JPS60196262A - Solder plating method of water tube - Google Patents
Solder plating method of water tubeInfo
- Publication number
- JPS60196262A JPS60196262A JP5187484A JP5187484A JPS60196262A JP S60196262 A JPS60196262 A JP S60196262A JP 5187484 A JP5187484 A JP 5187484A JP 5187484 A JP5187484 A JP 5187484A JP S60196262 A JPS60196262 A JP S60196262A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- tube
- tank
- flux
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Coating With Molten Metal (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はウォータチューブの半田メッキ方法に関するも
のであり、例えば熱交換器用ウォータチューブを成形す
る際に用いて有効である。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for solder plating water tubes, and is effective when used, for example, to mold water tubes for heat exchangers.
従来、熱交換器用ウォータチューブは次の様に成形され
、半田メッキされていた。つまり第１図に示すアンコイ
ラ−１に巻かれた帯状金属板２をローラ群３により円筒
状に連続成形加工後チューブ８とし、フラックス槽４を
通して表面処理を行い、半田槽６を通過させることによ
り、チューブ温度上昇と同時に半田メッキを行っていた
。すなわち、メッキを行なう為に、まず半田槽６内でチ
ューブ自身の温度を上昇させ、半田温度に近い温度にす
るわけであるが、チューブ８が半田槽６内を通過する際
、周囲の溶融した半田より熱を吸収してチューブ８が昇
温され、半田メッキするに充分な温度になってから半田
メッキされているのである。従って、チューブ８の成形
速度が速くなると、チ１−ブ８が溶融半田より充分な熱
を吸収しきれなくなるので、どうしても半田槽６の長さ
を長くしなければならない。また、半田槽６の長さを長
くするとチューブ８の温度分布にバラつきが生じ、半田
メッキの表面粗度が荒くなるという問題がある。Conventionally, water tubes for heat exchangers have been formed and solder plated as follows. In other words, the band-shaped metal plate 2 wound around the uncoiler 1 shown in FIG. , solder plating was performed at the same time as the tube temperature rose. That is, in order to perform plating, the temperature of the tube itself is first raised in the solder bath 6 to a temperature close to the soldering temperature, but when the tube 8 passes through the solder bath 6, the surrounding melted The temperature of the tube 8 is raised by absorbing heat from the solder, and the solder plating is performed after the tube 8 reaches a temperature sufficient for solder plating. Therefore, if the molding speed of the tube 8 increases, the tube 1-8 will not be able to absorb enough heat from the molten solder, so the length of the solder bath 6 must be increased. Furthermore, when the length of the solder bath 6 is increased, there is a problem that the temperature distribution of the tube 8 becomes uneven, and the surface roughness of the solder plating becomes rough.
本発明は上記問題点に鑑み、半田槽の長さを長（するこ
となくチューブに充分な熱を与え、たとえチューブの成
形速度が増しても充分に半田メッキができるようにする
ことを目的とする〔発明の構成〕
上記目的を達成するために本発明ではまず帯状金属板を
形成ローラで筒状のチューブに成形し、このチューブに
フラックスを塗布した後、高周波加熱コイルにより予熱
し、その後にこの予熱したチューブに半田メッキを行い
、そして冷却するような方法とした。In view of the above problems, the present invention aims to provide sufficient heat to the tube without increasing the length of the solder bath, and to enable sufficient solder plating even if the tube forming speed increases. [Structure of the Invention] In order to achieve the above object, the present invention first forms a band-shaped metal plate into a cylindrical tube with a forming roller, coats the tube with flux, preheats it with a high-frequency heating coil, and then The method was to apply solder plating to this preheated tube and then cool it.
本発明のウォータチューブの半田メッキ方法を用いれば
、フラックスを塗布した後、半田メッキを行なう前に高
周波加熱コイルにより予熱を行っているので、フラック
スの温度も上昇させることができ、フラックスの活性化
が向上してチューブの酸化膜を除去しやすくすることが
できる。また、チューブを予熱するのに高周波加熱コイ
ルを用いているので、たとえチューブの成形速度が速く
なっても、従来の様に半田槽の長さを長くする必要はな
く、全体として設備の長さを短くすることができる。ま
た高周波加熱コイルに供給する電流を制御することによ
り、チューブの成形速度に応した予熱温度を一定に保つ
ことができる。If the water tube solder plating method of the present invention is used, preheating is performed by a high-frequency heating coil after applying flux and before solder plating, so the temperature of the flux can also be increased, and the flux can be activated. This improves the oxide film on the tube and makes it easier to remove it. In addition, since a high-frequency heating coil is used to preheat the tube, even if the tube forming speed becomes faster, there is no need to increase the length of the soldering bath as in conventional methods, and the overall length of the equipment is reduced. can be shortened. Furthermore, by controlling the current supplied to the high-frequency heating coil, it is possible to keep the preheating temperature constant depending on the tube forming speed.
