JPH04146950A - Flame-retardant phenol resin composition - Google Patents
Flame-retardant phenol resin compositionInfo
- Publication number
- JPH04146950A JPH04146950A JP26954690A JP26954690A JPH04146950A JP H04146950 A JPH04146950 A JP H04146950A JP 26954690 A JP26954690 A JP 26954690A JP 26954690 A JP26954690 A JP 26954690A JP H04146950 A JPH04146950 A JP H04146950A
- Authority
- JP
- Japan
- Prior art keywords
- flame
- phenol resin
- resin composition
- retardant
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000005011 phenolic resin Substances 0.000 title claims abstract description 24
- 239000003063 flame retardant Substances 0.000 title claims description 17
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims description 15
- 239000000203 mixture Substances 0.000 title claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 8
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 125000001424 substituent group Chemical group 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 abstract description 8
- 238000013329 compounding Methods 0.000 abstract 1
- 229920001568 phenolic resin Polymers 0.000 description 14
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 10
- 239000002966 varnish Substances 0.000 description 8
- 238000004080 punching Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000003786 synthesis reaction Methods 0.000 description 6
- 239000007787 solid Substances 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 3
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- 244000226021 Anacardium occidentale Species 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 235000020226 cashew nut Nutrition 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 235000019198 oils Nutrition 0.000 description 2
- 229920002866 paraformaldehyde Polymers 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- -1 phosphoric acid ester compounds Chemical class 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- 239000002383 tung oil Substances 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- ZJRAAAWYHORFHN-UHFFFAOYSA-N 2-[[2,6-dibromo-4-[2-[3,5-dibromo-4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenoxy]methyl]oxirane Chemical compound C=1C(Br)=C(OCC2OC2)C(Br)=CC=1C(C)(C)C(C=C1Br)=CC(Br)=C1OCC1CO1 ZJRAAAWYHORFHN-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- LCHYEKKJCUJAKN-UHFFFAOYSA-N 2-propylphenol Chemical compound CCCC1=CC=CC=C1O LCHYEKKJCUJAKN-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 241000252233 Cyprinus carpio Species 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229940100630 metacresol Drugs 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 239000010466 nut oil Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電気的諸特性を低下させることなく、難燃性
に優れ、かつ、打抜加工性か良好なフェノール樹脂組成
物に関し、特に熱硬化性樹脂積層板に好適に用いられる
樹脂組成物に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a phenolic resin composition that has excellent flame retardancy and good punching workability without deteriorating electrical properties, and particularly The present invention relates to a resin composition suitable for use in thermosetting resin laminates.
Ｃ従来の技術〕
最近、絶縁材料、特に通信機および電子機器に使用され
る積層板は、加工設備の自動化、省エネルギー等の観点
から常温または常温付近の比較的低温での打抜加工性の
優れたものか要求されている。従って、通常積層板用樹
脂としては各種のアルキルフェノールをフェノールと併
用し、乾性油等で変性したフェノール樹脂か使われてい
る。C. Prior Art Recently, insulating materials, especially laminates used for communication devices and electronic devices, have been developed to have excellent punching properties at room temperature or relatively low temperatures near room temperature, from the viewpoint of automation of processing equipment and energy saving. What is required? Therefore, phenol resins modified with drying oil or the like are usually used as resins for laminates, in which various alkylphenols are used in combination with phenol.
一方、絶縁材料に使用される積層板に対して安全性重視
の風潮から難燃化の要求か強くなっている。従来積層板
の難燃化にはハロゲンあるいはリン化合物を樹脂中に添
加する添加型難燃剤を使用する場合と、樹脂に化学的に
結合させる反応型難燃剤を使用する場合とかあり、それ
ぞれ一長一短かある。前者としては例えば、テトラブロ
モビスフェノールＡや、トリフェニルホスフェート等が
あるが、難燃剤が製品中に未反応で残存するため、耐熱
性、耐溶剤性等の特性低下を生しる。On the other hand, there is an increasing demand for flame retardant laminates used as insulating materials due to the trend of placing emphasis on safety. Conventionally, laminates are made flame retardant by using additive flame retardants, which add halogen or phosphorus compounds to the resin, and by using reactive flame retardants, which chemically bond to the resin. Each has its advantages and disadvantages. be. Examples of the former include tetrabromobisphenol A and triphenyl phosphate, but since the flame retardant remains unreacted in the product, properties such as heat resistance and solvent resistance deteriorate.
