JPS60196316A - Manufacture of metallic composite solid construction by reactive injection molding - Google Patents

Abstract

PURPOSE:To manufacture conductive plastics including a fibrous metal and having no jamming of an electromagnetic wave, by dispersing a microcapsule to be obtained by covering a fibrous shape memory alloy deformed into a coillike state with resin is kept dispersed in a cavity. CONSTITUTION:A fibrous shape memory alloy, which has been deformed into a coillike state by applying external force to the same, is made into a microcapsule 6 having appropriate density by covering the alloy with resin, dispersed in the inside of a cavity 5 of a reactive injection mold and both solutions of a polyol stock solution and an isocyanate stock solution are injected from a mixing head 1, which are mixed and solidified. Simultaneously with softening of the resin of the capsule due to heat of reaction the shape memory alloy is extended and a conductive molded article including metallic fiber and having no jamming of an electromagnetic wave is obtained. It is possible to increase the metallic fiber in either a skin layer or a medium layer by making use of a floating or a sinking phenomenon due to density difference among the capsules. There is no abrasion on a kneading screw.

Description

DETAILED DESCRIPTION OF THE INVENTION FIELD OF THE INVENTION The present invention relates to a method for manufacturing a metal composite integral structure of a shuffling rod and metal by a reaction injection molding method.

(Background of the invention) Each keyaki electronic device km has conductive r
Many attempts have been made to use the plasti as a purple electromagnetic shield. There are roughly two types of techniques for imparting conductivity to flasks. One of them is to treat the surface of plastic molded products with a conductive coating. One of the forming methods is to combine conductive materials. Specific methods for the former include σ methods such as coating conductive paint, bath irradiation of metal materials, vacuum evaporation, sputtering, and plating, but the problem is that it is difficult to obtain adhesion strength, and the conductive film (2) There is a possibility of peeling, and furthermore, since surface treatment is performed as a secondary process, the equipment cost is high and the number of man-hours is large. On the other hand, as a specific method of the latter, there is a method of forming a pattern by injection molding a material in which a conductive filler is mixed into a thermoplastic resin. However, this method requires cutting of the filler filler during crosstalk.

This method has the drawback of promoting unrestricted dispersion and, in addition, causing problems such as wear of the kneading screws.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned nine drawbacks of the prior art and to provide an excellent method for manufacturing a metal composite integral structure in which a plastic material is composited with a conductive material.

[Summary of the invention]

The present invention uses a reaction injection molding method in which a first stock solution containing a polyol as a main component and a second stock solution containing an incyanate as a main component are collided and mixed under high pressure and then injected into a closed mold. Microcapsules filled with an organic polymer material are dispersed by applying an external force to the spiral shape memory alloy in advance to reduce their shape, and then the foamed structure composited with the shape memory alloy is integrally molded. That is the point.

The present invention will now be described in detail. External force caused by spiral shape memory alloy? In addition, micro-encapsulated cells with a density of about 0,a to 5.9/- were created with a smaller shape and were encapsulated in an organic polymeric material, and these were dispersed within the molded cavity. Afterwards, the chemically active biphasid σ
】By reaction injection molding, the raw solution is injected into the cavity after collision and mixing.

If the density of the capsule is smaller than the original g@degree (approximately 1.0 g/am), the capsule exists as a floating body in the undiluted solution in the cavity, and the shape memory alloy in the capsule is formed by the chemical reaction heat of the undiluted solution. Otherwise, it expands rapidly and destroys the cuff cell, and in the fully stretched state Q), it is fixed to the skin of the molded product as the reaction injection molding material hardens. The present invention is a method using such a principle. The skin layer of the molded product to which the shape memory alloy is fixed is conductive, and can be used for chemical magnetic shielding, etc.

In the present invention, by arbitrarily changing the density r of the cuff cells, it is possible for the cuff cells to settle, float, or be uniformly dispersed in the stock solution. The density of the microcapsules is selected depending on the purpose of the product. For example, if the purpose is to shield ms waves, the floating or sedimentation phenomenon of the microcapsules can be used to form the desired side of the housing of the electronic device. Metals can be selectively fixed as a layer at high concentrations.

The first stock solution as the main component of the polyol used in the present invention includes a polyether polyol obtained by adding an alkylene oxide to an aliphatic or aromatic σJ alcohol or amine, and a reaction accelerator (catalyst). , a foaming agent such as low boiling point alkyl halide, a foam stabilizer such as alkylene oxide modified polydimethylsiloxane, and carbon bra 9
It is generally composed of a coloring agent such as a pigment or a coloring agent.

The second stock solution containing incyanate as a main component is generally i4'-diphenylmethane diisocyanate.

[Embodiments of the invention]

In the following, a practical example of the present invention will be explained according to FIG.

