JPH09157414A - Production of phenol resin - Google Patents

Production of phenol resin

Info

Publication number
JPH09157414A
JPH09157414A JP32490695A JP32490695A JPH09157414A JP H09157414 A JPH09157414 A JP H09157414A JP 32490695 A JP32490695 A JP 32490695A JP 32490695 A JP32490695 A JP 32490695A JP H09157414 A JPH09157414 A JP H09157414A
Authority
JP
Japan
Prior art keywords
oil
phenol
resin
formaldehyde
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32490695A
Other languages
Japanese (ja)
Inventor
Hiroyuki Matsuoka
宏幸 松岡
Shigeyuki Yagi
茂幸 八木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP32490695A priority Critical patent/JPH09157414A/en
Publication of JPH09157414A publication Critical patent/JPH09157414A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Phenolic Resins Or Amino Resins (AREA)

Abstract

PROBLEM TO BE SOLVED: To produce a phenol resin, excellent in punchability and capable of providing a paper phenol laminated sheet excellent in water resistance and electrical insulating properties by reacting a (semi)drying oil with phenol in the presence of formaldehyde and an acidic catalyst. SOLUTION: (C) A (semi)drying oil (e.g. tung oil) is reacted with (B) phenols (e.g. phenol) in the presence of (A) formaldehyde and (B) an acidic catalyst (e.g. p-toluenesulfonic acid) and then converted into a resol in the presence of (E) an alkaline catalyst (e.g. triethylamine). For example, the amount of the component (C) used is 10-30% based on the component (D) and the molar ratio of the component (A) to the component (D) is within the range of 0.1-0.5.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、民生用電子機器の
プリント配線板用紙基材フェノール樹脂積層板(以下、
紙フェノール積層板という)に使用されるフェノール樹
脂の製造方法を提供するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board for a consumer electronic device, a paper substrate phenolic resin laminate (hereinafter
The present invention provides a method for producing a phenolic resin used for a paper phenolic laminate).

【0002】[0002]

【従来の技術】従来より、紙フェノール積層板の打抜き
加工性を改善する方法として、桐油、カシュー油、アマ
ニ油、ヒマシ油、リノレン油、リノール油、エポキシ化
植物油などの乾性油、半乾性油等とフェノール、クレゾ
ール等のフェノール類とを、酸性触媒下で反応させ、そ
の後アルカリ触媒でレゾール化した油変性フェノール樹
脂が使用されており、フェノール樹脂の硬化に関与しな
い外部可塑剤を使用する方法も行われていた。しかし、
油変性フェノール樹脂を使用した場合も、十分な打抜き
加工性を得るためには、(半)乾性油の使用率を高くす
る必要があり、積層板の耐熱性、耐水性、耐湿性、電気
絶縁性が低下する欠点があり、また、コスト面でも不利
である。また、外部可塑剤を配合する場合も同様に、積
層板の耐熱性、耐水性、耐湿性、電気絶縁性が低下して
しまう。
2. Description of the Related Art Conventionally, as a method for improving the punching workability of a paper phenol laminated sheet, a drying oil such as tung oil, cashew oil, linseed oil, castor oil, linolenic oil, linole oil, epoxidized vegetable oil, and a semi-drying oil. Etc. and phenols, phenols such as cresol, are reacted under an acidic catalyst, and then an oil-modified phenolic resin resolized with an alkaline catalyst is used, and a method of using an external plasticizer that is not involved in the curing of the phenolic resin Was also done. But,
Even if an oil-modified phenolic resin is used, it is necessary to increase the usage rate of (semi) drying oil in order to obtain sufficient punching workability, and the heat resistance, water resistance, moisture resistance, and electrical insulation of laminated boards However, it is disadvantageous in terms of cost. Similarly, when an external plasticizer is added, the heat resistance, water resistance, moisture resistance, and electric insulation of the laminated plate will also decrease.

