JPS60180048A - Electric field type ion source - Google Patents
Electric field type ion sourceInfo
- Publication number
- JPS60180048A JPS60180048A JP59033529A JP3352984A JPS60180048A JP S60180048 A JPS60180048 A JP S60180048A JP 59033529 A JP59033529 A JP 59033529A JP 3352984 A JP3352984 A JP 3352984A JP S60180048 A JPS60180048 A JP S60180048A
- Authority
- JP
- Japan
- Prior art keywords
- ion source
- tip
- electric field
- field type
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005684 electric field Effects 0.000 title claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 238000010884 ion-beam technique Methods 0.000 claims description 5
- 239000002826 coolant Substances 0.000 claims description 2
- 150000002500 ions Chemical class 0.000 abstract description 34
- 239000007789 gas Substances 0.000 abstract description 22
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 4
- 239000001257 hydrogen Substances 0.000 abstract description 4
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 239000000919 ceramic Substances 0.000 abstract description 2
- 239000002923 metal particle Substances 0.000 abstract description 2
- 229910001111 Fine metal Inorganic materials 0.000 abstract 1
- 238000005245 sintering Methods 0.000 abstract 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- -1 hydrogen ions Chemical class 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000002164 ion-beam lithography Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000001883 metal evaporation Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J27/00—Ion beam tubes
- H01J27/02—Ion sources; Ion guns
- H01J27/26—Ion sources; Ion guns using surface ionisation, e.g. field effect ion sources, thermionic ion sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/08—Ion sources
- H01J2237/0802—Field ionization sources
- H01J2237/0807—Gas field ion sources [GFIS]
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Electron Sources, Ion Sources (AREA)
Abstract
Description
【発明の詳細な説明】
(a)発明の技術分野
本発明はりソグラフィ装置の照射源等に適用する電界型
イオン源に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to an electric field type ion source applied to an irradiation source of a lithographic apparatus.
(b)技術の背景
近時、集積回路の大規模化、高密度化の趨勢に伴い、イ
オンビーム露光法が着目されている。(b) Background of the Technology In recent years, with the trend toward larger scale and higher density integrated circuits, ion beam exposure has attracted attention.
該露光法は他の例えばX線や電子ビームを用いる露光法
に比べて、微細化パターン形成のレジストあるいはメタ
ル蒸着マスクに対するパターン露光時の横方向散乱や近
接効果が少ないことから分解能が高く、また露光感度が
格段に優れている。Compared to other exposure methods using X-rays or electron beams, this exposure method has high resolution because there is less lateral scattering and proximity effects during pattern exposure on resists or metal evaporation masks for fine pattern formation, and Extremely high exposure sensitivity.
本発明は微細化パターンマスクの形成、該形成のパター
ンをウェハ面に転写する際のイオン光学系のFIB (
Focused Ion Beam)照射源又はイオン
源の改良に関する。The present invention relates to the formation of a fine pattern mask and the FIB (
This invention relates to improvements in irradiation sources (Focused Ion Beam) or ion sources.
(C)従来技術と問題点
この種イオンビーム照射源の一構成例を第1図断面図に
より説明する。(C) Prior Art and Problems An example of the configuration of this type of ion beam irradiation source will be explained with reference to a sectional view in FIG.
第1図に於いて、1は尖端曲率の半径が0.1 μm程
度に研磨加工されたタングステン等から形成したガス電
離用の一方側の電極(通称、エミッタチップと呼ばれる
)、2はエミッタチップ1を同軸的に囲むガス電離用の
他方側電極を兼ねるイオン引出し電極、3は前記引出し
電極2側面の高純度水素ガスの噴出孔、及び4は同電極
2の軸心部に形成された電離水素イオンの放射孔である
。In Fig. 1, 1 is an electrode (commonly called an emitter tip) for gas ionization made of tungsten or the like that has been polished to a radius of curvature of the tip of about 0.1 μm, and 2 is an emitter tip. 1 is an ion extraction electrode that coaxially surrounds 1 and serves as the other side electrode for gas ionization; 3 is a high-purity hydrogen gas ejection hole on the side surface of the extraction electrode 2; and 4 is an ionization electrode formed at the axial center of the electrode 2. It is a radiation hole for hydrogen ions.