一方、反応型難燃剤としては、従来ハロゲン置換アリー
ル基を有するジェポキシ化合物、あるいはモノエポキシ
化合物か使用されている（例えば特開昭６２−７２７４
４号公報）が、多量に用いた場合架橋密度が高くなり、
可撓性か低下し、低温ての打抜加工性の低下か生じる。On the other hand, as a reactive flame retardant, a jepoxy compound having a halogen-substituted aryl group or a monoepoxy compound has conventionally been used (for example, JP-A-62-7274
4), but when used in large amounts, the crosslinking density increases,
The flexibility decreases, resulting in a decrease in punching workability at low temperatures.
本発明の目的とするところは、電気的特性および他の諸
特性を低下させることなく、難燃性に優れ、且つ常温付
近での打抜加工性が良好な熱硬化性樹脂積層板を与える
フェノール樹脂組成物に関するものである。The object of the present invention is to provide a thermosetting resin laminate that has excellent flame retardancy and good punching workability at around room temperature without deteriorating electrical properties and other various properties. This invention relates to a resin composition.
本発明は、フェノール樹脂に、一般式
（但し、Ｒ，、Ｒ２は置換基を有するか又は有しない炭
素数２〜１０の１価の脂肪族または芳香族残基を示し、
ｎはθ〜４である。）なる化合物（Ｉ）を添加すること
により上記の各種の優れた特性を有する難燃性フェノー
ル樹脂組成物を提供しようとするものである。The present invention provides a phenolic resin with the general formula (where R, R2 represents a monovalent aliphatic or aromatic residue having 2 to 10 carbon atoms with or without a substituent,
n is θ~4. ) By adding Compound (I), it is intended to provide a flame-retardant phenolic resin composition having the above-mentioned various excellent properties.
本発明の難燃性フェノール樹脂組成物に用いられるフェ
ノール樹脂は、フェノール類とパラホルム、ホルマリン
水溶液等のホルムアルデヒドと反応させたものであり、
フェノール類としては、フェノール、あるいはクレゾー
ル、プロピルフェノール、ブチルフェノール、ノニルフ
ェノール、カシューダイマー等のＣ２〜Ｃ２０のアルキ
ルフェノールである。The phenol resin used in the flame-retardant phenol resin composition of the present invention is one obtained by reacting phenol with formaldehyde such as paraform or formalin aqueous solution,
The phenols include phenol and C2 to C20 alkylphenols such as cresol, propylphenol, butylphenol, nonylphenol, and cashew dimer.
フェノール類とホルムアルデヒドとの反応は、酸性触媒
を使用する場合と塩基性触媒を使用する場合とかある。The reaction between phenols and formaldehyde can be carried out using an acidic catalyst or a basic catalyst.
酸性触媒としては蓚酸、硫酸、パラトルエンスルホン酸
等であり、これよりノボラック型フェノール樹脂が得ら
れる。また塩基性触媒としては水酸化ナトリウム等の水
酸化物、あるいはアンモニア水、アミン類等てあり、こ
れよりレゾール型フェノール樹脂が得られる。本発明に
おいてはいずれも用いられる。又、桐油、亜麻仁油、脱
水ヒマシ油、カシューナツツ油等の油で変性された油変
性フェノール樹脂をフェノール樹脂として使用すること
も可能である。Examples of the acidic catalyst include oxalic acid, sulfuric acid, para-toluenesulfonic acid, etc., from which a novolac type phenol resin can be obtained. Basic catalysts include hydroxides such as sodium hydroxide, aqueous ammonia, and amines, from which resol type phenol resins can be obtained. Any of these can be used in the present invention. It is also possible to use oil-modified phenolic resins modified with oils such as tung oil, linseed oil, dehydrated castor oil, and cashew nut oil as the phenolic resin.
次に前記化合物（Ｉ）としては、ｎ＝２、Ｒ１：Ｃ５Ｈ
ｓ−１Ｒ２： ＣＨｉ Ｃ−Ｈａ−の場合、ｎ＝２、Ｒ
１： Ｃ−Ｈｓ−１Ｒｔ ： Ｃｍ Ｈｓ−の場合、ｎ
＝２、Ｒ＋：ＣｔＨｓ−１Ｒ＊：ＣｔＨ３−の場合、ｎ
＝４、Ｒ１：Ｃ＠Ｈ＠−１Ｒ２：ＣＨ，Ｃ，Ｈ，−の場
合等がある。Next, as the compound (I), n=2, R1:C5H
s-1R2: In the case of CHi C-Ha-, n=2, R
1: C-Hs-1Rt: In the case of Cm Hs-, n
= 2, R+:CtHs-1R*:CtH3-, n
=4, R1:C@H@-1R2:CH,C,H,-, etc.
