JP3222689B2 - Manufacturing method of laminated board - Google Patents
Manufacturing method of laminated boardInfo
- Publication number
- JP3222689B2 JP3222689B2 JP12997294A JP12997294A JP3222689B2 JP 3222689 B2 JP3222689 B2 JP 3222689B2 JP 12997294 A JP12997294 A JP 12997294A JP 12997294 A JP12997294 A JP 12997294A JP 3222689 B2 JP3222689 B2 JP 3222689B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sheet
- laminate
- benzoxazine
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、電気用絶縁板、特にプ
リント配線板用絶縁基板として用いられる積層板の製造
方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an electric insulating plate, and more particularly to a method for producing a laminated board used as an insulating substrate for a printed wiring board.
【0002】[0002]
【従来の技術】電気用絶縁板、特にプリント配線板用絶
縁基板として用いられる積層板(以下単に積層板とい
う)は、シート状繊維基材に、絶縁材料樹脂を塗布含浸
し、加熱してプリプレグを得、このプリプレグを所定数
重ね、加熱加圧することによって製造されている。絶縁
材料樹脂としては、フェノール樹脂、エポキシ樹脂、不
飽和ポリエステル樹脂などの熱硬化性樹脂が主に使用さ
れている。シート状繊維基材に、絶縁材料樹脂を塗布含
浸する工程では、多量の溶剤を使用している。2. Description of the Related Art A laminated board (hereinafter simply referred to as a laminated board) used as an insulating board for electric use, particularly a printed wiring board (hereinafter simply referred to as a "laminated board") is prepared by applying and impregnating a sheet-like fiber base material with an insulating material resin and heating the prepreg. The prepreg is manufactured by stacking a predetermined number of the prepregs and applying heat and pressure. Thermosetting resins such as phenolic resins, epoxy resins, and unsaturated polyester resins are mainly used as the insulating material resin. In the step of coating and impregnating the sheet-like fiber base material with the insulating material resin, a large amount of solvent is used.
【0003】[0003]
【発明が解決しようとする課題】ところが、シート状繊
維基材に、絶縁材料樹脂を塗布含浸する工程で多量の溶
剤を使用しているため、火災、爆発などの災害発生防止
及び揮散する溶剤蒸気による環境汚染防止に配慮した設
備の設置と維持管理に多額の費用を要し生産コストを圧
迫している。However, since a large amount of solvent is used in the step of coating and impregnating the sheet-like fiber base material with the insulating material resin, it is possible to prevent fires, explosions, and other disasters from occurring and to vaporize the solvent vapor. The installation and maintenance of facilities that take into account the prevention of environmental pollution caused by large amounts of money required a large amount of money, which put pressure on production costs.
【0004】ジヒドロ−1.3−ベンゾオキサジン類
は、加熱することにより、揮発性の副生成成分を生ずる
ことなく重合、硬化することが知られているが(特開昭
49−47378号公報参照)、積層板の製造について
は、メチルエチルケトンなどの溶剤を使用する方法が採
られている。このため、材料の特殊性もあって、ジヒド
ロ−1.3−ベンゾオキサジン類の硬化物をマトリック
スとする積層板は実用化に至っていない。本発明は、ジ
ヒドロ−1.3−ベンゾオキサジン類が硬化するとき、
揮発性の副生成成分を生ずることなく重合、硬化すると
いう特長をいかして、溶剤を用いないで積層板を製造す
る方法を提供することを目的とするものである。It is known that dihydro1.3-benzoxazines are polymerized and cured by heating without producing volatile by-products (see Japanese Patent Application Laid-Open No. 49-47378). For the production of the laminate, a method using a solvent such as methyl ethyl ketone is employed. For this reason, due to the specialty of the material, a laminated board using a cured product of dihydro-1.3-benzoxazine as a matrix has not been put to practical use. The present invention provides a method for curing dihydro-1.3-benzoxazines,
It is an object of the present invention to provide a method for producing a laminated board without using a solvent, by utilizing a feature that polymerization and curing are performed without generating volatile by-product components.