前記配置の電極Iと2の間は、詳細に図示されないが熱
伝導性の高い絶縁体で隔離され且つ隔離の空間は前記水
素ガスが1O−2Torr程度に充満される。Although the electrodes I and 2 arranged in the above arrangement are not shown in detail, they are isolated by a highly thermally conductive insulator, and the isolated space is filled with the hydrogen gas at a pressure of about 10-2 Torr.
電極1と2間、5〜20kVの直流高圧を印加すること
により、エミッタチップ尖端の曲率6近辺の電界強度が
ガス電離に充分な強度となる。かくして電離の水素イオ
ンが生成され、該生成のイオンを引出し加速して、及び
集束レンズ系等で集束して、微細パターン形成のターゲ
ツト体に向は照射する(集束レンズ及びビーム偏向の走
査電極等は図示されない)。By applying a DC high voltage of 5 to 20 kV between the electrodes 1 and 2, the electric field strength near the curvature 6 of the tip of the emitter tip becomes sufficient for gas ionization. In this way, ionized hydrogen ions are generated, and the generated ions are extracted, accelerated, focused by a focusing lens system, etc., and irradiated onto a target object for fine pattern formation (a focusing lens, a scanning electrode for beam deflection, etc.) (not shown).
然しなから、従来の前記イオン源に於けるエミッタチッ
プ尖端のガス電離は、チップ表面のガス吸着現象により
律速されるものである為、電離イオン量が限定され例え
ば、単位立体周当たり0.5μ八以下と小さい。又、チ
ップ尖端から放射するイオン量はチップ表面の清浄度に
よりガス吸着作用が劣化する。このため放射イオン源と
してのビーム照射の輝度が低下する等の問題もある。However, gas ionization at the tip of the emitter tip in the conventional ion source is rate-limited by the gas adsorption phenomenon on the tip surface, so the amount of ionized ions is limited, for example, 0.5 μ per unit solid circumference. Small, less than eight. Furthermore, the gas adsorption effect of the amount of ions emitted from the tip of the tip deteriorates depending on the cleanliness of the tip surface. For this reason, there are also problems such as a reduction in the brightness of beam irradiation as a radiation ion source.
(d)発明の目的 本発明は前記の問題点を解決することである。(d) Purpose of the invention The present invention is to solve the above problems.
前記FBI照射のりソグラフィ装置等に於いて、高イ輝
度のパターン照射能を存する点状ガスイオン源を具体化
することにある。The object of the present invention is to embody a point gas ion source capable of pattern irradiation with high brightness in the FBI irradiation lithography apparatus and the like.
(e)発明の構成
前記の目的は、イオンビームを集束、偏向して照射する
イオン源に於いて、多孔質金属のエミッタチップを備え
且つ該チップ内に冷却媒体が充填され前記ガスを引き出
すことにより達成することが出来る。(e) Structure of the Invention The above-mentioned object is to provide an ion source that focuses and deflects an ion beam for irradiation, which is equipped with a porous metal emitter chip and filled with a cooling medium to draw out the gas. This can be achieved by
(f)発明の実施例
以下、イオンビームリソグラフィ装置の照射源等に適用
する本発明の電界型イオン源実施例を図面に従って詳細
に説明する。(f) Embodiments of the Invention Hereinafter, embodiments of an electric field type ion source of the present invention applied to an irradiation source of an ion beam lithography apparatus will be described in detail with reference to the drawings.
本発明は、エミッタチップ尖端に流入するイオン源原子
がイオン化されれば、直ちに次の原子が流入しそれがイ
オン化されると云う過程を迅速にする電離ガス放出量が
多い焼結金属体のエミッタチップを使用している。The present invention provides an emitter made of a sintered metal body that releases a large amount of ionized gas to speed up the process in which when the ion source atoms flowing into the tip of the emitter tip are ionized, the next atoms immediately flow in and are ionized. Chips are used.
第2図はエミッタチップの構成を模式的に示すイオン源
断面図である。FIG. 2 is a cross-sectional view of the ion source schematically showing the configuration of the emitter chip.