化合物（１）の配合量は、特に以下の範囲に限定される
という趣旨ではないか、フェノール樹脂の固型物１００
重量部に対して３〜５０重量部になるように設定される
ことが好ましい。この使用量か３重量部を下まわると難
燃性か不充分となる傾向かあり、５０重量部を越えると
架橋密度か高くなり、積層板の打抜加工性か悪くなる傾
向かあるからである。The content of compound (1) may be particularly limited to the following range.
It is preferable to set the amount to 3 to 50 parts by weight. If the amount used is less than 3 parts by weight, flame retardancy tends to be insufficient, and if it exceeds 50 parts by weight, the crosslinking density increases and the punching processability of the laminate tends to deteriorate. be.
本発明で用いられる化合物［１）は、従来のリン酸エス
テル化合物のトリフェニルホスフェート等と異なり、ノ
ボラック型の骨格をもつため、耐熱性か高い。さらに、
ワニスとの相溶性が非常に良く、耐溶剤性か向上してい
るので、基板から回路板への加工工程において、基板か
ら溶剤へ溶出することか殆んとない。The compound [1) used in the present invention has a novolac type skeleton, unlike conventional phosphoric acid ester compounds such as triphenyl phosphate, and therefore has high heat resistance. moreover,
Since it has very good compatibility with varnish and improved solvent resistance, there is almost no possibility that it will be eluted from the substrate into the solvent during the processing process from the substrate to the circuit board.
以下、実施例を挙げて本発明を説明する。 The present invention will be explained below with reference to Examples.
合成例
桐油８００ｇ、メタクレゾール１２００ｇ、パラトルエ
ンスルホン酸２ｇを混合し、１００℃で１時間反応させ
た。次いてパラターシャリーブチルフェノール５０ｇ、
パラホルム１００ｇ、２５％アンモニア水８ｇを反応容
器に入れ、９０°Ｃて２時間反応させた。次いて減圧下
で水を除去し、溶剤を加えて樹脂ワニスを製造した。Synthesis Example 800 g of tung oil, 1200 g of metacresol, and 2 g of para-toluenesulfonic acid were mixed and reacted at 100° C. for 1 hour. Next, 50 g of paratertiary butylphenol,
100 g of paraform and 8 g of 25% aqueous ammonia were placed in a reaction vessel and reacted at 90°C for 2 hours. Water was then removed under reduced pressure and a solvent was added to produce a resin varnish.
実施例１
合成例のワニスの樹脂固形分１００重量部に対し、ｎ＝
２、Ｒ１：Ｃ６Ｈ５−１Ｒ２：Ｃ＠ Ｈ５の化合物１：
Ｉ］２０重量部を添加した。コツトンリンター紙に上記
ワニスを含浸し、これを乾燥して、樹脂付着分５０重量
％の樹脂含浸基材を製造した。Example 1 For 100 parts by weight of the resin solid content of the varnish of the synthesis example, n=
2, R1:C6H5-1R2:C@H5 compound 1:
I] 20 parts by weight were added. Cotton linter paper was impregnated with the above varnish and dried to produce a resin-impregnated base material with a resin adhesion content of 50% by weight.
この基材を８枚重ね合わせ、１６０〜１６５６Ｃ１８０
ｋｇ／ａｄの積層条件で６０分間加熱圧着して厚さ１．
６鮒のフェノール樹脂積層板を製造した。Layer 8 sheets of this base material, 160-1656C180
kg/ad lamination condition for 60 minutes to a thickness of 1.
Six carp phenolic resin laminates were manufactured.
実施例２
合成例のワニスの樹脂固形分１００重量部に対し、ｎ＝
２、Ｒ，：Ｃ，Ｈ６−１Ｒ２： Ｃｓ Ｈ５の化合物Ｃ
Ｉ）３０重量部を添加した。以下実施例１と同一の方法
でフェノール樹脂積層板を製造した。Example 2 For 100 parts by weight of the resin solid content of the varnish of the synthesis example, n=
2, R,:C,H6-1R2: Compound C of Cs H5
I) 30 parts by weight were added. A phenolic resin laminate was manufactured in the same manner as in Example 1.
