JPS6017884Y2 - electronic components - Google Patents

Description

[Detailed explanation of the idea] The present invention relates to electronic components encased in resin.

Generally, in the case of a resin-cased electronic component, such as a capacitor, a capacitor element with a lead-out terminal attached is housed in the resin case, and the gap is filled with a sealing resin.

However, when the capacitor element is made of metallized polypropylene film and the sealing resin is made of epoxy resin, the capacitor element has a lower specific gravity than the sealing resin, so the capacitor element floats during the sealing resin filling process and the resin thickness at the case opening increases. The problem is that the capacitor element becomes thin, or in extreme cases, the capacitor element protrudes from the resin surface, impairing moisture resistance.

Therefore, conventionally, as shown in Fig. 1, a square resin case 1
Epoxy resin 3 is placed in the cavity where the capacitor element 2 is housed.
The fixture 5 is filled with the epoxy resin 3 from the lead terminals 4a and 4b attached to the capacitor element 2 until the epoxy resin 3 is cured.
This was done to prevent the capacitor element 2 from coming out.

However, if each capacitor element is attached in this way, the work efficiency is extremely poor, and in order to improve the work efficiency, it may be possible to press multiple capacitors together with a fixing tool, but the lead-out terminal to the end face of the capacitor element Since the installation position in the height direction is not constant, if such items are pressed all at once with a fixing tool, the storage position of the capacitor element will vary, and the thickness of the epoxy resin at the case opening will vary. If the thickness cannot be ensured, it causes poor moisture resistance and has the disadvantage of not being able to withstand long-term use.

In order to eliminate these drawbacks, as shown in FIGS. 2 and 3, an element support 8 is provided in which the connecting portion 6 is integrated with a holding portion 7at7b that is curved inward from the middle and has elasticity. As shown in FIG.

A square case 11 with a capacitor element 10 inserted between 7b
A structure in which the sealing resin 12 is filled in the cavity of the case 11 and hardened after being stored in the case 11 is conceivable.
and a clamping portion 7a.

The dimension B between each curved vertex 9a and 9b of 7b must be set appropriately according to the size of the rectangular case 11 and capacitor element 10 used, and the same size must be used for all. It is impossible to do so.

In other words, if the inner width C of the case 11 is significantly larger than A, there will be variations in the storage position, and the capacitor element 10
If the width dimension is smaller than 8 dimensions, it is impossible to support the element, and in any case, it is necessary to prepare an element support that matches the case used and the size of the capacitor element, and in terms of parts management. I couldn't say it was a good thing.

The present invention has been developed in view of the above points, and has a simple structure that can be used uniformly regardless of the size of the case or electronic component element. The object of the present invention is to provide an electronic component that is inexpensive and has high practical value, which does not lift up and can secure a fixed element storage position.

An embodiment of the present invention will be described below with reference to the drawings.

That is, as shown in FIG. 5, for example, a pair of metallized polypropylene films are overlapped and wound to form metallicon electrodes 21 on both end faces, and a capacitor element 23 with lead terminals 22 connected to the metallicon electrodes 21 is made of, for example, polyester. Square case 2 made of synthetic resin such as , polycarbonate, vinyl chloride, polypropylene, ABBS resin, etc.
4, and between both sides of the capacitor element 23 and the inner wall of the case 24, as shown in FIG.
A curved element support 25 having elasticity made of a synthetic resin plate such as BS resin molded into a semicircular shape is inserted, and the capacitor element 23 is sandwiched between the curved apexes 26 of the support 25. The cavity in the case 24 is filled with a sealing resin 27 such as epoxy resin or polyester resin, and the sealing resin 2
It is made by thermosetting 7.

According to the capacitor configured as described above, the capacitor element 23 is connected to the curved apex 26 of the curved element support 25.
As a result, the capacitor element 23 can be fixed at a desired position within the case 13, and the capacitor element 23 will not be lifted up during the filling and curing process of the sealing resin 27, and the opening thickness t of the sealing resin 27 that was originally set can be maintained. can be ensured.

Therefore, the problem of poor moisture resistance due to insufficient opening thickness t can be solved, and at the same time, the opening thickness t can be set to the necessary minimum, contributing to miniaturization.

Furthermore, since the curved element support 25 has an extremely simple structure with elasticity made by simply forming a synthetic resin plate into a semicircular shape, it can be used uniformly regardless of the size of the case and capacitor element used. It does not require special component management depending on the size of the case and the capacitor element, and is inexpensive and of high practical value.

In the above embodiments, the element support is limited to a plate-shaped element support, but the same effect can be obtained by using a curved element support 28 formed from a synthetic resin rod as shown in FIG.

In the figure, 29 is a curved apex.

Furthermore, in the above embodiment, one pair of curved element supports is used, but when the total length of the capacitor element 30 is long as shown in FIG. It is more effective to use

In the figure, 31 is a square case, and 32 is a sealing resin.

Although all of the embodiments have been explained using capacitors as an example, it goes without saying that the present invention can be applied to electronic components other than capacitors.

As described above, according to the present invention, elastic curved element supports formed in a semicircular shape are inserted on both sides of an electronic component element housed in a case, and the apexes of the curved element are supported on both sides of the electronic component element. By doing so, it is possible to secure the storage position of the element, and also to obtain an inexpensive electronic component with high practical value, which can prevent the element from lifting up during filling and curing of the sealing resin.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a capacitor according to a conventional example, and FIGS. 2 to 4 are related to other conventional reference examples, and FIGS. Figure 4 is a sectional view showing a capacitor, Figures 5 and 6 are an embodiment of the present invention, and Figure 5 is a sectional view showing a capacitor.
The figure is a perspective view showing the curved element support configuring FIG.
FIG. 7 is a perspective view showing a curved element support according to another embodiment of the present invention, and FIG. 8 is a sectional view showing a capacitor according to another embodiment of the present invention. 23.30...Capacitor element, 24,31.
... Square case, 25, 28 ... Curved element support, 26, 29 ... Curved apex, 27
．． 32...Sealing resin.

Claims (1)

[Scope of utility model registration request] A rectangular case made of synthetic resin, an electronic component element housed in the case, and a resilient curved element support formed by molding a synthetic resin plate or rod into a semicircular shape inserted between both sides of the element and the inner wall of the case. and a sealing resin filled in the case cavity, wherein the curved vertices of each of the element supports are located on both sides of the element.