JPH0247442Y2

JPH0247442Y2 -

Info

Publication number: JPH0247442Y2
Application number: JP7795684U
Authority: JP
Priority date: 1984-05-29
Filing date: 1984-05-29
Publication date: 1990-12-13
Also published as: JPS60189808U

Description

【考案の詳細な説明】〔考案の利用分野〕本考案は薄形ICのリ−ドに曲がりが無いかど
うかを検査する装置に関するものである。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to an apparatus for inspecting whether or not the leads of a thin IC are bent.

[Background of the idea]

薄形ICは比較的最近開発された形式のICで、
底面と頂面とが平行で板状をなし、リ−ドが板面
と平行に突出したICと定義される。この薄形IC
は狭〓な空間に高密度で実装できるという長所が
有つて、急速に普及しつつある。 Thin IC is a relatively recently developed type of IC.
It is defined as an IC whose bottom and top surfaces are parallel, plate-shaped, and whose leads protrude parallel to the plate surface. This thin IC
It has the advantage of being able to be mounted at high density in a narrow space, and is rapidly becoming popular.

前記の如く板面と平行に突出して多数列設され
たリ−ドに変形が有ると、これをソケツトに搭載
したとき電極端子と旨く接触しない上に、接触さ
せるために加圧したときソケツトを変形、破損せ
しめる虞れが有る。このため、薄形ICの工業的
生産において、その製造工程の中間及び末端でリ
−ドの曲がりの有無を検査する必要が有る。 As mentioned above, if a large number of leads protruding parallel to the plate surface are deformed, they will not make good contact with the electrode terminals when mounted in the socket, and will not easily contact the socket when pressure is applied to make contact. There is a risk of deformation or damage. Therefore, in the industrial production of thin ICs, it is necessary to inspect the leads for bending at the middle and end of the manufacturing process.

従来の薄形ICのリ−ドの曲がり検査装置は、
TVカメラでリ−ドを撮像し、画像処理して曲が
りの有無を判定する構造であつたため、 (イ) 画像処理に関する装置が大形、大重量となる
こと、及び (ロ) 画像処理関連装置が高価であること、といつ
た不具合が有つた。 The conventional thin IC lead bending inspection device is
Since the structure was such that a TV camera images the lead and processes the image to determine the presence or absence of bending, (a) the image processing equipment is large and heavy, and (b) the image processing equipment The problem was that it was expensive.

[Purpose of invention]

本考案は上述の事情に鑑みて為され、小形、軽
量、かつ安価な薄形IC用のリ−ド曲がり検査装
置を提供しようとするものである。 The present invention has been made in view of the above-mentioned circumstances, and it is an object of the present invention to provide a lead bending inspection device for thin ICs that is small, lightweight, and inexpensive.

リ−ド曲がりの有無の検査については、被検査
物である薄形ICを水平に支承した場合、リ−ド
突出方向の上下方向の曲がりの有無、並びに、水
平投影形状の曲がりの有無を検出しなければなら
ない。 When inspecting for the presence or absence of lead bending, when the test object, a thin IC, is supported horizontally, the presence or absence of bending in the vertical direction of the lead protrusion direction, as well as the presence or absence of bending in the horizontal projection shape, is detected. Must.

[Summary of the idea]

上記の目的を達成するため、本考案の検査装置
は、薄形ICを吸着して該薄形ICの板面に垂直な
軸の回りに回動させる回転吸着ヘツドと、上記の
回転吸着ヘツドを搭載して薄形ICの板面と平行
な方向に移動するテ−ブルと、上記のテ−ブルの
移動量を検出する直線エンコ−ダとを備え、か
つ、前記薄形ICのリ−ド端面に対して移動テ−
ブルの移動方向と垂直に対向せしめて光フアイバ
の１端を位置せしめるとともに、該光フアイバの
他端をフオトセンサに接続したことを特徴とす
る。 In order to achieve the above object, the inspection device of the present invention includes a rotary suction head that suctions a thin IC and rotates it around an axis perpendicular to the plate surface of the thin IC; It is equipped with a table that is mounted and moves in a direction parallel to the board surface of the thin IC, a linear encoder that detects the amount of movement of the table, and a lead of the thin IC. Move the moving table against the end face.
One end of the optical fiber is positioned perpendicularly to the moving direction of the optical fiber, and the other end of the optical fiber is connected to a photo sensor.

[Example of idea]

次に、本考案の１実施例を第１図乃至第４図に
ついて説明する。 Next, one embodiment of the present invention will be described with reference to FIGS. 1 to 4.

第１図は本考案の検査装置の１実施例の平面図
を模式的に描いた説明図、第２図は第１図の−
断面を模式的に描いた説明図、第３図は第２図
に仮想線で囲んで示した部の拡大詳細図、第４
図は第１図の−断面を模式的に描いた説明図
である。 FIG. 1 is an explanatory diagram schematically depicting a plan view of one embodiment of the inspection device of the present invention, and FIG.
An explanatory drawing schematically depicting a cross section; Fig. 3 is an enlarged detailed view of the area surrounded by imaginary lines in Fig. 2;
The figure is an explanatory diagram schematically depicting the - cross section of FIG. 1.

