JPS60207400A - Method of separating taping part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention relates to a method for assembling a printed wiring body, and more specifically, to a method for separating electronic components having multiple leads from a series of taped components that are aligned and held. Technology e.g. electronic components such as composite resistor arrays and transistors 1
11 is often a multi-lead radial type in which a plurality of leads (3a, 3b, 3c) are led out from the component body (2) in the same direction as shown in Figure g. is a series of taping parts (5) in which the tips of each of the leads (3a), (3b), and (3G) are adhered to a long tape member (4) for adhesive sealing, and a large number of leads are held in series at equal intervals. ).

When manufacturing a printed wiring body by separately separating the electronic components +11 from this taping component series (111) and assembling them onto a printed circuit board, the conventional method will be described with reference to FIGS. 2 to 1. First, as shown in Fig. 2, the leads (3m) (zb) (30) of each electronic component +1+ 11+... in the taping parts series (6) are placed near the base of the tape member (4) as shown by the chain line in the figure. In other words, all the leads (3a) (3b) are cut so that the leads (3b) (3o) on both sides of the electronic component 111 have dimensions that allow clinching (leg bending) during temporary fixing as described later. (
Cut 3c) to the same size. As shown in FIG. 1, electronic components 11 are separated from the tape member (4) by this cutting.
1 is a push-through hole (7) drilled at a predetermined position of the printed circuit board (6) by an automatic push-in machine (not shown) as shown in the first cause.
aX7b) (70) to each lead (3a) (3b) (3o
) by pushing through the printed circuit board (6).
° placed on top. Next, as shown in Figure 7Q, the leads (3b) (3o) on both sides of the electronic component 111 placed on the printed circuit board (6) are cut to predetermined dimensions as shown by the chain lines in the figure. As shown in the above lead (31) 0
30), the printed circuit board (6) protrudes from the back surface and the light input end is bent outward. By bending the clinch legs of this lead (3b x 3a), the shimiko part (1) and the printed circuit board (6
), and as shown in FIG. 2, in this temporarily fixed state, the m child component 111 is soldered to the printed circuit board (8) by a solder dip process to electrically and mechanically connect it. Thereafter, the excess tip portion of the remaining lead (3a) of the electronic component 11+ is cut off to complete the assembly of the electronic component (1). A printed wiring body is manufactured by assembling other electronic components in large scale at predetermined positions on the printed circuit board (6) in the same manner as described above.

Problems to be Solved by the Invention In the above conventional method, the leads (3
b) After the upper electronic component 111 is temporarily fixed to the printed circuit board (6) by the leg bending process of (3o), solder dip treatment is performed, and the electronic component (1) is soldered to the printed circuit board (8). Since the excess tip of the remaining lead (3&) is cut and removed, the remaining lead (3&) is long during the solder dip process described above, so solder may layer on undesired parts and cause a short circuit. There was a problem that caused this. Further, there is a problem in that soldering requires a step of cutting the leads (3a) afterward, making it impossible to reduce the number of shears.

2. Means for Solving the Problem The present invention separates seven electronic components from a series of taped components in which electronic components having a plurality of leads are arranged and held at equal intervals on a tape member, and Lead clinch (leg bending) process required for temporary fixing of each electronic component separated from the taped parts series in *i method of printed wiring body which is pressed into the printed circuit board, temporarily fixed by leg bending process, and then soldered afterwards. At the same time, cut the leads unnecessary for temporary fixing to a predetermined dimension that is shorter than the clinching length. This is a manufacturing method that includes a step of separating the materials individually from each other.

Ho 0. EXAMPLE Below, an example of the method for manufacturing a printed wiring body according to the present invention will be described with reference to FIGS. 7 to ij. Figures 2 to 7
．． The same reference numerals as the second cause indicate the same thing, and the explanation thereof will be omitted.