【0005】[0005]
【課題を解決するための手段】本発明は、分子中に化2
に示す基を2以上有するジヒドロ−1.3−ベンゾオキ
サジン類(以下ジヒドロベンゾオキサジン樹脂という)
をシート状にし、このシートと、所定枚数の繊維質シー
ト基材とを重ねて加熱加圧することを特徴とする積層板
の製造方法である。The present invention provides a compound represented by the formula
Dihydro-1.3-benzoxazines having two or more groups shown below (hereinafter referred to as dihydrobenzoxazine resins)
In the form of a sheet, and laminating the sheet and a predetermined number of fibrous sheet substrates, and heating and pressing the laminated sheet.
【化2】 化2式中R1 は、フェニル基、置換フェニル基、メチル
基又はシクロヘキシル基であり、R2 は、水素、メチル
基、エチル基又はフェニル基である。Embedded image In the formula, R 1 is a phenyl group, a substituted phenyl group, a methyl group or a cyclohexyl group, and R 2 is a hydrogen, a methyl group, an ethyl group or a phenyl group.
【0006】ジヒドロベンゾオキサジン樹脂は、ヒドロ
キシル基のオルト位の少なくとも一つが水素であるヒド
ロキシフェニレン基を、1分子中に2以上有する化合物
と、1級アミンとホルムアルデヒドとを、前記ヒドロキ
シフェニレン基のオルト位の少なくとも一つが水素であ
るヒドロキシル基1モルに対し、1級アミンを0.2〜
0.9モル、及び、ホルムアルデヒドを1級アミンの2
倍モル量以上の比で反応させることによって製造され
る。The dihydrobenzoxazine resin is a compound having at least one hydroxyphenylene group in which at least one of the ortho positions of the hydroxyl group is hydrogen in one molecule, a primary amine and formaldehyde, Primary amine is used in an amount of 0.2 to 1 mole per mole of a hydroxyl group in which at least one of the
0.9 mole of formaldehyde and 2 of primary amine
It is produced by reacting at a molar ratio of at least twice.
【0007】具体的には、ヒドロキシル基のオルト位の
少なくとも一つが水素であるヒドロキシフェニレン基
を、1分子中に2以上有する化合物(以下、反応しうる
ヒドロキシフェニレン基を有する化合物という)と、1
級アミンとの混合物を、70℃以上に加熱したアルデヒ
ド中に添加して、70〜110℃、好ましくは、90〜
100℃で、20分〜2時間反応させ、その後120℃
以下の温度で減圧乾燥することによってジヒドロベンゾ
オキサジン樹脂が得られる。More specifically, a compound having two or more hydroxyphenylene groups in one molecule in which at least one of the ortho positions of the hydroxyl group is hydrogen (hereinafter, referred to as a compound having a reactive hydroxyphenylene group) and 1
The mixture with a tertiary amine is added to an aldehyde heated to 70 ° C. or more, and the mixture is added at 70 to 110 ° C., preferably 90 to 110 ° C.
Reaction at 100 ° C for 20 minutes to 2 hours, then 120 ° C
A dihydrobenzoxazine resin is obtained by drying under reduced pressure at the following temperature.
【0008】反応しうるヒドロキシフェニレン基を有す
る化合物のヒドロキシル基1モルに対し、1級アミンを
0.2〜0.9モル、及び、ホルムアルデヒドを1級ア
ミンの2倍モル量以上の比で反応させることが肝要であ
る。1級アミンが0.2モルより少ないと、ジヒドロオ
キサジン環の数が少なくなるので、得られた化合物を硬
化させたとき、架橋密度が小さく、強度が小さい硬化物
しか得られない。また、0.9モルより多いと、分子鎖
の伸長度が小さくて架橋密度が小さくなるため200℃
を超えると軟化したり、熱劣化するので好ましくない。The primary amine and the formaldehyde are reacted at a ratio of at least 0.2 to 0.9 mol and at least twice the molar amount of the primary amine with respect to 1 mol of the hydroxyl group of the compound having a reactive hydroxyphenylene group. It is important to make it happen. When the amount of the primary amine is less than 0.2 mol, the number of dihydrooxazine rings becomes small, so that when the obtained compound is cured, only a cured product having a low crosslinking density and a small strength can be obtained. On the other hand, if the amount is more than 0.9 mol, the degree of elongation of the molecular chain is small and the crosslink density is small, so that 200 ° C.
