JPS60177698A - Mounting board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to a technique that is effective when applied to a mounting board for electronic components, and is particularly effective when applied to a mounting board on which a large number of electronic components are fixed, for example. It is related to.

[Background technology]

When mounting an electronic component on a board, the external terminals of the electronic component are sequentially soldered to the board electrodes and fixed. If it is discovered that the mounted electronic component or board is defective after soldering, it will cost you a lot of time and effort.
Either melt the solder, separate the electronic component from the board, replace the electronic component or board and mount it, or remove the entire board.
The problem arises that it must be disposed of.

The inventors have discovered that this problem is particularly serious for boards on which a large number of electronic components are mounted on the same board.

[Purpose of the invention]

An object of the present invention is to provide an effective technique that can be applied to improve work efficiency when mounting electronic components on a board.

Another object of the present invention is to provide a technique which is effective when applied to improve the yield of electronic devices in which a large number of electronic parts are mounted on the same substrate.
It is about providing.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

That is, by using a low melting point metal in at least a portion of the mounting electrode of the board, it is formed so that it can make sufficient contact with the external terminal of the electronic component to be mounted and is detachable. Since the inspection can be carried out simply by fitting the external terminal to the mounting electrode, if there is a problem such as a defect, the electrode can be heated to melt the low melting point metal Z before completely fixing it. , countermeasures can be taken and the above objectives can be achieved.

[Embodiment 1] FIG. 1 is a cross-sectional view of a part of a mounting board according to Embodiment 1 of the present invention, taken along a plane passing approximately through the center of the mounting electrode. In this figure, a semiconductor device formed of a bin grid array type package indicated by a two-dot chain line is shown in a mounted state.

The mounting board 1 according to the first embodiment is made of a green board 3 made of polyimide resin or the like on which a predetermined wiring 2 is formed on the back surface. Through holes 6 are formed at intervals corresponding to 5V, and sockets 7, which are mounting electrodes, are attached to the through holes (v6) while being electrically connected to the wiring 2.

In the mounting board 1 of the first embodiment, the socket 7 is fixed in a grommet shape by crushing both ends to form a frame 7a that tightly contacts the front and back surfaces of the board, as shown in FIG. There are 2 holes in through hole 6.
This is a cross-sectional section in which two bows face each other, as shown in plan view in Figure 2.

The socket 7 is made of a metal material having an elasticity yal' that can sufficiently tighten the bottle when the semiconductor device 1 is mounted, such as tin or an alloy mainly containing tin Y, and has a relatively low melting point. It is made of things.

Therefore, when the mounting board of Example 1 is used, the performance can be tested in a temporarily fixed state using the elasticity of the socket 70 as shown in FIG. 1 before final fixing. If a defect is found in the semiconductor device 4 or the mounting board 1, it can be easily replaced because the socket 7 is removable, and if it passes the inspection, the metal material of the socket 7 can be replaced as is. The final fixation can be achieved by heating the material above its melting point to perform thermal fusion.

Therefore, when manufacturing electronic devices using the mounting board Y of Example 1, it is possible to improve workability and prevent the occurrence of defective products, thereby achieving an improvement in yield. It is.

[Example 2] The mounting board according to the second embodiment of the present invention is roughly the same as the mounting board of the first embodiment, except that the mounting electrodes have a 2Iil structure as shown in an enlarged view in FIG. It is characterized by the way it is formed.

That is, the socket 7 of the mounting board 1 of the second embodiment is made of a metal material, such as copper or copper alloy, which has a certain degree of elasticity and is normally used as a socket material, and the surface of the socket 7 is The solder 8 is applied to form two layers Z.

Since the mounting board of the second embodiment is equipped with the mounting chamber & having the structure as described above, when manufacturing electronic equipment by mounting electronic components such as semiconductor devices, the elasticity of the socket 70 first allows the electronic components to be mounted. The performance test can be carried out with the external terminals tightened and temporarily fixed, and if the test passes, the solder 8 can be melted by heat treatment to ensure complete fixation. , it is possible to achieve the same purpose as the mounting board of the first embodiment.

[Embodiment 3] Fig. 4 is a cross-sectional view of a mounting board for semiconductor mounting comprising a chip carrier type package according to Embodiment 3 of the present invention, taken along a plane passing approximately through the center of one mounting electrode. This is what is shown. Note that the two-dot chain line indicates the mounting state of the semiconductor device.

The mounting board 1 of the second embodiment has a cavity 9 formed at a predetermined position on a board made of polyimide resin, for example, in which a predetermined wiring 2 is embedded.
A mounting electrode 10 is planted on the peripheral wall with one end in contact with the wiring 2 and the other end shaped like a fishhook and extending toward the bottom of the cavity 9.

