached.

本発明は、フェノール類やアルデヒド類と東質的に反応
するリン化合物、具体的には−NH基を含有する、アミ
ノメチルホスホネート化合物を使用することにより、上
述した間順点を一挙に解決したものである。
The present invention solves the above problems at once by using a phosphorus compound that reacts with phenols and aldehydes, specifically an aminomethyl phosphonate compound containing an -NH group. It is something.

本発明の構成の要件はフェノール類、アルデヒド類を主
成分としてフェノール樹脂を得るに際して、下式で示さ
れるリン化合物を添力u1反応させ、物理的性質、加工
性の優れた耐燃性フェノール樹脂を得るものである。
The requirements for the structure of the present invention are that when obtaining a phenolic resin mainly composed of phenols and aldehydes, a phosphorus compound represented by the following formula is reacted with an additive u1 to produce a flame-resistant phenolic resin with excellent physical properties and processability. It's something you get.

本発明で使用するリン化合物の例としては、ジメチル−
N−ステアリルアミノメチルホスホネート、ジエチル−
N−ステアリルアミノメチルホスホネート、イソプロピ
ルブチル−N−ブチルアミノメチルホスホネート、ジプ
チル−N−オクチルアミノメチルホスホネート等があげ
られる。
Examples of phosphorus compounds used in the present invention include dimethyl-
N-stearylaminomethylphosphonate, diethyl-
Examples include N-stearylaminomethylphosphonate, isopropylbutyl-N-butylaminomethylphosphonate, and diptyl-N-octylaminomethylphosphonate.

これらのリン化合物はこれまで、高純度で収率よく、経
済的に得ることは不可能と考えられていたが、本発明者
は、1Mアミンとホルムアルデヒドまたはその誘導体と
トリアルキルホスファイトを反応させ、副生するアルコ
ールな除去することにより極めて容易に製造可能である
ことを見出した。
Until now, it was thought that it was impossible to economically obtain these phosphorus compounds with high purity and good yield, but the present inventor has developed a method by reacting 1M amine, formaldehyde or its derivatives, and trialkyl phosphite. It has been found that it can be produced extremely easily by removing the by-product alcohol.

反応式を下記に示す。The reaction formula is shown below.

本発明の化合物はフェノール樹脂製造時に電力t1して
反応させてもよく、又、フェノール樹脂フェスに添加し
て使用してもよい。
The compound of the present invention may be reacted with electric power t1 during the production of the phenol resin, or may be added to the phenol resin face for use.

本発明におけるリン化合物の使用蓋はリン化合物のリン
含1によって異るが5〜40重1%が好ましい。また、
他の難燃剤を併用することも出来る。
The amount of phosphorus compound used in the present invention varies depending on the phosphorus content of the phosphorus compound, but it is preferably 5 to 40% by weight. Also,
Other flame retardants can also be used in combination.

以下に本発明に使用するリン化合物の製造例、実施例、
比較例を示す。尚、例中の部は31iJt基準である。
Below are production examples and examples of phosphorus compounds used in the present invention,
A comparative example is shown. Note that the parts in the example are based on 31iJt.

〔製造例−1〕 反応槽にオクチルアミン66部をとり、50〜6ocK
保ちながら、95%パラホルムアルデヒド15.8部を
添加、反応させた。所要時間は50分であった。
[Production Example-1] 66 parts of octylamine was placed in a reaction tank, and 50 to 6 ocK
While maintaining the temperature, 15.8 parts of 95% paraformaldehyde was added and reacted. The time required was 50 minutes.

次いで同温度で、トリエチルホスファイl−83部を1
時間かかつて滴下し、さらに同温度で2時間かき1ぜた
Next, at the same temperature, 1-83 parts of triethylphosphite was added.
The mixture was added dropwise for about an hour, and stirred at the same temperature for an additional 2 hours.

水圧、次いで減圧下で揮発分を除去して得た生成物は無
色に近い液体でその収音(収率)は140部(99%)
となった。留分は24部であり、ガスクロ分析の結果、
若干の水を含むエタノールであることがわかった。生成
物分析値は表−1に記載した。又、この生成物のIRス
ペクトルを第1図に、NMRスペクトルを第2図に示し
た。分析結果および第1.2図に示した生成物のIR,
NMRチャートから目的物であるジエチル−N−オクチ
ルアミンメチルホスホネートを得たことがわかる。
The product obtained by removing volatile components under water pressure and then under reduced pressure is a nearly colorless liquid with a yield of 140 parts (99%).
It became. The fraction was 24 parts, and as a result of gas chromatography analysis,
It turned out to be ethanol containing some water. Product analysis values are listed in Table-1. The IR spectrum and NMR spectrum of this product are shown in FIG. 1 and FIG. 2, respectively. Analysis results and IR of the product shown in Figure 1.2,
The NMR chart shows that the target product, diethyl-N-octylamine methylphosphonate, was obtained.

〔製造例−2〜−4〕 製造例−1と同様の方法で、ジメチル−N−オクチルア
ミノメチルホスホネート、ジエチル−N−ステアリルア
ミノメチルホスボネート、ジブチル−N−ブナルアミノ
メチルホスホネートを得た。
[Production Examples-2 to -4] Dimethyl-N-octylaminomethylphosphonate, diethyl-N-stearylaminomethylphosphonate, and dibutyl-N-bunalaminomethylphosphonate were obtained in the same manner as in Production Example-1. .

