JPH07329090A - Manufacture of laminated sheet - Google Patents
Manufacture of laminated sheetInfo
- Publication number
- JPH07329090A JPH07329090A JP6129973A JP12997394A JPH07329090A JP H07329090 A JPH07329090 A JP H07329090A JP 6129973 A JP6129973 A JP 6129973A JP 12997394 A JP12997394 A JP 12997394A JP H07329090 A JPH07329090 A JP H07329090A
- Authority
- JP
- Japan
- Prior art keywords
- group
- resin
- dihydro
- sheets
- phenyl group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、電気用絶縁板、特にプ
リント配線板用絶縁基板として用いられる積層板の製造
方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electric insulating plate, particularly a laminated plate used as an insulating substrate for a printed wiring board.
【0002】[0002]
【従来の技術】電気用絶縁板、特にプリント配線板用絶
縁基板として用いられる積層板(以下単に積層板とい
う)は、シート状繊維基材に、絶縁材料樹脂を塗布含浸
し、加熱してプリプレグを得、このプリプレグを所定数
重ね、加熱加圧することによって製造されている。絶縁
材料樹脂としては、フェノール樹脂、エポキシ樹脂、不
飽和ポリエステル樹脂などの熱硬化性樹脂が主に使用さ
れている。シート状繊維基材に、絶縁材料樹脂を塗布含
浸する工程では、多量の溶剤を使用している。2. Description of the Related Art A laminated board (hereinafter simply referred to as a laminated board) used as an electrical insulating board, particularly as an insulating substrate for a printed wiring board, has a sheet-like fiber base material coated and impregnated with an insulating material resin and heated to produce a prepreg. Is obtained by stacking a predetermined number of these prepregs and heating and pressing. As the insulating material resin, thermosetting resins such as phenol resin, epoxy resin and unsaturated polyester resin are mainly used. A large amount of solvent is used in the step of coating and impregnating the sheet-shaped fiber base material with the insulating material resin.
【0003】[0003]
【発明が解決しようとする課題】ところが、シート状繊
維基材に、絶縁材料樹脂を塗布含浸する工程で多量の溶
剤を使用しているため、火災、爆発などの災害発生防止
及び揮散する溶剤蒸気による環境汚染防止に配慮した設
備の設置と維持管理に多額の費用を要し生産コストを圧
迫している。However, since a large amount of solvent is used in the step of coating and impregnating the insulating fiber resin on the sheet-shaped fiber base material, it prevents the occurrence of disasters such as fire and explosion and vaporizes the solvent vapor. A large amount of cost is required for the installation and maintenance of equipment in consideration of the prevention of environmental pollution due to the production cost.
【0004】ジヒドロ−1.3−ベンゾオキサジン類
は、加熱することにより、揮発性の副生成成分を生ずる
ことなく重合、硬化することが知られているが(特開昭
49−47378号公報参照)、積層板の製造について
は、メチルエチルケトンなどの溶剤を使用する方法が採
られている。このため、材料の特殊性もあって、ジヒド
ロ−1.3−ベンゾオキサジン類の硬化物をマトリック
スとする積層板は実用化に至っていない。本発明は、ジ
ヒドロ−1.3−ベンゾオキサジン類が硬化するとき、
揮発性の副生成成分を生ずることなく重合、硬化すると
いう特長をいかして、溶剤を用いないで積層板を製造す
る方法を提供することを目的とするものである。It is known that dihydro-1.3-benzoxazines are polymerized and cured by heating without producing a volatile by-product component (see JP-A-49-47378). ), A method of using a solvent such as methyl ethyl ketone is used for manufacturing the laminated plate. For this reason, due to the peculiarities of the materials, a laminated plate using a cured product of dihydro-1.3-benzoxazines as a matrix has not been put to practical use. The present invention provides that when dihydro-1.3-benzoxazines cure
It is an object of the present invention to provide a method for producing a laminated plate without using a solvent, taking advantage of the fact that the volatile by-product components are polymerized and cured.
【0005】[0005]
【課題を解決するための手段】本発明は、分子中に化2
に示す基を2以上有するジヒドロ−1.3−ベンゾオキ
サジン類(以下ジヒドロベンゾオキサジン樹脂という)
を抄きこんだシートを、所定枚数重ねて加熱加圧するこ
とを特徴とする積層板の製造方法である。The present invention provides a compound having
Dihydro-1.3-benzoxazines having two or more groups shown in (hereinafter referred to as dihydrobenzoxazine resin)
Is a method for producing a laminated plate, characterized in that a predetermined number of sheets obtained by making the above are stacked and heated and pressed.