【0003】[0003]

【発明が解決しようとする課題】本発明は、打抜き加工
性に優れ、かつ吸水性、電気絶縁性に優れた積層板を得
ることができるフェノール樹脂の製造方法を提供するも
のである。
DISCLOSURE OF THE INVENTION The present invention provides a method for producing a phenolic resin, which is capable of obtaining a laminate having excellent punching workability, water absorbency and electrical insulation.

【0004】[0004]

【課題を解決するための手段】本発明は、油変性フェノ
ール樹脂を合成する際にホルムアルデヒドの存在下に酸
触媒下で(半)乾性油とフェノールを反応させ、その
後、アルカリ触媒でレゾール化を行うことを特徴とする
フェノール樹脂の製造方法である。本発明の方法によ
り、フェノール類がホルムアルデヒドと縮合してメチレ
ン基により高分子化(ノボラック化)することにより、
打抜き加工性が向上するとともにレゾール化の際のメチ
ロール基が減少するため吸水性及び電気絶縁性に優れた
積層板が得られる。
According to the present invention, when synthesizing an oil-modified phenolic resin, a (semi) drying oil and a phenol are reacted in the presence of formaldehyde in the presence of formaldehyde under an acid catalyst. It is a method for producing a phenol resin, which is characterized in that it is carried out. According to the method of the present invention, phenols are condensed with formaldehyde to be polymerized with a methylene group (novolak),
Since the punching workability is improved and the methylol groups at the time of resolization are reduced, a laminate having excellent water absorption and electrical insulation can be obtained.

【0005】油変性フェノール樹脂に使用する油として
は、桐油、カシュー油、アマニ油、ヒマシ油、リノレン
油、リノール油、エポキシ化植物油などの乾性油、半乾
性油が上げられるが、特に桐油が反応性やコスト面より
望ましい。乾性油の使用量はフェノール類に対して5%
〜50%程度が望ましい。特に好ましくは10%〜30
%である。5%未満では可撓性が十分でなく、30%を
越えると反応性及び密着性が低下するようになる。
Oils used in oil-modified phenolic resins include tung oil, cashew oil, linseed oil, castor oil, linolenic oil, linole oil, epoxidized vegetable oil and other drying oils, and semi-drying oils. Desirable in terms of reactivity and cost. The amount of dry oil used is 5% with respect to phenols
About 50% is desirable. Particularly preferably 10% to 30
%. If it is less than 5%, the flexibility is not sufficient, and if it exceeds 30%, the reactivity and adhesion are deteriorated.

【0006】酸触媒としてはシュウ酸、パラトルエンス
ルホン酸、塩酸、硫酸等が挙げられる。フェノール類と
しては、フェノール、クレゾール、tert−ブチルフ
ェノール、オクチルフェノール、ノニルフェノール等を
単独もしくは併用して用いる。また、酸触媒で油とフェ
ノール類を反応させる際に添加するホルムアルデヒドと
してはホルマリン水溶液、パラホルムアルデヒド等であ
り、ホルムアルデヒドのフェノール類に対するモル比は
0.1〜0.5の範囲が望ましい。0.1未満であると
十分に効果が得られず、また0.5を越えると高分子量
になりすぎレゾール化が困難になる。
Examples of the acid catalyst include oxalic acid, p-toluenesulfonic acid, hydrochloric acid and sulfuric acid. As the phenols, phenol, cresol, tert-butylphenol, octylphenol, nonylphenol and the like are used alone or in combination. Formaldehyde added when reacting oil and phenols with an acid catalyst is formalin aqueous solution, paraformaldehyde, etc., and the molar ratio of formaldehyde to phenols is preferably in the range of 0.1 to 0.5. If it is less than 0.1, no sufficient effect can be obtained, and if it exceeds 0.5, the molecular weight becomes too high and resolization becomes difficult.

