JPS60189808U - Thin IC lead bending inspection device - Google Patents

Thin IC lead bending inspection device

Info

Publication number
JPS60189808U
JPS60189808U JP7795684U JP7795684U JPS60189808U JP S60189808 U JPS60189808 U JP S60189808U JP 7795684 U JP7795684 U JP 7795684U JP 7795684 U JP7795684 U JP 7795684U JP S60189808 U JPS60189808 U JP S60189808U
Authority
JP
Japan
Prior art keywords
thin
inspection device
lead bending
bending inspection
optical fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7795684U
Other languages
Japanese (ja)
Other versions
JPH0247442Y2 (en
Inventor
工藤　勝吾
真庭　友由
小柳　義郎
風間　清二
Original Assignee
日立電子エンジニアリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立電子エンジニアリング株式会社 filed Critical 日立電子エンジニアリング株式会社
Priority to JP7795684U priority Critical patent/JPS60189808U/en
Publication of JPS60189808U publication Critical patent/JPS60189808U/en
Application granted granted Critical
Publication of JPH0247442Y2 publication Critical patent/JPH0247442Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の薄形ＩＣ用リすド曲がり検査装置の平
面図、第２図は第１図の■−■断面図、第３図は第２図
の■部拡犬図、第４図は第１図のＩＶ−ｉＶ断面図であ
る。 １・・・ＩＣ，２・・・ガイドレール、３・・・移動テ
ーブル、４・・・直線エンコーダ、５ａ〜５ｄ・・・’
Ｊ　−ト群、６・・・フォトセンサ、６ａ・・・光ファ
イバ、８・・・軸受、９・・・吸着ヘッド、９ａ・・・
伝動軸、１０・・・モータ、１０ａ・・・モータ出力軸
、１１・・・カップリング。Figure 1 is a plan view of the device for inspecting lead bending for thin ICs according to the present invention, Figure 2 is a cross-sectional view taken along the line ■-■ in Figure 1, and Figure 3 is an enlarged view of section ■ in Figure 2. FIG. 4 is a sectional view taken along IV-iV in FIG. 1. 1...IC, 2...Guide rail, 3...Moving table, 4...Linear encoder, 5a to 5d...'
J-group, 6... Photo sensor, 6a... Optical fiber, 8... Bearing, 9... Suction head, 9a...
Transmission shaft, 10... Motor, 10a... Motor output shaft, 11... Coupling.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 薄形ＩＣを吸着して該薄形ＩＣの板面に垂直な軸の回り
に回動させる回転吸着ヘッドと、上記の回転吸着ヘッド
を搭載して薄形ＩＣの板面と平行な方向に移動するテー
ブルと、上記のテーブルの移動量を検出する直線エンコ
ーダとを備え、かつ、前記薄形ＩＣのｌ！−ド端面に対
して移動テーブルの移動方向と垂直に対向せしめて光フ
ァイバの１端を位置せしめるとともに、該光ファイバの
他端をフォトセンサに接続したことを特徴とする薄形Ｉ
Ｃのリード曲がり検査装置。A rotary suction head that suctions a thin IC and rotates it around an axis perpendicular to the plate surface of the thin IC, and a rotating suction head that moves in a direction parallel to the plate surface of the thin IC. a linear encoder for detecting the amount of movement of the table, and a linear encoder for detecting the amount of movement of the thin IC. - A thin type I characterized in that one end of the optical fiber is positioned perpendicularly to the moving direction of the moving table and the other end of the optical fiber is connected to a photosensor.
C lead bending inspection device.
JP7795684U 1984-05-29 1984-05-29 Thin IC lead bending inspection device Granted JPS60189808U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7795684U JPS60189808U (en) 1984-05-29 1984-05-29 Thin IC lead bending inspection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7795684U JPS60189808U (en) 1984-05-29 1984-05-29 Thin IC lead bending inspection device

Publications (2)

Publication Number Publication Date
JPS60189808U true JPS60189808U (en) 1985-12-16
JPH0247442Y2 JPH0247442Y2 (en) 1990-12-13

Family

ID=30621495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7795684U Granted JPS60189808U (en) 1984-05-29 1984-05-29 Thin IC lead bending inspection device

Country Status (1)

Country Link
JP (1) JPS60189808U (en)

Also Published As

Publication number Publication date
JPH0247442Y2 (en) 1990-12-13

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