【0006】[0006]
【化2】 化2式中R1 は、フェニル基、置換フェニル基、メチル
基又はシクロヘキシル基であり、R2 は、水素、メチル
基、エチル基又はフェニル基である。[Chemical 2] In the chemical formula 2, R 1 is a phenyl group, a substituted phenyl group, a methyl group or a cyclohexyl group, and R 2 is hydrogen, a methyl group, an ethyl group or a phenyl group.
【0007】ジヒドロベンゾオキサジン樹脂は、ヒドロ
キシル基のオルト位の少なくとも一つが水素であるヒド
ロキシフェニレン基を、1分子中に2以上有する化合物
と、1級アミンとホルムアルデヒドとを、前記ヒドロキ
シフェニレン基のオルト位の少なくとも一つが水素であ
るヒドロキシル基1モルに対し、1級アミンを0.2〜
0.9モル、及び、ホルムアルデヒドを1級アミンの2
倍モル量以上の比で反応させることによって製造され
る。The dihydrobenzoxazine resin comprises a compound having two or more hydroxyphenylene groups in which at least one of the ortho positions of the hydroxyl group is hydrogen in one molecule, a primary amine and formaldehyde, and an ortho group of the hydroxyphenylene group. To 1 mol of a hydroxyl group in which at least one of the positions is hydrogen, a primary amine of 0.2 to
0.9 mol and formaldehyde of primary amine 2
It is produced by reacting in a molar ratio of at least twice.
【0008】具体的には、ヒドロキシル基のオルト位の
少なくとも一つが水素であるヒドロキシフェニレン基
を、1分子中に2以上有する化合物(以下、反応しうる
ヒドロキシフェニレン基を有する化合物という)と、1
級アミンとの混合物を、70℃以上に加熱したアルデヒ
ド中に添加して、70〜110℃、好ましくは、90〜
100℃で、20分〜2時間反応させ、その後120℃
以下の温度で減圧乾燥することによってジヒドロベンゾ
オキサジン樹脂が得られる。Specifically, a compound having two or more hydroxyphenylene groups in which at least one ortho-position of a hydroxyl group is hydrogen in one molecule (hereinafter referred to as a compound having a reactive hydroxyphenylene group) and 1
The mixture with a primary amine is added to an aldehyde heated to 70 ° C. or higher to 70 to 110 ° C., preferably 90 to 110 ° C.
React at 100 ° C for 20 minutes to 2 hours, then 120 ° C
The dihydrobenzoxazine resin is obtained by drying under reduced pressure at the following temperature.
【0009】反応しうるヒドロキシフェニレン基を有す
る化合物のヒドロキシル基1モルに対し、1級アミンを
0.2〜0.9モル、及び、ホルムアルデヒドを1級ア
ミンの2倍モル量以上の比で反応させることが肝要であ
る。1級アミンが0.2モルより少ないと、ジヒドロオ
キサジン環の数が少なくなるので、得られた化合物を硬
化させたとき、架橋密度が小さく、強度が小さい硬化物
しか得られない。また、0.9モルより多いと、分子鎖
の伸長度が小さくて架橋密度が小さくなるため200℃
を超えると軟化したり、熱劣化するので好ましくない。The primary amine is reacted in an amount of 0.2 to 0.9 mol, and formaldehyde is reacted in a ratio of at least twice the molar amount of the primary amine with respect to 1 mol of the hydroxyl group of the compound having a reactive hydroxyphenylene group. It is essential to let them do it. If the amount of the primary amine is less than 0.2 mol, the number of dihydrooxazine rings will be small, so that when the obtained compound is cured, only a cured product having a low crosslink density and a low strength can be obtained. If it is more than 0.9 mol, the degree of extension of the molecular chain will be small and the crosslink density will be small, so the temperature will be 200 ° C.
If it exceeds, softening or heat deterioration is not preferable.