Characteristic line of the present invention In the conventional method, a series of taping parts (6
) All leads (3 &) in electronic components (1) (:
5b) (3e) could be machined and the electronic component 1 was cut to the same dimensions, including the lynch processing length.
1) is mounted on the printed circuit board (61) and the lead (3) is mounted after fc.
The excess tip portion of a) was cut off beforehand, and the lead unnecessary for clinching the electronic component (1) in the taping component series (5), for example, the lead (3a) above, is cut to a predetermined size. The point is to remove the excess tip portion.

Specifically, as shown in FIG. 7, first, each electronic component il+ 111 in the taping component series (5)...the leads necessary for temporarily fixing the fist, for example, the leads (3b) (30
) is cut from near the base of the tape member (4) as shown by line 41I in the figure. That is, the leads (3, -b) and (3o) on both sides of the electronic component (1) are cut to a size that allows the legs to be bent during temporary fixing, as will be described later. Unnecessary leads, such as leads (
3a) is shorter than the dimension that allows the leg bending process, and as will be described later, when the electronic component (1) is mounted on the printed circuit board (6), the tip of the lead (3&) is
Cut it to a specified size so that it slightly protrudes from the back side. As shown in FIG. 2, the electronic component + 11 separated from the tape member (4) by this cutting is inserted into the insertion hole (
7&) (7b) (7a) with each lead (3&) (31))
Printed circuit board (6) by pushing through (30)
placed on top.

Next, as shown in Fig.
The tips of the leads (3b) and (3o) are slightly protruding from the back side of the printed circuit board (6), and in this state, the leads (3b) and (3o) are cut and bent using conventional chains to attach the electronic component 11+ to the printed circuit board (6).
6) Temporarily fix. As shown in FIG. 5, the stain element (1) is soldered to the printed circuit board (6) by Ushiyama dip treatment in the temporarily fixed state to electrically and mechanically connect it.

Printed circuit boards (6) for other electronic parts as well as described above.
and finally manufacture a printed wiring body.

In the above embodiment, three leads (3a) (3b) (
3o) Although the example of application to the electronic component (1) that separates the wires has been deducted, the present invention is not limited to this, and can be applied to any electronic component that has multiple leads, and can also be applied to radial type electronic components. In addition to electronic components, it can also be applied to round axial electronic components by taping their leads in a bent state. Furthermore, as mentioned above, it has been tentatively identified that the two leads (3b) and (3a) on both sides of the electronic component (1) are clinched by bending the legs.
This clinching process may be performed for the minimum necessary amount of force.

1. Effects of the Invention According to the present invention, during solder dip processing, the clinched leads for temporary fixing are cut to a predetermined size in advance, and the length of the leads protruding from the back surface of the shiblint board is short, so that they can be cut into undesired areas. The cause of short circuits can be removed without solder adhesion. In addition, since the step of cutting the leads after the solder dipping process is not necessary, the number of solders can be reduced by 1 person, and since the leads are cut with the 1 electronic part & 116 taped, the work at that I/1 part is stable and workable. will also be significantly improved.

[Brief explanation of drawings]

w1/ Figures 1 to 5 are assembly process diagrams showing one embodiment of the method for manufacturing a printed wiring body according to the present invention, Figure 5 is a partial front view showing a specific example of the taping member, and Figures 2 to 7. 2
The figure is an assembly process diagram for explaining a conventional example of a method for manufacturing a printed wiring body. (11--Electronic parts, (3a) (3b) (3a) S lead, (4)... tape member, (5)... taping parts series, (6)... printed circuit board.

Claims (1)

[Claims] (1) In the production of printed wiring bodies in which electronic components are individually separated from a series of taped components having multiple leads, inserted into a printed circuit board, and then lead clinched and soldered, some of the multiple leads are bent for clinching. A method for separating taped parts, characterized in that the remaining lead is cut into a dimension i including the length, and the remaining lead is shortened by the bending length, respectively, when the electronic parts are separated from the series of taped parts.