JPS60177647A - 自動精密位置合せシステム - Google Patents
自動精密位置合せシステムInfo
- Publication number
- JPS60177647A JPS60177647A JP59032576A JP3257684A JPS60177647A JP S60177647 A JPS60177647 A JP S60177647A JP 59032576 A JP59032576 A JP 59032576A JP 3257684 A JP3257684 A JP 3257684A JP S60177647 A JPS60177647 A JP S60177647A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- wafer
- key pattern
- semiconductor wafer
- automatic precision
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Dicing (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59032576A JPS60177647A (ja) | 1984-02-24 | 1984-02-24 | 自動精密位置合せシステム |
| GB08407592A GB2139348B (en) | 1983-03-26 | 1984-03-23 | Automatic aligment system |
| KR1019840001548A KR900002508B1 (ko) | 1983-03-26 | 1984-03-26 | 자동 정렬 시스템 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59032576A JPS60177647A (ja) | 1984-02-24 | 1984-02-24 | 自動精密位置合せシステム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60177647A true JPS60177647A (ja) | 1985-09-11 |
| JPH0580149B2 JPH0580149B2 (cg-RX-API-DMAC7.html) | 1993-11-08 |
Family
ID=12362708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59032576A Granted JPS60177647A (ja) | 1983-03-26 | 1984-02-24 | 自動精密位置合せシステム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60177647A (cg-RX-API-DMAC7.html) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57198629A (en) * | 1981-05-30 | 1982-12-06 | Toshiba Corp | Dicing equipment |
-
1984
- 1984-02-24 JP JP59032576A patent/JPS60177647A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57198629A (en) * | 1981-05-30 | 1982-12-06 | Toshiba Corp | Dicing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0580149B2 (cg-RX-API-DMAC7.html) | 1993-11-08 |
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