図中、7は尖端が尖鋭曲率面とされた電離電極としての
エミッタチップ、2は前記従来の構成図で説明した引出
し電極、8はエミッタチップ7の尖鋭曲率面10を形成
した金属微粒子から焼結固化した多孔質金属、及び9は
前記チップ7を絶縁支持しまた外気と遮断する気密接合
部13を生成するセラミック等からなる絶縁体で、イオ
ンの電離空間を形成する壁部である。In the figure, 7 is an emitter tip as an ionization electrode whose tip has a sharply curved surface, 2 is the lead-out electrode explained in the conventional configuration diagram, and 8 is a sintered metal particle formed with a sharply curved surface 10 of the emitter tip 7. The solidified porous metal and 9 are insulators made of ceramic or the like that insulate and support the chip 7 and form an air-tight joint 13 that isolates it from the outside air, and is a wall that forms an ionization space for ions.
更に、前記チップ体7は、内部の空洞11が多孔質金属
で形成されてなり、空洞内には電離イオンとなる液化ガ
スが充填される。充填ガスは、大気圧か乃至は若干高い
気圧状態とされる。使用の液化ガスとしては、 −25
3℃(沸点)の水素、または−186℃のアルゴン等の
元素を用いる。Further, the chip body 7 has an internal cavity 11 formed of porous metal, and the cavity is filled with a liquefied gas that becomes ionized ions. The filling gas is at atmospheric pressure or at a slightly higher pressure. The liquefied gas used is -25
An element such as hydrogen at 3°C (boiling point) or argon at -186°C is used.
これから明らかな様に本発明のイオン源は、従来の抵抗
加熱方式あるいはRF電力による誘導加熱方式のイオン
源と異なり、寧ろ極低温の液化媒体を充填せるエミッタ
チップ電極7を具備する。−又電離界面をなす電極尖端
10部は、空洞11内の液化ガスが浸潤し得る多孔質の
焼結金属8とされる。As is clear from this, the ion source of the present invention is different from the conventional resistance heating type or induction heating type ion source using RF power, and is equipped with an emitter tip electrode 7 that can be filled with an extremely low temperature liquefied medium. -Also, the electrode tip 10 forming the ionization interface is made of porous sintered metal 8 into which the liquefied gas in the cavity 11 can infiltrate.
第3図は本発明イオン源としての他の実施例を模式的に
しめず電極断面図である。FIG. 3 is a schematic cross-sectional view of an electrode of another embodiment of the ion source of the present invention.
第2図実施例と比較して、前記空洞11充填液化ガスが
常時、浸潤する多孔質焼結金属8が電極尖端10に配置
されることは同じであるが、主な相違点は次のとおり。Compared to the embodiment shown in FIG. 2, the porous sintered metal 8 into which the liquefied gas filling the cavity 11 constantly permeates is disposed at the electrode tip 10, but the main differences are as follows. .
第3図エミッタチップ電極体7 (第2図参照)を囲ん
で該電極周辺を冷却する同軸状の二重管構成電極12と
される。同軸構成の電極12に充填する液化ガスは、前
記水素のイオン源とする時、外部管14(!ljには一
269°Cの液化ヘリウムが、又、前記アルゴンのイオ
ン源とする時は外部管14側に一196°C(沸点)゛
の液化窒素が、夫々充填され内部管15内元素の冷却を
なす。A coaxial double-tube electrode 12 surrounds the emitter tip electrode body 7 (see FIG. 2) in FIG. 3 and cools the area around the electrode. The liquefied gas to be filled in the coaxial electrode 12 is liquefied helium at -269°C in the external tube 14 (!lj) when used as the hydrogen ion source, and external liquefied helium at -269°C when used as the argon ion source. The tubes 14 are filled with liquefied nitrogen at -196° C. (boiling point) to cool the elements inside the inner tubes 15.
このようにすれば、イオン源ガスの不必要な損耗もしく
は無用の気化が避けられて昇華しやすいイオン源ガスを
効率的に使用することが出来る。In this way, unnecessary loss or unnecessary vaporization of the ion source gas can be avoided, and the ion source gas that easily sublimates can be used efficiently.