【0010】反応しうるヒドロキシフェニレン基を有す
る化合物に対する1級アミンの配合量は、次のようにし
て求めることができる。すなわち、ヒドロキシフェニレ
ン基を有する化合物の全ヒドロキシル基と同モル量の1
級アミンを反応させて、実際に得られた生成物の重量か
ら反応したヒドロキシル基量、すなわち、ヒドロキシフ
ェニレン基を有する化合物中の反応しうるヒドロキシル
基量を見積もり、これに対する前記のモル比として算出
する。The blending amount of the primary amine with respect to the compound having a reactive hydroxyphenylene group can be determined as follows. That is, 1 mol of the same molar amount as all hydroxyl groups of the compound having a hydroxyphenylene group
The amount of the reacted hydroxyl group, that is, the amount of the reactive hydroxyl group in the compound having the hydroxyphenylene group is estimated from the weight of the product actually obtained by reacting the primary amine, and calculated as the above molar ratio. To do.
【0011】1分子中に2以上の反応しうるヒドロキシ
フェニレン基を有する化合物としては、部分的にフェノ
ール核を有する種々の化合物が用いることができる。具
体的にはフェノールノボラック樹脂、レゾール樹脂、フ
ェノール変成キシレン樹脂、アルキルフェノール樹脂、
メラミンフェノール樹脂、フェノール変性ポリブタジエ
ン等が挙げられる。これらは、特に限定するものではな
いが架橋点となるヒドロキシル基のオルト位が無置換で
あるものが硬化物特性の点で望ましく、そのため例えば
フェノールノボラック樹脂の場合はオルト率が小さく比
較的分子量の小さいいわゆるランダムノボラックを用い
ることが好ましい。上記の樹脂は、1分子中の反応しう
るヒドロキシフェニレン基の数が異なった化合物の集合
であり、製造中に生成した熱硬化性化合物の一部が互い
に重合している。As the compound having two or more reactive hydroxyphenylene groups in one molecule, various compounds partially having a phenol nucleus can be used. Specifically, phenol novolac resin, resol resin, phenol-modified xylene resin, alkylphenol resin,
Examples include melamine phenol resin and phenol-modified polybutadiene. These are not particularly limited, but those in which the ortho position of the hydroxyl group serving as a cross-linking point is unsubstituted are desirable in terms of the properties of the cured product. Therefore, for example, in the case of phenol novolac resin, the ortho ratio is small and the molecular weight is relatively small. It is preferred to use small so-called random novolacs. The above resin is a set of compounds having different numbers of hydroxyphenylene groups capable of reacting in one molecule, and some of the thermosetting compounds produced during the production are polymerized with each other.
【0012】1級アミンとしては、具体的にはメチルア
ミン、シクロヘキシルアミン、アニリン、置換アニリン
等が挙げられる。脂肪族アミンであると、得られた熱硬
化性化合物の硬化が速いが硬化物の耐熱性がやや劣り、
アニリンのような芳香族アミンであると、得られた熱硬
化性化合物を硬化させた硬化物の耐熱性はよいが硬化が
遅くなる。Specific examples of the primary amine include methylamine, cyclohexylamine, aniline and substituted aniline. If it is an aliphatic amine, the obtained thermosetting compound cures quickly, but the heat resistance of the cured product is slightly inferior,
When the aromatic amine such as aniline is used, the cured product obtained by curing the obtained thermosetting compound has good heat resistance but slows curing.
【0013】このようにして得られたジヒドロベンゾオ
キサジン樹脂を、予め80〜180℃、好ましくは12
0〜160℃で熱処理する事により、その一部を予備重
合させ、成形時の硬化速度や溶融粘度を調整する。The dihydrobenzoxazine resin thus obtained is preheated to 80 to 180 ° C., preferably 12
By heat-treating at 0 to 160 ° C., a part of it is prepolymerized to adjust the curing speed and melt viscosity during molding.
【0014】ジヒドロベンゾオキサジン樹脂を合成した
後粉砕し、繊維と共に水に分散し、これを抄網で抄き上
げ、乾燥してシート状にする。繊維としては、セルロー
ス系繊維が好適であるが、ガラスなど無機短繊維も用い
られる。繊維とジヒドロベンゾオキサジン樹脂の粉末と
を混合し乾式でシート状に形成してもよい。After synthesizing the dihydrobenzoxazine resin, it is crushed, dispersed in water together with the fiber, made up with a net, and dried to form a sheet. Cellulose fibers are suitable as the fibers, but inorganic short fibers such as glass are also used. The fibers may be mixed with a powder of dihydrobenzoxazine resin to form a dry sheet.
【0015】ジヒドロベンゾオキサジン樹脂粉末の粒度
は、300μm以下、好ましくは50μm以下とする。
またシート中のジヒドロベンゾオキサジン樹脂粉末の量
は、30〜75重量%とする。30重量%より少ない
と、成形できず、75重量%より多いと、積層板として
必要な強度が得られない。The particle size of the dihydrobenzoxazine resin powder is 300 μm or less, preferably 50 μm or less.
