JPS60177033A - Production of laminated board - Google Patents

Abstract

PURPOSE:To improve the moisture resistance, electrical insulating property, punchability and productivity of a laminated board, by using a small amount of a phenolic resin precondensate containing a small amount of a diamine or triamine as a resin for treating a base material in producing the laminated board of the phenolic resin on paper base material. CONSTITUTION:A triamine, e.g. ethylenediamine, or triamine, e.g. diethylene triamine, in an amount of 0.1-1wt% based on the resin solid is added to a phenolic resin precondensate, and the resultant mixture is used as a resin for treating a base material (primer resin) to treat a paper base material, which is then impregnated with a facing phenolic resin to give prepreg. Sheets of the resultant prepreg in a given number are laminated and hot-pressed to afford the amined laminated board.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing a paper-based phenolic resin laminate with good productivity using a phenolic resin initial condensate having a large processing effect as a base material treatment resin (undercoat resin). .

As is well known, thunol resin is used after allowing the reaction of phenol and formalin to proceed to a predetermined degree of reaction in a reaction vessel, but the reaction time is generally long at 5 to 8 hours, and it is desirable to shorten the reaction time. It will be done. In addition, the resin for substrate treatment has good impregnating properties into substrates such as #1, which have a large amount of low molecular weight, and the treatment effect of the substrate is large. However, in this case, the degree of reactivity of the resin is low, and in order to sufficiently proceed with the reaction in the prepreg state in which the resin is impregnated into the base material and dried, it is necessary to increase the drying time, which requires a long drying time. There is a drawback that the productivity of the process is greatly reduced. The present invention solves the above-mentioned drawback. As a base material treatment resin, a diamine or triamine is added to the initial condensate of a phenol resin with a low reactivity. 0.1 to 1 for the shape
The weight ratio is added. The paper base material is treated with this, and the prepreg, which has been impregnated with phenol resin and dried, is laminated and molded.

By reducing the degree of reactivity of the Tuonol resin, the reaction time with the reaction pot can be shortened, and since the low molecular weight content is increased, the treatment effect of the base material is improved, and the moisture resistance of the resulting laminate is improved. Electrical insulation and punching workability can be improved. Furthermore, the addition of diamines or triamines accelerates the curing of phenolic resins,
Does not reduce productivity in coating and drying processes.

The diamine or triamine used in the present invention is not particularly limited, such as ethylenediamine, triethylenediamine, diethylenetriamine, etc., but it is desirable that the diamine or triamine has a boiling point near the drying temperature so that unreacted components are volatilized during drying of the prepreg. As a result of intensive experiments regarding the amount of addition, we found that if the amount is less than 0.1% by weight based on the resin solids of the base material treatment resin, there is not much effect of accelerating curing, and if it is more than 1% by weight, the curing speed is It becomes almost saturated and the effect of addition cannot be achieved. The drawing shows an example of the curing accelerating effect of ethylenediamine on a nonyl group-modified phenol resin.

In addition, the phenol resin initial condensate is obtained by adding a slight excess of formaldehyde to phenol and causing a heating reaction with an alkaline catalyst, and it has a large number of methylol groups (-OH, OH) in the molecule. It is.

Further, paper base materials include kraft paper, star/tar paper, etc., but are not particularly limited.

Next, the present invention will be described in detail. Example 1 Link paper was mixed with ethylenediamine (j),
It was treated with a substrate treatment resin containing 577 parts by weight, and the resin content after impregnation and drying was 20 parts. Subsequently, a phenolic resin for top coating was impregnated and dried to obtain a prepreg with a total resin content of 50%.

Top n[F prepreg stacked in specified number, 170C-12
1.6 by heating and pressure molding at 0kg/cr/l for 30 minutes
A laminated plate having a fl thickness was obtained.

Conventional Example 1 1.6. was carried out in the same manner as in Example 1 except that a resin to which ethylenediamine was not added was used as the base material treatment resin. A thick laminate was obtained.

Conventional Example 2 A laminate with a thickness of 1.6 was obtained in the same manner as in Example 1, except that a nonyl group-modified phenol resin without addition of ethylenediamine with a gelation time of 3 minutes was used as the base material treatment resin.

In addition, the nonyl group-modified phenol resin contains paraformaldehyde (paraform 86
%)1. After adding 0.3 moles of benzyldimethylamine and allowing the reaction to proceed at 80°C for 90 minutes, 7 moles of phenol,
4 moles of paraformaldehyde (halaform 86%) was added and the reaction was allowed to proceed at 80C until a predetermined gelation time was reached, and a solution with a solid content of 50% diluted with methanol was used. In addition, a resol type tung oil modified phenolic resin was used as the top coating phenolic resin. The gelation time was measured by taking 0.5 ml of resin with a solid content of 50% and placing it on a hot plate at 150C.

Regarding the laminates obtained in the examples of the present invention and the conventional examples, J l
Table 1 shows the results of the characteristic tests conducted according to No. 5-0-6481, together with the productivity in the reaction, coating, and drying steps.

Table 1 As is clear from Table 1, the N obtained by the present invention
The T-layer board has low moisture absorption deterioration of electrical resistance and low water absorption, so it has extremely excellent electrical insulation and immersion resistance, and has greatly improved productivity compared to conventional products.
Its industrial value is enormous.

[Brief explanation of drawings]

The drawing is a curve diagram showing the curing accelerating effect of ethylenediamine on nonyl group-modified phenolic resin. Patent applicant Shin-Kobe Electric Co., Ltd.

Claims (1)

[Claims] In the method for producing a paper-based two-nor resin laminate, a phenolic resin initial condensate with diamine or triamine added in a weight ratio of 0.1-1 to the solid resin is used as the base material treatment resin (undercoating resin). A method for producing a laminate, characterized in that it is used.