前記詳細に説明した多孔質エミッタチップ電極を具備す
る電界型イオン源によれば、チップ尖端のガス分圧が適
宜高められると共にイオン電流の制御も容易である。従
って、微細化パターン形成時における高輝度のビーム照
射源が容易に得られる。According to the electric field type ion source equipped with the porous emitter tip electrode described in detail above, the gas partial pressure at the tip tip can be appropriately increased, and the ion current can be easily controlled. Therefore, a high-intensity beam irradiation source for forming fine patterns can be easily obtained.
(g)発明の効果
以上5本発明の多孔質エミッタチップ電極を具備する電
界型イオン源によれば1供給のイオン源ガスに対する制
約が無く、従来問題とされた微細化パターン形成の露光
イオン照射源の輝度も高められる等幾多の利点がある。(g) Effects of the Invention (5) According to the electric field type ion source equipped with the porous emitter tip electrode of the present invention, there is no restriction on the supply of ion source gas, and exposure ion irradiation for forming fine patterns, which has been a problem in the past. There are many advantages, such as increasing the brightness of the source.
第1図は従来のイオン源要部構成を示す断面図である。
第2図は本発明イオン照射源の要部構成を模式的に示す
断面図、及び第3図は本発明イオン照射源の他実施例を
模式的に示す断面図である。FIG. 1 is a sectional view showing the configuration of the main parts of a conventional ion source. FIG. 2 is a cross-sectional view schematically showing the main structure of the ion irradiation source of the present invention, and FIG. 3 is a cross-sectional view schematically showing another embodiment of the ion irradiation source of the present invention.
Claims (1)
て、多孔質金属のエミッタチップを備え且つ該チップ内
に冷却媒体が充填され前記ガスを引き出すことを特徴と
する電界型イオン源。An electric field type ion source that focuses, deflects, and directs an ion beam, and is characterized by having a porous metal emitter tip and filling the tip with a cooling medium to draw out the gas.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59033529A JPS60180048A (en) | 1984-02-24 | 1984-02-24 | Electric field type ion source |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59033529A JPS60180048A (en) | 1984-02-24 | 1984-02-24 | Electric field type ion source |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60180048A true JPS60180048A (en) | 1985-09-13 |
Family
ID=12389071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59033529A Pending JPS60180048A (en) | 1984-02-24 | 1984-02-24 | Electric field type ion source |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60180048A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4774433A (en) * | 1986-04-09 | 1988-09-27 | Hitachi, Ltd. | Apparatus for generating metal ions |
US20080217555A1 (en) * | 2003-10-16 | 2008-09-11 | Ward Billy W | Systems and methods for a gas field ionization source |
AT506340B1 (en) * | 2008-01-25 | 2012-04-15 | Fotec Forschungs & Technologi | METHOD FOR PRODUCING AN ION SOURCE |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57180047A (en) * | 1981-04-27 | 1982-11-05 | Nippon Telegr & Teleph Corp <Ntt> | Ion beam generator |
JPS58163135A (en) * | 1982-03-20 | 1983-09-27 | Nippon Denshi Zairyo Kk | Ion source |
-
1984
- 1984-02-24 JP JP59033529A patent/JPS60180048A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57180047A (en) * | 1981-04-27 | 1982-11-05 | Nippon Telegr & Teleph Corp <Ntt> | Ion beam generator |
JPS58163135A (en) * | 1982-03-20 | 1983-09-27 | Nippon Denshi Zairyo Kk | Ion source |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4774433A (en) * | 1986-04-09 | 1988-09-27 | Hitachi, Ltd. | Apparatus for generating metal ions |
US20080217555A1 (en) * | 2003-10-16 | 2008-09-11 | Ward Billy W | Systems and methods for a gas field ionization source |
US9159527B2 (en) * | 2003-10-16 | 2015-10-13 | Carl Zeiss Microscopy, Llc | Systems and methods for a gas field ionization source |
AT506340B1 (en) * | 2008-01-25 | 2012-04-15 | Fotec Forschungs & Technologi | METHOD FOR PRODUCING AN ION SOURCE |
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