If it exceeds, it is not preferable because of softening or thermal deterioration.
【0009】反応しうるヒドロキシフェニレン基を有す
る化合物に対する1級アミンの配合量は、次のようにし
て求めることができる。すなわち、ヒドロキシフェニレ
ン基を有する化合物の全ヒドロキシル基と同モル量の1
級アミンを反応させて、実際に得られた生成物の重量か
ら反応したヒドロキシル基量、すなわち、ヒドロキシフ
ェニレン基を有する化合物中の反応しうるヒドロキシル
基量を見積もり、これに対する前記のモル比として算出
する。The amount of the primary amine to be added to the compound having a reactive hydroxyphenylene group can be determined as follows. That is, 1 mole of the same molar amount as all hydroxyl groups of the compound having a hydroxyphenylene group is used.
The amount of reacted hydroxyl groups in the compound having a hydroxyphenylene group was estimated from the weight of the product actually obtained by reacting the secondary amine, and the amount of the hydroxyl group capable of reacting in the compound having a hydroxyphenylene group was estimated, and calculated as the molar ratio described above. I do.
【0010】1分子中に2以上の反応しうるヒドロキシ
フェニレン基を有する化合物としては、部分的にフェノ
ール核を有する種々の化合物が用いることができる。具
体的にはフェノールノボラック樹脂、レゾール樹脂、フ
ェノール変成キシレン樹脂、アルキルフェノール樹脂、
メラミンフェノール樹脂、フェノール変性ポリブタジエ
ン等が挙げられる。これらは、特に限定するものではな
いが架橋点となるヒドロキシル基のオルト位が無置換で
あるものが硬化物特性の点で望ましく、そのため例えば
フェノールノボラック樹脂の場合はオルト率が小さく比
較的分子量の小さいいわゆるランダムノボラックを用い
ることが好ましい。上記の樹脂は、1分子中の反応しう
るヒドロキシフェニレン基の数が異なった化合物の集合
であり、製造中に生成した熱硬化性化合物の一部が互い
に重合している。As the compound having two or more reactive hydroxyphenylene groups in one molecule, various compounds partially having a phenol nucleus can be used. Specifically, phenol novolak resin, resole resin, phenol modified xylene resin, alkylphenol resin,
Melamine phenol resin, phenol-modified polybutadiene and the like can be mentioned. These are not particularly limited, but those in which the ortho position of the hydroxyl group serving as a crosslinking point is unsubstituted are desirable in terms of the properties of the cured product.For example, in the case of a phenol novolak resin, the ortho ratio is small and the molecular weight is relatively small. It is preferred to use small so-called random novolaks. The above resin is a set of compounds having different numbers of reactive hydroxyphenylene groups in one molecule, and a part of the thermosetting compounds generated during the production are polymerized with each other.
【0011】1級アミンとしては、具体的にはメチルア
ミン、シクロヘキシルアミン、アニリン、置換アニリン
等が挙げられる。脂肪族アミンであると、得られた熱硬
化性化合物の硬化が速いが硬化物の耐熱性がやや劣り、
アニリンのような芳香族アミンであると、得られた熱硬
化性化合物を硬化させた硬化物の耐熱性はよいが硬化が
遅くなる。Specific examples of the primary amine include methylamine, cyclohexylamine, aniline, substituted aniline and the like. If the aliphatic amine, the curing of the resulting thermosetting compound is fast, but the heat resistance of the cured product is slightly inferior,
When an aromatic amine such as aniline is used, the cured product obtained by curing the obtained thermosetting compound has good heat resistance, but cures slowly.
【0012】このようにして得られたジヒドロベンゾオ
キサジン樹脂を、予め80〜180℃、好ましくは12
0〜160℃で熱処理する事により、その一部を予備重
合させ、成形時の硬化速度や溶融粘度を調整する。The thus obtained dihydrobenzoxazine resin is previously heated at 80 to 180 ° C., preferably at 12 ° C.
By heat-treating at 0 to 160 ° C., a part thereof is prepolymerized, and the curing speed and melt viscosity during molding are adjusted.