The amount of dihydrobenzoxazine resin powder in the sheet is 30 to 75% by weight. If it is less than 30% by weight, molding cannot be carried out, and if it is more than 75% by weight, the strength required as a laminate cannot be obtained.
【0016】分子中に化1に示す基を2以上有するジヒ
ドロ−1.3−ベンゾオキサジン類を抄きこんだシート
を所定枚数重ねた構成体を離形フィルムで覆い、加熱加
圧して積層板を得る。離形フィルムに代えて、金属はく
例えば銅はくを重ねれば、金属はく張積層板を得ること
ができる。金属はくとしては、通常銅はくを使用する
が、必要特性によってはニッケルはく、アルミはく等の
金属はくを用いることもできる。A laminate obtained by covering a predetermined number of sheets containing dihydro-1.3-benzoxazines having two or more groups represented by Chemical Formula 1 in the molecule with a release film, heating and pressurizing the laminate, To get If a metal foil, for example, a copper foil is stacked instead of the release film, a metal foil-clad laminate can be obtained. Copper foil is usually used as the metal foil, but metal foil such as nickel foil and aluminum foil may be used depending on the required characteristics.
【0017】[0017]
実施例1 フェノール1.9kg、ホルマリン(37%水溶性)
1.0kg、しゅう酸4gを5リットルの反応釜に仕込
み、還流温度で6時間反応させた。引き続き内部を減圧
して未反応のフェノール及び水を除去した。得られた樹
脂は軟化点84℃(環球法)3〜多核体比82/18
(ゲルバ−ミエ−シヨンクロマトグラフィ−によるピー
ク面積比)であった。Example 1 1.9 kg phenol, formalin (37% water soluble)
1.0 kg and 4 g of oxalic acid were placed in a 5 liter reaction kettle and reacted at reflux temperature for 6 hours. Subsequently, the inside pressure was reduced to remove unreacted phenol and water. The obtained resin has a softening point of 84 ° C. (ring and ball method) 3 to a polynuclear body ratio of 82/18.
(Peak area ratio by gel-vermi- chromatography).
【0018】上記により合成したフェノールノボラック
樹脂1.70kg(水酸基16mol相当)とアニリン
0.93kg(10mol相当)とを混合し、80℃で
5時間撹拌し均一な混合溶液を調整した。5リットルの
反応釜中にホルマリン1.62kgを仕込み90℃に加
熱し、その中に、前記フェノールノボラック樹脂とアニ
リンとの混合溶液を加え、30分間還流温度に保ち、次
に、100℃で2時間減圧して縮合水を除去した。反応
し得る水酸基の71%がジヒドロ−1.3−ベンゾオキ
サジン化された樹脂組成物を得た。1.70 kg (corresponding to 16 mol of hydroxyl group) of phenol novolac resin synthesized above and 0.93 kg (corresponding to 10 mol) of aniline were mixed and stirred at 80 ° C. for 5 hours to prepare a uniform mixed solution. 1.62 kg of formalin was charged into a 5 liter reaction kettle and heated to 90 ° C., and the mixed solution of the phenol novolac resin and aniline was added thereto, and the mixture was kept at reflux temperature for 30 minutes, then at 2 ° C. at 100 ° C. The condensed water was removed by depressurizing for a time. A resin composition was obtained in which 71% of the reactive hydroxyl groups were dihydro-1.3-benzoxazinized.
【0019】反応し得る水酸基量の算出法は、以下の通
りである。前記フェノールノボラック樹脂1.70kg
(水酸基16mol相当)をアニリン1.49kg(1
6mol相当)及びホルマリン2.59kgと同様に反
応させ、反応可能な水酸基のすべてをジヒドロ−1.3
−ベンゾオキサジン化する。未反応のアニリン及びホル
マリン並びに反応系の水を除去した残り、即ち、ジヒド
ロベンゾオキサジン樹脂の収量は、3.34kgであ
る。これは、フェノールノボラック樹脂の水酸基のうち
14molが反応し、ジヒドロ−1.3−ベンゾオキサ
ジン化したものに相当する。これから、本実施例におい
て得られた樹脂組成物は、反応し得る水酸基14mol
のうち10mol(71%)がジヒドロ−1.3−ベン
ゾオキサジン化したものであることがわかる。The method for calculating the amount of hydroxyl groups that can react is as follows. 1.70 kg of the phenol novolac resin
(Corresponding to 16 mol of hydroxyl group) 1.49 kg (1
6 mol) and 2.59 kg of formalin are reacted in the same manner to remove all the reactive hydroxyl groups from dihydro-1.3.