【0007】レゾール化の際に加えるホルムアルデヒド
は、酸触媒下で添加したホルムアルデヒドとあわせてフ
ェノール類に対しモル比で0.8〜2.0の範囲が望ま
しい。0.8未満であると未反応のフェノール成分が増
加し、また2.0を越えると未反応のホルムアルデヒド
が多く残り臭気が強く、コスト面でも不利になる。アル
カリ触媒としては、トリエチルアミン、トリエタノール
アミン等の第3アミンが特に好適であるが、アンモニア
水、ヘキサメチレンテトラミン等も使用することができ
る。
The formaldehyde added at the time of resolization is preferably in the range of 0.8 to 2.0 in molar ratio with respect to the phenols together with the formaldehyde added under the acid catalyst. When it is less than 0.8, unreacted phenol component increases, and when it exceeds 2.0, unreacted formaldehyde remains in a large amount and the odor is strong, which is also disadvantageous in terms of cost. As the alkaline catalyst, tertiary amines such as triethylamine and triethanolamine are particularly suitable, but aqueous ammonia, hexamethylenetetramine and the like can also be used.

【0008】以上のような方法で得られた油フェノール
樹脂は、常法により紙基材に含浸し、得られた樹脂含浸
紙を複数枚重ね合わせ、加熱加圧成形して、打抜き加工
性に優れた紙フェノール積層板を得ることができる。本
発明で得られた油変性フェノール樹脂は、紙基材に一次
含浸処理をした後二次含浸を行う2段含浸法、一次含浸
処理を行わない1段含浸法のどちらにも適用することが
できる。
The oil-phenolic resin obtained by the above method is impregnated into a paper base material by a conventional method, a plurality of the obtained resin-impregnated papers are superposed and heat-pressed to obtain punching workability. An excellent paper-phenolic laminate can be obtained. The oil-modified phenolic resin obtained in the present invention can be applied to both a two-stage impregnation method in which a paper base material is subjected to a primary impregnation treatment and then a secondary impregnation treatment, and a one-stage impregnation method without a primary impregnation treatment. it can.

【0009】[0009]

【実施例】以下、本発明を実施例に基づいて詳細に説明
するが、本発明はこれに限定されるものではない。
The present invention will be described below in detail with reference to examples, but the present invention is not limited to these examples.

【0010】〔低分子量フェノール樹脂(ワニスd)の
合成〕フェノール1000g、37%ホルムアルデヒド
水溶液980g、トリエチルアミン20gからなる混合
物を60℃で2時間反応させ、次に減圧下で濃縮し、こ
れをメタノールで希釈して樹脂分50%のフェノール樹
脂ワニスdを得た。
[Synthesis of Low-Molecular Weight Phenolic Resin (Varnish d)] A mixture of 1000 g of phenol, 980 g of 37% aqueous formaldehyde and 20 g of triethylamine was reacted at 60 ° C. for 2 hours and then concentrated under reduced pressure, which was then concentrated with methanol. Diluted to obtain a phenol resin varnish d having a resin content of 50%.

【0011】《実施例1》 油変性フェノール樹脂(ワ
ニスa)の合成及びこれを用いた積層板Aの作製 フェノール1600gと桐油800gと40%ホルマリ
ン水溶液390gをパラトルエンスルホン酸の存在下、
95℃で2時間反応させた。次いでパラホルムアルデヒ
ド500g、トリエチルアミン30g、トルエン200
0gを加えて90℃で2時間反応後、減圧下で濃縮し、
これをトルエンとメタノールの混合溶媒で希釈して樹脂
分50%の油変性フェノール樹脂ワニスaを得た。ワニ
スa100重量部、ワニスd40重量部、臭素化エポキ
シ樹脂(樹脂分50%)20重量部、メチロール化メラ
ミン樹脂(樹脂分50%)20重量部、トリフェニルホ
スフェート10重量部を配合したワニスを樹脂分55%
となるように紙基材に含浸させてプリプレグを得た。こ
のプリプレグ8枚とその表裏両面に接着剤つき銅箔を重
ね合わせ、加熱加圧成形して板厚1.6mmの積層板A
を得た。
Example 1 Synthesis of Oil-Modified Phenolic Resin (Varnish a) and Production of Laminate A Using the Same 1600 g of phenol, 800 g of tung oil and 390 g of 40% formalin aqueous solution in the presence of paratoluenesulfonic acid.
The reaction was carried out at 95 ° C for 2 hours. Next, paraformaldehyde 500g, triethylamine 30g, toluene 200
After adding 0 g and reacting at 90 ° C. for 2 hours, the mixture was concentrated under reduced pressure,
This was diluted with a mixed solvent of toluene and methanol to obtain an oil-modified phenol resin varnish a having a resin content of 50%. Varnish a 100 parts by weight, varnish d 40 parts by weight, brominated epoxy resin (resin content 50%) 20 parts by weight, methylolated melamine resin (resin content 50%) 20 parts by weight, triphenyl phosphate 10 parts by weight resin varnish 55%
A prepreg was obtained by impregnating a paper base material so that Eight pieces of this prepreg and copper foil with adhesive on both front and back sides are laminated and heat-pressed to form a laminate A having a thickness of 1.6 mm.
I got