実施例３
合成例のワニスの樹脂固形分１００重量部に対し、ｎ＝
４、Ｒ、： Ｃｈ Ｈｓ−１Ｒ２：ＣＨ３Ｃ５Ｈａ−の
化合物ＣＩ）２０重量部を添加した。Example 3 For 100 parts by weight of the resin solid content of the varnish of the synthesis example, n=
4, R,: 20 parts by weight of the compound CI) of Ch Hs-1R2:CH3C5Ha- was added.
以下実施例１と同一の方法でフェノール樹脂積層板を製
造した。A phenolic resin laminate was manufactured in the same manner as in Example 1.
比較例１
合成例のワニスの樹脂固形分１００重量部に対し、市販
難燃剤トリフェニルホスフェ−１−２０部を添加した。Comparative Example 1 1 to 20 parts of a commercially available flame retardant triphenylphosphate was added to 100 parts by weight of the resin solid content of the varnish of the synthesis example.
以下実施例１と同一の方法でフェノール樹脂積層板を製
造した。A phenolic resin laminate was manufactured in the same manner as in Example 1.
比較例２
合成例のワニスの樹脂固形分１００重量部に対し、市販
難燃剤テトラブロモビスフェノールＡジグリシジルエー
テル２０重量部を添加した。以下実施例１と同一の方法
てフェノール樹脂積層板を製造した。Comparative Example 2 20 parts by weight of tetrabromobisphenol A diglycidyl ether, a commercially available flame retardant, was added to 100 parts by weight of the resin solid content of the varnish of the synthesis example. A phenolic resin laminate was manufactured using the same method as in Example 1.
以上の実施例、比較例で得られたフェノール樹脂積層板
の諸特性を第１表に示す。Table 1 shows various properties of the phenolic resin laminates obtained in the above Examples and Comparative Examples.
絶縁抵抗、耐溶剤性・ＪＩＳ Ｃ６４８１＋二よる打抜
加工性： ＡＳＴＭ Ｄ−６１７による以上の実施例か
らも明らかなように、本発明の難燃性フェノール樹脂組
成物は、難燃性、常温付近での打抜加工性、電気特性、
耐溶剤性、耐熱性等を同時に満足する特性を持ち、難燃
性フェノール樹脂積層板用として特に優れている。Insulation resistance, solvent resistance, punching workability according to JIS C6481+2: As is clear from the above examples according to ASTM D-617, the flame-retardant phenolic resin composition of the present invention has flame retardant properties, punching workability, electrical properties,
It has properties that simultaneously satisfy solvent resistance, heat resistance, etc., and is particularly excellent for use in flame-retardant phenolic resin laminates.
本発明の難燃性フェノール樹脂組成物は、難燃性はもち
ろんのこと、可撓性、電気特性、耐溶剤性、耐熱性に優
れており、化粧板、成形品、積層品等に使用可能である
。特に年々要求特性か向上している積層板用の樹脂とし
て好適である。The flame-retardant phenolic resin composition of the present invention is not only flame-retardant, but also has excellent flexibility, electrical properties, solvent resistance, and heat resistance, and can be used for decorative boards, molded products, laminates, etc. It is. It is particularly suitable as a resin for laminates whose required properties are improving year by year.
Claims (1)
い炭素数２〜１０の１価の脂肪族または芳香族残基を示
し、ｎは０〜４である。）で示される化合物〔 I 〕を
添加することを特徴とする難燃性フェノール樹脂組成物
。(1) Phenol resin has a general formula ▲ mathematical formula, chemical formula, table, etc. ▼ (I) (However, R_1 and R_2 are monovalent aliphatic or aromatic having 2 to 10 carbon atoms with or without substituents. A flame-retardant phenol resin composition, characterized in that it contains a compound [I] represented by a group residue (n is 0 to 4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26954690A JPH04146950A (en) | 1990-10-09 | 1990-10-09 | Flame-retardant phenol resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26954690A JPH04146950A (en) | 1990-10-09 | 1990-10-09 | Flame-retardant phenol resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04146950A true JPH04146950A (en) | 1992-05-20 |
Family
ID=17473889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26954690A Pending JPH04146950A (en) | 1990-10-09 | 1990-10-09 | Flame-retardant phenol resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04146950A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5599863A (en) * | 1994-06-17 | 1997-02-04 | Cyro Industries | Gamma radiation sterilizable acrylic polymer |
-
1990
- 1990-10-09 JP JP26954690A patent/JPH04146950A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5599863A (en) * | 1994-06-17 | 1997-02-04 | Cyro Industries | Gamma radiation sterilizable acrylic polymer |
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