-Becomes benzoxazine. The unreacted aniline and formalin and the water remaining in the reaction system, ie, the yield of the dihydrobenzoxazine resin, was 3.34 kg. This corresponds to dihydro-1.3-benzoxazinized by reacting 14 mol of the hydroxyl groups of the phenol novolac resin. From this, the resin composition obtained in this example has a reactive hydroxyl group of 14 mol.
It can be seen that, of these, 10 mol (71%) was dihydro-1.3-benzoxazinated.
【0020】実施例2 1,2−ブタジエン(日本曹達株式会社製、B−100
0)0.92kg、フェノール3.30kg、p−トル
エンスルホン酸1gを5リットルの反応釜に仕込み、8
0℃で5時間反応させた。冷却、水洗後、水蒸気蒸留に
より未反応のフェノールを除去しポリブタジエン変性フ
ェノール樹脂1.41kgを得た。付加したフェノール
の重量より、水酸基当量は270となる。Example 2 1,2-Butadiene (Nippon Soda Co., Ltd., B-100
0) 0.92 kg, phenol 3.30 kg, and p-toluenesulfonic acid 1 g were charged in a 5 liter reaction kettle, and 8
The reaction was carried out at 0 ° C for 5 hours. After cooling and washing with water, unreacted phenol was removed by steam distillation to obtain 1.41 kg of polybutadiene-modified phenol resin. From the weight of the added phenol, the hydroxyl group equivalent is 270.
【0021】得られたポリブタジエン変性フェノール樹
脂2.70kg(水酸基10mol相当)、アニリン
0.56kg(6mol相当)及びホルマリン0.97
kgを用い、実施例1と同様の操作で反応し得る水酸基
の73%がジヒドロ−1.3−ベンゾオキサジン化され
た樹脂組成物を得た。2.70 kg (corresponding to 10 mol of hydroxyl groups) of the obtained polybutadiene-modified phenol resin, 0.56 kg (corresponding to 6 mol) of aniline and 0.97 of formalin.
Using kg, a resin composition in which 73% of the hydroxyl groups capable of reacting were dihydro-1.3-benzoxazinized was obtained in the same manner as in Example 1.
【0022】実施例3 桐油0.50kg、m−クレゾール4.00kg、p−
トルエンスルホン酸4gを5リットルの反応釜に仕込
み、80℃で5時間反応させた。冷却、水洗後、水蒸気
蒸留により未反応のm−クレゾールを除去し桐油/m−
クレゾール反応物0.82kgを得た。付加したm−ク
レゾールの重量より水酸基当量は280となる。Example 3 Tung oil 0.50 kg, m-cresol 4.00 kg, p-
4 g of toluenesulfonic acid was charged into a 5 liter reaction kettle and reacted at 80 ° C. for 5 hours. After cooling and washing with water, unreacted m-cresol was removed by steam distillation to obtain tung oil / m-
0.82 kg of a cresol reaction product was obtained. The hydroxyl equivalent is 280 from the weight of the added m-cresol.
【0023】得られた桐油/m−クレゾール反応物2.
80kg(水酸基10mol相当)をアニリン0.56
kg(6mol相当)、ホルマリン0.97kgを用い
実施例1と同様の操作で反応し得る水酸基の66%がジ
ヒドロ−1.3−ベンゾオキサジン化された樹脂を得
た。Tung oil / m-cresol reaction product obtained 2.
80 kg (corresponding to 10 mol of hydroxyl groups) of 0.56 aniline
A resin in which 66% of the hydroxyl groups capable of reacting with dihydro-1.3-benzoxazine was obtained by the same operation as in Example 1 was obtained using kg (corresponding to 6 mol) and 0.97 kg of formalin.
【0024】実施例4 キシレン樹脂(三菱瓦斯化学株式会社製商品名ニカノー
ルH、平均分子量557、反応性基当量96を使用)
0.96kg、フェノール4.00kg、p−トルエン
スルホン酸4gを5リットルの反応釜に仕込み、80℃
で5時間反応させた。冷却、水洗後、水蒸気蒸留により
未反応のフェノールを除去し、フェノール変性キシレン
樹脂1.12kgを得た。未反応フェノール残存量から
オキシメチレン基と置換したフェノールは0.31kg
であった。ここから合成したキシレン樹脂の水酸基当量
は340となる。Example 4 Xylene resin (using Mitsubishi Gas Chemical Co., Ltd. trade name Nikanol H, average molecular weight 557, reactive group equivalent 96)
Charge 0.96 kg, phenol 4.00 kg, and p-toluenesulfonic acid 4 g into a 5 liter reaction kettle and keep at 80 ° C.