【0012】《実施例2》 油変性フェノール樹脂(ワ
ニスb)の合成及びこれを用いた積層板Bの作成 クレゾール1600gと桐油800gとパラホルムアル
デヒド50gとトルエン溶媒1000g中でパラトルエ
ンスルホン酸の存在下、95℃で2時間反応させた。次
いでパラホルムアルデヒド600g、トリエチルアミン
20g、トルエン1000gを加えて90℃で2時間反
応後、減圧下で濃縮し、これをトルエンとメタノールの
混合溶媒で希釈して樹脂分50%の油変性クレゾール樹
脂ワニスbを得た。ワニスb100重量部、ワニスc4
0重量部、臭素化エポキシ樹脂(樹脂分50%)20重
量部、メチロール化メラミン樹脂(樹脂分50%)20
重量部、トリフェニルホスフェート10重量部を配合し
たワニスを樹脂分55%となるように紙基材に含浸させ
てプリプレグを得た。このプリプレグ8枚とその表裏両
面に接着剤つき銅箔を重ね合わせ、加熱加圧成形して板
厚1.6mmの積層板Bを得た。
Example 2 Synthesis of Oil-Modified Phenolic Resin (Varnish b) and Preparation of Laminated Board B Using the Same B. Cresol 1600 g, tung oil 800 g, paraformaldehyde 50 g, and toluene solvent 1000 g in the presence of paratoluenesulfonic acid. And reacted at 95 ° C for 2 hours. Next, 600 g of paraformaldehyde, 20 g of triethylamine, and 1000 g of toluene were added and reacted at 90 ° C. for 2 hours, then concentrated under reduced pressure and diluted with a mixed solvent of toluene and methanol to dilute the oil-modified cresol resin varnish b having a resin content of 50%. Got Varnish b100 parts by weight, varnish c4
0 parts by weight, brominated epoxy resin (resin content 50%) 20 parts by weight, methylolated melamine resin (resin content 50%) 20
The paper base material was impregnated with a varnish containing 10 parts by weight of triphenyl phosphate and 50 parts by weight of triphenyl phosphate to obtain a prepreg. Eight prepregs and copper foil with an adhesive were superimposed on both front and back surfaces thereof, and heated and pressed to obtain a laminate B having a thickness of 1.6 mm.