１は被検査物である薄形ICである。 1 is a thin IC that is an object to be inspected.

ガイドレ−ル２によつて案内される移動テ−ブ
ル３を設ける。説明の便宜上、ガイドレ−ル２の
方向をＸ軸とし、これに直交する水平方向をＹ軸
とする。 A moving table 3 guided by a guide rail 2 is provided. For convenience of explanation, the direction of the guide rail 2 is assumed to be the X axis, and the horizontal direction orthogonal to this is assumed to be the Y axis.

移動テ−ブル３のＸ軸方向の移動量を検出して
その位置を算定するように直線エンコ−ダ４を設
ける。 A linear encoder 4 is provided to detect the amount of movement of the moving table 3 in the X-axis direction and calculate its position.

第１図に示すごとく、IC１に設けられている
多数のリ−ドの内、Ｘ方向に突出している11本の
リ−ドのグル−プをリ−ド群５ａと名付ける。同
様に、Ｙ方向の11本をリ−ド群５ｂ，X′方向の
11本をリ−ド群５ｃ，Y′方向の11本をリード群
５ｄと名付ける。 As shown in FIG. 1, among the large number of leads provided on the IC 1, a group of 11 leads protruding in the X direction is named a lead group 5a. Similarly, the 11 wires in the Y direction are connected to the lead group 5b, and the 11 wires in the X' direction are
The 11 leads are named a lead group 5c, and the 11 leads in the Y' direction are named a lead group 5d.

１対のフオトセンサ６，７を設け、その光入出
力をそれぞれ光フアイバ６ａ，７ａで導く。そし
て上記の光フアイバ６ａの末満はリ−ド群５ａに
対してＹ軸方向に対向するように支承するととも
に、光フアイバ７ａの末満はリ−ド群５ｄに対し
てＹ軸方向に対向せしめる。 A pair of photo sensors 6 and 7 are provided, and their optical input and output are guided through optical fibers 6a and 7a, respectively. The end of the optical fiber 6a is supported so as to face the lead group 5a in the Y-axis direction, and the end of the optical fiber 7a is supported so as to face the lead group 5d in the Y-axis direction. urge

第２図に示した５b′はリ−ド群５ｂ中の１本の
リ−ド、同じく５g′はリ−ド群５ｄ中の１本のリ
−ドである。 5b' shown in FIG. 2 is one lead in the lead group 5b, and 5g' is one lead in the lead group 5d.

第３図に実線で示したリ−ド５d′のように、リ
−ドと光フアイバ７ａとが正対していれば、該リ
−ドの端面がフオトセンサ７によりON，OFF信
号として検知されるが、もし、仮想線で示した５
d″のように上下に変形していると検知されない。
このため、フオトセンサによつてリ−ドの上下方
向の曲がりの有無が検知される。 If the lead and the optical fiber 7a are directly facing each other, as shown by the solid line in FIG. 3, the end face of the lead will be detected by the photo sensor 7 as an ON or OFF signal. However, if 5 shown by the virtual line
If it is deformed vertically like d″, it will not be detected.
Therefore, the presence or absence of vertical bending of the lead is detected by the photo sensor.

第１図において、移動テ−ブル３を右方に移動
させると、光フアイバ６ａは11本のリ−ド群５ｂ
の内の各リ−ドに対して順次に対向しつつ擦れ違
うので、これらのリ−ド群に曲がりが無ければ11
回の検知信号が得られる。 In FIG. 1, when the moving table 3 is moved to the right, the optical fiber 6a is connected to the 11 lead group 5b.
Since each lead in the group faces each other in turn and rubs against each other, if there are no bends in these lead groups, the lead will be 11
Detection signals are obtained.

もし、リ−ドが検知されないときは、リ−ドが
上方若しくは下方に曲がつているものと判断さ
れ、直線エンコ−ダ４の位置信号と対比して何本
目のリ−ドに異常が有るかを判定し得る。 If the lead is not detected, it is determined that the lead is bent upward or downward, and it is determined which lead is abnormal compared to the position signal of the linear encoder 4. It can be determined whether

また、11本のリ−ドが正しくＹ方向を向いてい
れば、検知信号は直線エンコ−ダ４の位置信号と
対応して等ピツチで検出されるが、もしＹ方向に
対して水平面内で振れているとピツチ狂いとして
検出される。 Furthermore, if the 11 leads are correctly oriented in the Y direction, the detection signals will be detected at equal pitches in correspondence with the position signal of the linear encoder 4, but if they are in the horizontal plane with respect to the Y direction, If it oscillates, it will be detected as being out of pitch.

このようして、フオトセンサ６と光フアイバ６
ａとによつてリ−ド群５ｂ中におけるリ−ドの変
形の有無が検出される。 In this way, the photo sensor 6 and the optical fiber 6
The presence or absence of deformation of the leads in the lead group 5b is detected by a.