And reacted for 5 hours. After cooling and washing with water, unreacted phenol was removed by steam distillation to obtain 1.12 kg of a phenol-modified xylene resin. 0.31 kg of phenol substituted with oxymethylene group from unreacted phenol remaining amount
Met. The hydroxyl equivalent of the xylene resin synthesized from this is 340.
【0025】得られたキシレン変性フェノール樹脂3.
40kg(水酸基10mol相当)、アニリン0.28
kg(3mol相当)、ホルマリン0.49kgを用い
実施例1と同様の操作で反応し得る水酸基の79%がジ
ヒドロ−1.3−ベンゾオキサジン化された樹脂成物を
得た。The xylene-modified phenolic resin obtained 3.
40 kg (corresponding to 10 mol of hydroxyl groups), aniline 0.28
By using the same amount of kg (corresponding to 3 mol) and 0.49 kg of formalin, the same procedure as in Example 1 was carried out to obtain a resin composition in which 79% of hydroxyl groups were dihydro-1.3-benzoxazinized.
【0026】積層板1〜4の製造 得られた4種類のジヒドロベンゾオキサジン樹脂を、1
00μm以下に粉砕し、パルプに対して30重量%の割
合で水に分散し、抄紙した。なお、積層板1は実施例1
の樹脂、積層板2は実施例2の樹脂、積層板3は実施例
3の樹脂、積層板4は実施例4の樹脂を用いたものであ
る。得られたシート7枚と、厚さ18μmの銅はく1枚
を重ね、鏡板間にセットして、多段プレスで、温度17
0℃、圧力11MPaで60分間加熱加圧した。Production of Laminated Plates 1 to 4 The obtained four kinds of dihydrobenzoxazine resins were added to 1
It was crushed to a size of not more than 00 μm, dispersed in water at a ratio of 30% by weight with respect to pulp, and paper was made. In addition, the laminated board 1 is the same as that of the first embodiment.
Resin, the laminated plate 2 uses the resin of Example 2, the laminated plate 3 uses the resin of Example 3, and the laminated plate 4 uses the resin of Example 4. 7 sheets thus obtained and 1 sheet of copper foil having a thickness of 18 μm were superposed, set between end plates, and heated at a temperature of 17 with a multi-stage press.
It was heated and pressurized at 0 ° C. and a pressure of 11 MPa for 60 minutes.
【0027】積層板5の製造 実施例1で得られたジヒドロベンゾオキサジン樹脂を、
100μm以下に粉砕し、あらかじめ、水溶性メラミン
変性フェノール樹脂で処理したパルプに対して30重量
%の割合で水に分散し、抄紙した。得られたシート7枚
と、厚さ18μmの銅はく1枚を重ね、鏡板間にセット
して、多段プレスで、温度170℃、圧力11MPaで
60分間加熱加圧した。Production of Laminate 5 The dihydrobenzoxazine resin obtained in Example 1 was
It was pulverized to 100 μm or less, and was dispersed in water at a ratio of 30% by weight with respect to the pulp which was previously treated with the water-soluble melamine-modified phenol resin, and paper was made. Seven sheets thus obtained and one sheet of copper foil having a thickness of 18 μm were overlapped with each other, set between end plates, and heated and pressed at a temperature of 170 ° C. and a pressure of 11 MPa for 60 minutes by a multistage press.