以下本発明の実施例について説明する。第２図に於いて
１はアンコイラで、帯状金属板２が巻かれてあり、その
帯状金属板２を成形ローラ群３に送り込んでいる。この
成形ローラ群３は図示しない電動機によって駆動され、
これによって帯状金属板２が円筒状のチューブ８に成形
される。そして、この円筒状に成形されたチューブ８は
フラックス槽４内に進入し、半田付着性向上のためチュ
ーブ８の外周にフラックスが塗布される。尚、フラック
ス槽４内は、図示しないポンプによってフラックスが循
環している。フラックス槽４内を通過したチューブ８は
、高周波加熱コイル９によって急加熱される。この高周
波加熱コイル９ば第３図に示す様な蜆旋形状を有し、チ
ューブ８の外周を取り巻いて配設され、チューブ８の温
度を１００℃〜１５０℃の間の一定値に保っている。１
０は、高周波発振装置で、前記駆動ローラ３が駆動され
ている間、高周波加熱コイル９に連続的に電流を流して
いる。６は半田槽で、図示しない半田ポンプで、溶融し
た半田を半田トイ１１に連続して送り込み半田トイ内で
噴流する構造を有し、前記高周波加熱コイル９で予熱さ
れたチューブ８に連続的に半田メッキ出来る様になって
いる。半田槽６内の温度は３００℃〜３５０°Ｃで、半
田槽６内で施されたメッキは約１０〜２０μの均一な厚
さを有する。７は冷却槽で、冷却水が図示しないポンプ
により循環出来る構造を有し、前記半１ｆＪ槽６内でメ
ッキされたチューブ８を冷却している。Examples of the present invention will be described below. In FIG. 2, reference numeral 1 denotes an uncoiler around which a band-shaped metal plate 2 is wound, and feeds the band-shaped metal plate 2 to a group of forming rollers 3. This forming roller group 3 is driven by an electric motor (not shown),
As a result, the band-shaped metal plate 2 is formed into a cylindrical tube 8. This cylindrical tube 8 enters the flux tank 4, and flux is applied to the outer periphery of the tube 8 to improve solder adhesion. Incidentally, inside the flux tank 4, flux is circulated by a pump (not shown). The tube 8 that has passed through the flux tank 4 is rapidly heated by a high frequency heating coil 9. This high-frequency heating coil 9 has a spiral shape as shown in FIG. 3, and is arranged around the outer periphery of the tube 8 to maintain the temperature of the tube 8 at a constant value between 100°C and 150°C. . 1
0 is a high frequency oscillator, and while the drive roller 3 is being driven, current is continuously passed through the high frequency heating coil 9. Reference numeral 6 denotes a solder tank, which has a structure in which a solder pump (not shown) continuously feeds molten solder into the soldering toy 11 and jets it inside the soldering toy, and continuously supplies the melted solder to the tube 8 preheated by the high-frequency heating coil 9. It can be solder plated. The temperature inside the solder bath 6 is 300° C. to 350° C., and the plating applied within the solder bath 6 has a uniform thickness of about 10 to 20 μm. Reference numeral 7 denotes a cooling tank, which has a structure in which cooling water can be circulated by a pump (not shown), and cools the plated tube 8 in the half 1 fJ tank 6.
尚、前記高周波発振装置１０は、成形速度に応じた加熱
出力をサイリスク制御より自動的にコントロールするこ
とができる。Incidentally, the high frequency oscillator 10 can automatically control the heating output according to the molding speed using cyrisk control.