上記の作用と同時に、同様にして、フオトセン
サ７と光フアイバ７ａとによつてリ−ド群５ｄが
検査される。 Simultaneously with the above operation, the lead group 5d is similarly inspected by the photo sensor 7 and the optical fiber 7a.

第４図に示すように、移動テ−ブル３に対して
軸受８を介して吸着ヘツド９が回転自在に支承さ
れ、この吸着ヘツド９がIC1を吸着保持している
上記の吸着ヘツド９はモ−タ１０により回転駆動
される。１０ａはモ−タ出力軸、９ａは伝動軸、
１１はカツプリングである。 As shown in FIG. 4, a suction head 9 is rotatably supported on the movable table 3 via a bearing 8, and this suction head 9 holds the IC1 by suction. - Rotationally driven by the motor 10. 10a is the motor output shaft, 9a is the transmission shaft,
11 is a coupling.

これにより、モ−タ１０を作動させて吸着ヘツ
ド９を回動させ、保持しているIC1を垂直軸の回
りに（即ちICの板面と垂直な軸の回りに）回動
させることができる。 As a result, the motor 10 can be operated to rotate the suction head 9, and the IC1 being held can be rotated around a vertical axis (that is, around an axis perpendicular to the plate surface of the IC). .

第１図において移動テ−ブル３を右方に駆動
し、IC１が仮想線で示した１′位置に達すると、
これを右回りに90゜回転させ、リ−ド群５ａ〜５
ｄをそれぞれ仮想線で示した５a′〜５d′のごとく
方向変換（90゜右回り）させる。再び移動テ−ブ
ル３を左方へ駆動しつつ、フオトセンサ６でリ−
ド群５c′を、フオトセンサ７でリ−ド群５a′を、
それぞれ検査して１個の薄形IC１のリ−ド全数
の曲り検査を完了する。 In FIG. 1, when the moving table 3 is driven to the right and IC1 reaches the 1' position shown by the imaginary line,
Rotate this 90 degrees clockwise and lead groups 5a to 5.
d is changed in direction (90 degrees clockwise) as shown by phantom lines 5a' to 5d'. While driving the moving table 3 to the left again, the photo sensor 6
The lead group 5c' is connected to the lead group 5a' by the photo sensor 7.
Each test is performed to complete the bending test for all the leads of one thin IC 1.

以上の構造機能から明らかなように、本実施例
の検査装置はTVカメラや画像処理手段を設け
ず、小形、軽量で安価なフオトセンサ６，７の
ON，OFF信号と、直線エンコ−ダ４の位置信号
とによつて、薄形IC１の44本のリ−ド全数の曲
がりの有無を迅速、容易、かつ正確に判定するこ
とができる。 As is clear from the above structural functions, the inspection device of this embodiment does not include a TV camera or image processing means, and uses small, lightweight, and inexpensive photo sensors 6 and 7.
Based on the ON/OFF signals and the position signal of the linear encoder 4, it is possible to quickly, easily, and accurately determine whether or not all 44 leads of the thin IC 1 are bent.

〔考案の効果〕以上詳述したように、本考案によれば小形、軽
量、かつ安価な薄形IC用のリ−ド曲がり検査装
置を構成することができる。[Effects of the Invention] As detailed above, according to the present invention, it is possible to construct a lead bending inspection device for a thin IC that is small, lightweight, and inexpensive.

[Brief explanation of the drawing]

第１図は本考案の薄形IC用リ−ド曲がり検査
装置の平面図、第２図は第１図の−断面図、
第３図は第２図の部拡大図、第４図は第１図の
−断面図である。１……IC、２……ガイドレ−ル、３……移動
テ−ブル、４……直線エンコ−ダ、５ａ〜５ｄ…
…リ−ド群、６……フオトセンサ、６ａ……光フ
アイバ、８……軸受、９……吸着ヘツド、９ａ…
…伝動軸、１０……モ−タ、１０ａ……モ−タ出
力軸、１１……カツプリング。 Fig. 1 is a plan view of the thin IC lead bending inspection device of the present invention, Fig. 2 is a cross-sectional view of Fig. 1,
FIG. 3 is an enlarged view of a portion of FIG. 2, and FIG. 4 is a cross-sectional view taken from FIG. 1...IC, 2...Guide rail, 3...Moving table, 4...Linear encoder, 5a to 5d...
...Lead group, 6...Photo sensor, 6a...Optical fiber, 8...Bearing, 9...Suction head, 9a...
...Transmission shaft, 10...Motor, 10a...Motor output shaft, 11...Coupling.

Claims

[Scope of utility model registration request]

A rotary suction head that suctions a thin IC and rotates it around an axis perpendicular to the plate surface of the thin IC, and a rotating suction head that moves in a direction parallel to the plate surface of the thin IC. a linear encoder for detecting the amount of movement of the table, and
One of the optical fibers is arranged perpendicularly to the moving direction of the moving table to face the lead end face of the thin IC.
a thin type, characterized in that one end of the optical fiber is positioned, and the other end of the optical fiber is connected to a photo sensor.
IC lead bending inspection device.