【0028】比較例 桐油とフェノールとを酸性触媒下で反応させ、次に85
%パラホルムアルデヒド加えてアルカリ触媒下反応させ
て、レゾール化して、桐油変性率39%の桐油変性フェ
ノール樹脂を得た。この桐油変性フェノール樹脂100
重量部に、テトラブロモビスフェノールAジグリシジル
エーテル25重量部を配合してメチルエチルケトンに溶
解して含浸用ワニスとした。厚さ0.2mmのクラフト
紙に、水溶性メラミン変性フェノール樹脂を、樹脂分が
15重量%となるように塗布乾燥し、次に、前記含浸用
ワニスを樹脂付着量が53重量%になるように含浸乾燥
してプリプレグとした。得られたプリプレグ7枚を接着
剤付銅はく1枚を組み合わせて重ね、温度170℃圧力
8MPaで90分間に加熱加圧して積層板を得た。Comparative Example Tung oil and phenol were reacted under acidic catalyst, and then 85
% Paraformaldehyde was added and the reaction was carried out in the presence of an alkali catalyst to form a resol, to obtain a tung oil-modified phenol resin having a tung oil modification rate of 39%. This tung oil modified phenolic resin 100
25 parts by weight of tetrabromobisphenol A diglycidyl ether was added to parts by weight and dissolved in methyl ethyl ketone to prepare a varnish for impregnation. A water-soluble melamine-modified phenolic resin is applied to a kraft paper having a thickness of 0.2 mm so as to have a resin content of 15% by weight and dried, and then the impregnating varnish is applied so that the resin adhesion amount becomes 53% by weight. Was impregnated and dried to obtain a prepreg. Seven pieces of the obtained prepreg were combined and combined with one piece of copper foil with an adhesive, and heated and pressed at a temperature of 170 ° C. and a pressure of 8 MPa for 90 minutes to obtain a laminated plate.
【0029】得られた積層板について、気中耐熱性、加
熱減量、吸水率及び絶縁抵抗を調べた。結果を表1に示
す。気中耐熱性は、200℃の乾燥機中に保持してふく
れを生ずるまでの時間である。加熱減量は、200℃の
乾燥機中に10分間保持したときの保持前後の重量変化
である。吸水率は、50℃で24時間処理した後、23
℃の水の中に24時間保持したときの保持前後の重量変
化の百分率である。絶縁抵抗率は、銅はくをエッチング
で除去し、煮沸水中で2時間保持した後、中心間隔15
mmで設けた直径5mmの二つの穴に、絶縁抵抗計のテ
ーパーピンを挿入し、直流500Vを1分間印加したと
きの絶縁抵抗計の読みである。The laminated plate thus obtained was examined for heat resistance in air, loss on heating, water absorption and insulation resistance. The results are shown in Table 1. The heat resistance in the air is the time until it is kept in a dryer at 200 ° C. and causes blistering. The weight loss on heating is the change in weight before and after holding in a dryer at 200 ° C. for 10 minutes. Water absorption is 23 after treatment at 50 ° C for 24 hours.
It is the percentage of the weight change before and after holding in water at 0 ° C. for 24 hours. The insulation resistance was measured by removing the copper foil by etching and holding it in boiling water for 2 hours.
It is a reading of the insulation resistance meter when a taper pin of the insulation resistance meter is inserted into two holes with a diameter of 5 mm provided in mm and a direct current of 500 V is applied for 1 minute.
【0030】[0030]
【表1】 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 試験項目 積層板1 積層板2 積層板3 積層板4 ─────────────────────────────── 気中耐熱性(分) 60 45 40 40 加熱減量(%) 0.16 0.20 0.21 0.22 吸水率(%) 0.65 0.60 0.61 0.61 絶縁抵抗(Ω)×108 5 4 5 5 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 積層板5 比較例 ───────────────────── 気中耐熱性(分) 42 30 加熱減量(%) 0.20 0.35 吸水率(%) 0.35 0.75 絶縁抵抗(Ω)×108 5 2 ━━━━━━━━━━━━━━━━━━━━━[Table 1] ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Test item Laminated board 1 Laminated board 2 Laminated board 3 Laminated board 4 ─ ────────────────────────────── Air heat resistance (min) 60 45 40 40 Heat loss (%) 0.16 0 .20 0.21 0.22 Water absorption rate (%) 0.65 0.60 0.61 0.61 Insulation resistance (Ω) × 10 8 5 4 5 5 5 ━━━━━━━━━━━━━━ ━━━━━━━━━━━━━━━━━━ Laminate 5 Comparative example ───────────────────── Air heat resistance (minutes ) 42 30 Heat loss (%) 0.20 0.35 Water absorption (%) 0.35 0.75 Insulation resistance (Ω) × 10 8 5 2 ━━━━━━━━━━━━━━━━ ━━━━━━
【0031】[0031]
【発明の効果】本発明方法によれば、ベンゾオキサジン
樹脂が硬化するときに低分子量の反応副生物を生成しな
いという特徴を活かし、溶剤を使用しないで成形できる