【0013】《比較例1》 油変性フェノール樹脂(ワ
ニスc)の合成及びこれを用いた積層板Cの作製 フェノール1600gと桐油800gをパラトルエンス
ルホン酸の存在下、95℃で2時間反応させた。次いで
パラホルムアルデヒド650g、トリエチルアミン30
g、トルエン2000gを加えて90℃で2時間反応
後、減圧下で濃縮し、これをトルエンとメタノールの混
合溶媒で希釈して樹脂分50%の油変性フェノール樹脂
ワニスbを得た。ワニスc100重量部、ワニスd40
重量部、臭素化エポキシ樹脂(樹脂分50%)20重量
部、メチロール化メラミン樹脂(樹脂分50%)20重
量部、トリフェニルホスフェート10重量部を配合した
ワニスを樹脂分55%となるように紙基材に含浸させて
プリプレグを得た。このプリプレグ8枚とその表裏両面
に接着剤つき銅箔を重ね合わせ、加熱加圧成形して板厚
1.6mmの積層板Cを得た。
Comparative Example 1 Synthesis of Oil-Modified Phenolic Resin (Varnish c) and Preparation of Laminate C Using the Same 1600 g of phenol and 800 g of tung oil were reacted at 95 ° C. for 2 hours in the presence of paratoluenesulfonic acid. . Then 650 g of paraformaldehyde, 30 of triethylamine
g and 2000 g of toluene were added, and the mixture was reacted at 90 ° C. for 2 hours, concentrated under reduced pressure, and diluted with a mixed solvent of toluene and methanol to obtain an oil-modified phenol resin varnish b having a resin content of 50%. 100 parts by weight of varnish c, d40 of varnish
Parts by weight, 20 parts by weight of brominated epoxy resin (resin content 50%), 20 parts by weight of methylolated melamine resin (resin content 50%), and 10 parts by weight of triphenyl phosphate so that the varnish has a resin content of 55%. A paper base material was impregnated to obtain a prepreg. Eight sheets of the prepreg and copper foil with an adhesive were superimposed on both front and rear surfaces thereof, and heated and pressed to obtain a laminate C having a thickness of 1.6 mm.

【0014】以上の方法により得られたそれぞれの積層
板について特性を測定し、表1に示す結果を得た。
The characteristics of each laminate obtained by the above method were measured and the results shown in Table 1 were obtained.

【表1】 [Table 1]

【0015】[0015]

【発明の効果】以上の結果から明らかなように、本発明
の方法により得られたフェノール樹脂を使用することに
より、打抜き加工性、耐水性、電気絶縁性に優れた紙フ
ェノール積層板を得ることができる。
As is clear from the above results, by using the phenol resin obtained by the method of the present invention, it is possible to obtain a paper phenol laminate excellent in punching workability, water resistance and electric insulation. You can

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 乾性油又は半乾性油変性フェノール樹脂
を合成する際に、ホルムアルデヒドの存在下に酸触媒に
より前記乾性油又は半乾性油とフェノール類を反応さ
せ、その後、アルカリ触媒によりレゾール化を行うこと
を特徴とするフェノール樹脂の製造方法。
1. When synthesizing a drying oil or a semi-drying oil modified phenolic resin, the drying oil or the semi-drying oil and the phenols are reacted with an acid catalyst in the presence of formaldehyde, and then the resolization is performed with an alkali catalyst. A method for producing a phenol resin, which is characterized by carrying out.
【請求項2】 請求項1で得られたフェノール樹脂を用
いることを特徴とする紙基材フェノール樹脂積層板の製
造方法。
2. A method for producing a paper-based phenolic resin laminate, which comprises using the phenolic resin obtained in claim 1.
JP32490695A 1995-12-13 1995-12-13 Production of phenol resin Pending JPH09157414A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32490695A JPH09157414A (en) 1995-12-13 1995-12-13 Production of phenol resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32490695A JPH09157414A (en) 1995-12-13 1995-12-13 Production of phenol resin

Publications (1)

Publication Number Publication Date
JPH09157414A true JPH09157414A (en) 1997-06-17

Family

ID=18170949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32490695A Pending JPH09157414A (en) 1995-12-13 1995-12-13 Production of phenol resin

Country Status (1)

Country Link
JP (1) JPH09157414A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011077053A (en) * 2003-04-09 2011-04-14 Bac2 Ltd Conductive polymer, conductive polymer composition and their use

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011077053A (en) * 2003-04-09 2011-04-14 Bac2 Ltd Conductive polymer, conductive polymer composition and their use

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