Since the mounting electrode 10 is made of the same material as the socket 7 shown in Example 1, the semiconductor device 11 made of a chip carrier type package can be brought into reliable contact with the external terminal of the electrode 10Y. After inspection, simply heat treatment
It is possible to perform complete fixation.

Therefore, when an electronic device is manufactured using the mounting board 1 of the third embodiment, the same objective as that of the first embodiment can be achieved with respect to a semiconductor device formed of a chip carrier type package.

[Example 4] The mounting board of Example 4 according to the present invention is roughly the same as the mounting board of Example 3, but as in Example 2, the mounting electrodes are enlarged as shown in FIG. 2N as shown
It is formed in I.

That is, by depositing 12χ of solder on the surface of the electrode 10 made of an elastic material such as a copper alloy,
This embodiment can achieve the same purpose as the third embodiment.

〔effect〕

(1) By forming the mounting electrodes of the mounting board from an elastic material containing at least a portion of a low-melting point metal, it is possible to perform a performance test in a temporarily fixed state before electronic components are fused and mounted. Therefore, if a defect is found in the electronic component or the mounting board, it can be easily replaced.

(2) With the above (1), it is possible to improve work efficiency.

(31) According to (1) above, it is possible to improve the manufacturing yield even for electronic devices that include a large number of electronic components.

(41) By forming the mounting electrode from a metal having a low melting point and elasticity, such as a tin alloy, the electrode can be formed integrally with the electrode, thereby reducing manufacturing costs.

(5) Low -
L+A+-1+1-%y xt+-l-+++ -赫w
Since the electrodes can be formed using ordinary electrode materials, they can be manufactured easily.

(6) By forming the mounting electrode socket, it is possible to provide a mounting board suitable for mounting a so-called DIP type or PGA type semiconductor device.

(7) By forming the mounting electrode on the peripheral wall of the cavity formed in the substrate, it is possible to provide a mounting substrate suitable for mounting a semiconductor device consisting of a chip carrier type package.

Although the invention made by the present inventor has been specifically explained based on Examples above, the present invention is not limited to the above Examples, and it goes without saying that various changes can be made without departing from the gist thereof. For example, the shape of the mounting electrode is not limited to that shown in the examples, and any shape may be used as long as it is suitable for achieving the purpose of the present invention. Needless to say.

The electrode material may be any material as long as it can achieve the same objectives as those shown in the examples.

[Application field]

In the above explanation, the statement made by the inventor as king
DIP type, PGA, which is the field of application behind A.
Although the case where the application is applied to a semiconductor device consisting of a mold and a chip carrier type package has been described, the application is not limited thereto (for example, if the mounting electrode is a socket, it is a socket).Electronic components that are inserted and mounted Any type of method may be used as long as it is suitable, and it is an effective technique that can be applied to various types of electronic components that are mounted by face-down bonding.

[Brief explanation of the drawing]

1 is a sectional view showing a part of a mounting board for a semiconductor device made of a PGA type package according to the first embodiment of the present invention; FIG. 2 is an enlarged plan view showing the electrodes of the first embodiment; FIG. 4 is an enlarged sectional view showing a part of a mounting board according to the second embodiment of the present invention, and FIG. 4 shows a mounting board for a semiconductor device comprising a chip carrier type package according to the third embodiment of the present invention. Cross-sectional view FIG. 5 is an enlarged cross-sectional view showing a part of a mounting board according to a fourth embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Mounting board, 2... Wiring, 3... Printed circuit board, 4... Semiconductor device, 5... Pin, 6... Through hole, 7... Socket, 7a... Frame, 8...
Solder, 9... Cavity, 10... Electrode, 11...
- Semiconductor device, 12...Solder. Figure 1 / Figure 4 Figure 5

Claims (1)

[Scope of Claims] 1. A mounting board in which the electrode is formed using an elastic material having at least a portion of a heat-sealable metal. 2. The mounting board according to claim 1, wherein the electrode is a socket for mounting a semiconductor device. 3. The mounting board according to claim 1, wherein the electrode is an electrode for mounting a semiconductor device made of a chip carrier type pattern. 4. Claims 1 to 3, characterized in that the electrode is made of a metal with a low melting point and elasticity.
The mounting board described in any of the above. 5. The mounting board according to any one of claims 1 to 3, characterized in that the electrode is formed by adhering a low melting point metal to the surface of an elastic metal. . 6. The mounting board according to claim 4, wherein the metal is tin or an alloy containing tin as a main component. 7. The mounting board according to claim 5, wherein the low melting point metal is solder.