製造データー、分析結果を表−1にまとめて示した。The manufacturing data and analysis results are summarized in Table 1.

フェノール積層板の製造 〔実施例−1〕 フェノール1so部、3z%ホルマリン156部、製造
例−1で得た、ジエチル−N−オクチルアミノメチルホ
スホネート50部、26%アンモニア6部を還流温度で
1時間反応させた。
Production of phenol laminate [Example-1] 1 so part of phenol, 156 parts of 3z% formalin, 50 parts of diethyl-N-octylaminomethylphosphonate obtained in Production Example-1, and 6 parts of 26% ammonia were mixed at reflux temperature to 1 part. Allowed time to react.

減圧下で脱水を行なった後、メタノールで希釈、樹脂分
50%のワニスを得た。
After dehydration under reduced pressure, the mixture was diluted with methanol to obtain a varnish with a resin content of 50%.

このワニスを樹脂金蓋50%になるように0.25mの
クラフト紙に含浸させ、乾燥させた。
A 0.25 m thick piece of kraft paper was impregnated with this varnish to a ratio of 50% resin and dried.

得られたプリプレグ7枚と銅rf31枚を積層し160
C100kl/dで1時間加圧し、厚さ1、A wxの
銅張MN板を得た。
The obtained 7 sheets of prepreg and 31 sheets of copper rf were laminated to form a 160mm
Pressure was applied at C100 kl/d for 1 hour to obtain a copper-clad MN board with a thickness of 1 and A wx.

このものの試験結果を表−2に記載した。The test results for this product are listed in Table-2.

〔実施例−2〜4〕〔比較例1〕 固形分50%のフェノール樹脂ワニスに製造例2〜4で
得たアミノメチルホスホネート化合物、市販の添加型離
燃剤を所定−加え、メタノールで希釈固形分50%とし
た。
[Examples 2 to 4] [Comparative Example 1] Aminomethyl phosphonate compounds obtained in Production Examples 2 to 4 and a commercially available additive type flame release agent were added to a phenolic resin varnish with a solid content of 50% in a predetermined amount, and diluted with methanol to form a solid. 50%.

このワニスを使用し、実施例−1と同様の工程で鏑張積
層板を得た。
Using this varnish, a black-clad laminate was obtained in the same process as in Example-1.

アミノメチルホスホネート化合物、添加型難燃剤の配合
蓋、得られた積層板の試験結沫を表−2に記載した。
Table 2 shows the combination of the aminomethylphosphonate compound, the additive flame retardant, and the test results of the resulting laminate.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は製造例1で得られた化成物のInスペクトル、
第2図はそのNMRスペクトルである。 出願人代理人 古 谷 馨
Figure 1 shows the In spectrum of the chemical compound obtained in Production Example 1,
FIG. 2 is its NMR spectrum. Applicant's agent Kaoru Furuya

Claims (1)

【特許請求の範囲】 フェノール樹脂を製造するに際して、フェノール樹脂に
対して下式で示される化合物を添加又は反応させること
を特徴とする耐燃性フェノの 一ル樹脂製造方法 △
[Claims] A method for producing a flame-resistant phenolic resin, which comprises adding or reacting a compound represented by the following formula to a phenolic resin when producing a phenolic resin.
JP6532484A 1984-04-02 1984-04-02 Production of improved phenolic resin Pending JPS60208318A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6532484A JPS60208318A (en) 1984-04-02 1984-04-02 Production of improved phenolic resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6532484A JPS60208318A (en) 1984-04-02 1984-04-02 Production of improved phenolic resin

Publications (1)

Publication Number Publication Date
JPS60208318A true JPS60208318A (en) 1985-10-19

Family

ID=13283613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6532484A Pending JPS60208318A (en) 1984-04-02 1984-04-02 Production of improved phenolic resin

Country Status (1)

Country Link
JP (1) JPS60208318A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8124716B2 (en) * 2004-05-28 2012-02-28 Dow Global Technologies Llc Reacting compound having H-P=O, P-H or P-OH group with functional group-containing organic compound
CN104031086A (en) * 2014-05-30 2014-09-10 湖南大学 Method for synthesizing alpha-amino alkyl phosphonate compounds

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8124716B2 (en) * 2004-05-28 2012-02-28 Dow Global Technologies Llc Reacting compound having H-P=O, P-H or P-OH group with functional group-containing organic compound
US20120129978A1 (en) * 2004-05-28 2012-05-24 Dow Global Technologies Llc Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
US8440771B2 (en) * 2004-05-28 2013-05-14 Dow Global Technologies Llc Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
US8563661B2 (en) 2004-05-28 2013-10-22 Dow Global Technologies Llc Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
US8586699B2 (en) 2004-05-28 2013-11-19 Dow Global Technologies Llc Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
US8829123B2 (en) 2004-05-28 2014-09-09 Dow Global Technologies Llc Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
US8962773B2 (en) 2004-05-28 2015-02-24 Dow Global Technologies Llc Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
CN104031086A (en) * 2014-05-30 2014-09-10 湖南大学 Method for synthesizing alpha-amino alkyl phosphonate compounds

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