ため、安全面及び環境衛生上優れている。EFFECTS OF THE INVENTION According to the method of the present invention, since the benzoxazine resin can be molded without using a solvent by utilizing the characteristic that a low molecular weight reaction by-product is not generated when it is cured, it is excellent in safety and environmental hygiene. ing.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 B29K 105:22 (72)発明者 平井 康之 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館工場内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Reference number within the agency FI Technical indication location B29K 105: 22 (72) Inventor Yasuyuki Hirai 1500 Ogawa, Shimodate-shi, Ibaraki Hitachi Chemical Co., Ltd. Shimodate in the factory
Claims (3)
ヒドロ−1.3−ベンゾオキサジン類を抄きこんだシー
トを、所定枚数重ねて加熱加圧することを特徴とする積
層板の製造方法。 【化1】 式中R1 は、フェニル基、置換フェニル基、メチル基又
はシクロヘキシル基であり、R3 は、水素、メチル基、
エチル基又はフェニル基である。1. A process for producing a laminated sheet, comprising stacking a predetermined number of sheets containing dihydro-1.3-benzoxazines having two or more groups represented by Chemical formula 1 in the molecule and heating and pressing the sheets. Method. [Chemical 1] In the formula, R 1 is a phenyl group, a substituted phenyl group, a methyl group or a cyclohexyl group, and R 3 is hydrogen, a methyl group,
It is an ethyl group or a phenyl group.
が、フェノール樹脂にホルマリン及び一級アミンを反応
させて得られたジヒドロ−1.3−ベンゾオキサジンで
あることを特徴とする積層板の製造方法。2. A method for producing a laminate, wherein the dihydro-1.3-benzoxazine is dihydro-1.3-benzoxazine obtained by reacting a phenol resin with formalin and a primary amine.
属はくを重ねて加熱加圧することを特徴とする請求項1
又は2記載の積層板の製造方法。3. A predetermined number of sheets are superposed, a metal foil is superposed on the outer side of the superposed sheets, and the sheets are heated and pressed.
Or the manufacturing method of the laminated board as described in 2.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12997394A JP3228003B2 (en) | 1994-06-13 | 1994-06-13 | Manufacturing method of laminated board |
TW084104843A TW308566B (en) | 1994-06-13 | 1995-05-16 | |
MYPI95001514A MY138359A (en) | 1994-06-13 | 1995-06-08 | Method of producing laminate |
CN95105865A CN1057728C (en) | 1994-06-13 | 1995-06-09 | Method of producing laminate |
KR1019950015294A KR0162709B1 (en) | 1994-06-13 | 1995-06-10 | Manufacture of laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12997394A JP3228003B2 (en) | 1994-06-13 | 1994-06-13 | Manufacturing method of laminated board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07329090A true JPH07329090A (en) | 1995-12-19 |
JP3228003B2 JP3228003B2 (en) | 2001-11-12 |
Family
ID=15023022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12997394A Expired - Lifetime JP3228003B2 (en) | 1994-06-13 | 1994-06-13 | Manufacturing method of laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3228003B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09176263A (en) * | 1995-12-25 | 1997-07-08 | Sumitomo Durez Co Ltd | Phenolic resin composition |
JPH09283876A (en) * | 1996-04-12 | 1997-10-31 | Hitachi Chem Co Ltd | Laminated board for printed wiring board |
US8026300B2 (en) * | 2006-04-13 | 2011-09-27 | Momentive Specialty Chemicals Inc. | Aqueous resin dispersion, process of making thereof, and product thereof |
US8354475B2 (en) | 2007-12-12 | 2013-01-15 | Momentive Specialty Chemicals Inc. | Epoxy-phenolic resins co-dispersions |
-
1994
- 1994-06-13 JP JP12997394A patent/JP3228003B2/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09176263A (en) * | 1995-12-25 | 1997-07-08 | Sumitomo Durez Co Ltd | Phenolic resin composition |
JPH09283876A (en) * | 1996-04-12 | 1997-10-31 | Hitachi Chem Co Ltd | Laminated board for printed wiring board |
US8026300B2 (en) * | 2006-04-13 | 2011-09-27 | Momentive Specialty Chemicals Inc. | Aqueous resin dispersion, process of making thereof, and product thereof |
US8354475B2 (en) | 2007-12-12 | 2013-01-15 | Momentive Specialty Chemicals Inc. | Epoxy-phenolic resins co-dispersions |
Also Published As
Publication number | Publication date |
---|---|
JP3228003B2 (en) | 2001-11-12 |
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