FIG. 1 is a cross-sectional view showing the basic part of a reaction injection containment type rock used in the manufacturing method according to the present invention, and FIG. 2 is an enlarged cross-sectional view of the section I-1 in FIG. 1. In the figure, 1 is a mixing head for mixing the chemically active stock solution r@arrow, 2 is an after mixer, 3 is a gate, 4 is a type %, and 5 is a capity of type 4. Further, 6 indicates a microcapsule encapsulating shape memory compound 8:.

The outline of the molding process using the above-mentioned apparatus is as follows. First, microcapsules 6 containing a spiral-shaped 7J shape memory alloy made into a coil shape by adding ultraviolet chips to a 5-yen capsule are filled. In this case, as described above, the microcapsules 6 are selected to have an appropriate density depending on the intended use of the molded article. Next, a chemically active first stock solution containing Polymer as a main component and a second stock solution containing Incyanate as a main component are mixed in mixing head 1, and then this? It is injected into the cavity 5 via the after mixer 2 and gate 3. -After a few seconds, the two stock solutions chemically react, and the blowing agent foams due to the heat of reaction.
Moreover, the coiled shape memory alloy in the microcapsule 6 is expanded by the reaction heat. At this time, is it shape memory alloy in micro cuff cell 6? The covering organic polymer material becomes soft due to the heat of reaction, and is destroyed by the elongation σ energy of the shape memory alloy. Since the material hardens in this state, the shape memory alloy remains fixed as it is.

FIG. 3 is a side view showing an example of molding a nousing for an electronic device using the above process, and FIG. 4 is an enlarged sectional view of section A in FIG. 3. In the figure, 7 is a housing for electronic equipment, 8 and 9 are skin layers included in the shape memory alloy, and 10 is a foam layer with a cellular structure that is foamed by the internal 70-layer foam. be. In this case, by appropriately selecting the density of the microcapsules and applying 7fl for the microcapsule floating phenomenon and sedimentation phenomenon, a sand-covered foam structure with a skin layer containing a high concentration of shape memory alloy on both sides can be produced in one step. can be made.

The volume resistivity IR, IQ of the composite integrated structure made according to the present invention is on the side of ~10 Ω, which is much lower than that of ordinary conductive plastics (11-10 Ω), making it an excellent choice. 2 [Effects of the Invention] According to the present invention, microcapsules are prepared in advance in a sealed mold by applying an external force to a spiral shape memory alloy to reduce the shape thereof and coated with an organic polymer material. By dispersing the mixture and injecting the molding stock solution r using a reaction injection molding method, a metal composite integral structure r having excellent conductivity can be obtained by a simple method. In addition, by appropriately selecting microcapsules, shape memory alloys? A polygonal foam structure containing a high degree of oxidation in the epidermal layer can be made in about 11 minutes.
This molded product is extremely effective for magnetic wave shielding of various electronic devices, and can be obtained at low cost using a simple method.

[Brief explanation of drawings]

Figure 1 is a cross-sectional view showing the basic part of the reaction injection molding method used in the manufacturing method of the present invention, Figure 2 is an enlarged cross-sectional view of the section I-I in Figure 1, and Figure 3 is a molding made by the manufacturing method of the present invention. FIG. 4 is an enlarged sectional view of section A in FIG. 3. Explanation of symbols 1...Mixing heid, 2...After mixer, 6
...Gate, 4...Mold, 5...Cavity, 6...
・・Microcapsule, 7・・・Electronic device housing,
8.9...Skin layer, 10...Foam layer. Figure 1

Claims (1)

[Claims] (1) 1st f, stock solution containing polyol as the main component;
A second stock solution containing incyanate' as the main component and 100 to 1.7 iQ lid part 0. A method for producing a composite integral structure using a reaction injection bottom type method in which the material is collided and mixed at a high pressure (at a high pressure) and then injected into a closed mold, wherein a fiber-shaped shape-memory structure is injected into the closed mold in advance. In addition to the external chipping of the alloy, the shape of the metal is reduced and the microcafusel coated with an organic polymer material is dispersed and injection ligated to integrally mold the foamed structure that is a composite of the shape memory alloy. A method for manufacturing a composite integral structure. (2. In the method for manufacturing a metal composite integral structure according to claim 1, the first stock solution is a polyamide resin obtained by adding an alkylene oxide to an aliphatic or aromatic alcohol or amine. It is composed of an ether polyol, a reaction accelerator, a blowing agent such as a low-boiling point halogenated 7A/Kyl, a foam stabilizer such as an alkylene oxide-modified polydimethylsiloxane, and a coloring agent such as carbon black or pigment. A method for manufacturing a metal composite integral structure characterized by (3) a method for manufacturing a metal composite integral structure according to claim 1, wherein the second stock solution or 4°4'-diphenylmethane A method for manufacturing a composite integral structure of gold maple, which is characterized by being made of diisocyanate.