第４図はチューブ８の成形速度（つまりチューブ８の進
行速度）と高周波加熱コイルの電気容量との関係を示す
図である。この図かられかるように、例えば成形速度２
００ ｍ ／ ｍ ｉ ｎの場合、高周波加熱コイルの
電気容量ば１５ＫＷ必要であり、その時のチューブ８の
表面温度は約１４０ ’Ｃ〜１６０°Ｃの範囲である。FIG. 4 is a diagram showing the relationship between the forming speed of the tube 8 (that is, the advancing speed of the tube 8) and the electric capacity of the high-frequency heating coil. As can be seen from this figure, for example, molding speed 2
In the case of 00 m/min, the electric capacity of the high frequency heating coil is required to be 15 KW, and the surface temperature of the tube 8 at that time is in the range of about 140'C to 160C.
また、第１図に示すような従来の方法で半田メッキを行
った場合、成形速度が１２０ｍ／ｍｉｎ以上になると、
それまでの半田槽６の長さを２倍以上にしないとチュー
ブ８は充分に熱を吸収することができないが、本実施例
では半田槽６の長さを長くする必要のないのはもちろん
のこと、半田槽６の長さを従来のものより短くすること
ができる。In addition, when solder plating is performed using the conventional method as shown in Fig. 1, when the molding speed becomes 120 m/min or more,
The tube 8 will not be able to absorb enough heat unless the length of the solder bath 6 is doubled or more, but in this embodiment, it is of course unnecessary to increase the length of the solder bath 6. In particular, the length of the solder tank 6 can be made shorter than the conventional one.
第１図は従来の半田メッキ方法を示す図、第２図は本発
明の一例を示す図、第３図は高周波加熱コイルの拡大図
、第４図はチューブの成形速度と高周波加熱コイルの電
気容量との関係を示す図である。
２・・・帯状金属板、３・・・成形ローラ、４・・・フ
ラックス槽、６・・・半田槽、７・・・冷却槽、８・・
・チューブ、９・・・高周波加熱コイル。
第１図
第３図 里
第４図
八老迷泉−Figure 1 is a diagram showing a conventional solder plating method, Figure 2 is a diagram showing an example of the present invention, Figure 3 is an enlarged view of a high-frequency heating coil, and Figure 4 is a diagram showing tube forming speed and electricity of the high-frequency heating coil. FIG. 3 is a diagram showing the relationship with capacity. 2... Band-shaped metal plate, 3... Forming roller, 4... Flux bath, 6... Solder bath, 7... Cooling tank, 8...
・Tube, 9...High frequency heating coil. Figure 1 Figure 3 Village Figure 4 Yaro Meizun -
Claims (1)
第一工程と、この筒状チューブにフラフクスを塗布する
第二工程と、このフラフクスが塗布された筒状チューブ
を高周波加熱コイルにより予熱する第三工程と、この加
熱さ−れた筒状チューブに半田をメッキする第四工程と
、このメッキされた筒状チューブを冷却する第五工程と
からなるウォータチューブの半田メッキ方法。A first step of forming a band-shaped metal plate into a cylindrical tube using a forming roller, a second step of applying fluffx to this cylindrical tube, and a third step of preheating the cylindrical tube coated with this fluffx using a high-frequency heating coil. a fourth step of plating solder on the heated cylindrical tube; and a fifth step of cooling the plated cylindrical tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5187484A JPS60196262A (en) | 1984-03-16 | 1984-03-16 | Solder plating method of water tube |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5187484A JPS60196262A (en) | 1984-03-16 | 1984-03-16 | Solder plating method of water tube |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60196262A true JPS60196262A (en) | 1985-10-04 |
Family
ID=12899026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5187484A Pending JPS60196262A (en) | 1984-03-16 | 1984-03-16 | Solder plating method of water tube |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60196262A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5414058A (en) * | 1977-07-01 | 1979-02-01 | Nitsushiyou Densan Kk | Dryer |
| JPS569016A (en) * | 1979-07-04 | 1981-01-29 | Nippon Denso Co Ltd | Production of solder-coated tube |
-
1984
- 1984-03-16 JP JP5187484A patent/JPS60196262A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5414058A (en) * | 1977-07-01 | 1979-02-01 | Nitsushiyou Densan Kk | Dryer |
| JPS569016A (en) * | 1979-07-04 | 1981-01-29 | Nippon Denso Co Ltd | Production of solder-coated tube |
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