【0013】積層板用として使用されている、植物油変
性フェノール樹脂、エポキシ樹脂、ポリエステル樹脂、
ビニールエステル樹脂、ポリイミド樹脂等の熱硬化性樹
脂をBステージ化物又は硬化物として添加してもよい。
また植物油変性フェノール樹脂、エポキシ樹脂等の印刷
回路用積層板を成形した製品の残材及び切断耳等より金
属箔等を除去して粒径150μm以下の粒子に粉砕し
て、3〜75%混合してシート状にすることも可能であ
る。これらの樹脂粉を分散させるには、粒径が小さい方
が好ましく、通常粒径100μm以下、最適には粒径5
0μm以下が望ましい。これらの樹脂組成は、印刷回路
用積層板の要求特性により選択又は改良して使用する。
これらの添加物のほかに、必要により、可塑剤を添加す
る。[0013] Vegetable oil-modified phenolic resins, epoxy resins, polyester resins, used for laminates
A thermosetting resin such as a vinyl ester resin or a polyimide resin may be added as a B-staged product or a cured product.
In addition, metal foils and the like are removed from the residual material and cut ears of a product formed of a printed circuit laminate such as a vegetable oil-modified phenolic resin, an epoxy resin, etc., pulverized into particles having a particle size of 150 μm or less, and mixed with 3 to 75%. It is also possible to form a sheet. In order to disperse these resin powders, it is preferable that the particle size is small, and usually the particle size is 100 μm or less, and optimally the particle size is 5 μm.
0 μm or less is desirable. These resin compositions are selected or improved depending on the required characteristics of the printed circuit laminate, and used.
In addition to these additives, if necessary, a plasticizer is added.
【0014】ジヒドロベンゾオキサジン樹脂を合成した
後、例えばホットメルト用コーターを使用し、樹脂を加
圧加温して、金属シート又は耐熱樹脂シート(フッ素樹
脂シートなど)の上に均一に塗布してシートにする。シ
ートの厚みは、繊維質シート基材の材質や厚みにより適
宜調整するが、120g/m2 〜200g/m2 とする
のがよく、140g/m2 〜180g/m2が最適であ
る。After synthesizing the dihydrobenzoxazine resin, the resin is heated under pressure using, for example, a coater for hot melt, and uniformly coated on a metal sheet or a heat-resistant resin sheet (eg, a fluororesin sheet). Make a sheet. The thickness of the sheet is appropriately adjusted depending on the material and thickness of the fibrous sheet substrate, good to the 120g / m 2 ~200g / m 2 , 140g / m 2 ~180g / m 2 is optimum.
【0015】繊維質シート基材としては、一般に積層板
用として使用されているシート基材が使用できる。紙、
ガラス織布、ガラス不織布などいずれも使用できる。こ
れらのシート基材には、例えば紙については水溶性フェ
ノール樹脂又はメラミン変性フェノール樹脂で、ガラス
基材については、シランカップリング剤で、それぞれ処
理しておくのが好ましい。As the fibrous sheet substrate, a sheet substrate generally used for a laminate can be used. paper,
Any of glass woven fabric, glass nonwoven fabric and the like can be used. These sheet substrates are preferably treated with a water-soluble phenol resin or a melamine-modified phenol resin for paper and with a silane coupling agent for glass substrates.
【0016】繊維質シート基材と、ジヒドロベンゾオキ
サジン樹脂のシートとを適宜重ねた構成体を離形フィル
ムで覆い、加熱加圧して積層板を得る。繊維質シート基
材と、ジヒドロ−1.3−ベンゾオキサジン化合物のシ
ートとをあらかじめ加熱ロールで圧着した複合シートを
用いてもよい。繊維質シート状基材にジヒドロベンゾオ
キサジン樹脂をコーティングするようにすれば、連続成
形も可能となる。離形フィルムに代えて、金属はく例え
ば銅はくを重ねれば、金属はく張積層板を得ることがで
きる。金属はくとしては、通常銅はくを使用するが、必
要特性によってはニッケルはく、アルミはく等の金属は
くを用いることもできる。A structure in which a fibrous sheet substrate and a dihydrobenzoxazine resin sheet are appropriately laminated is covered with a release film, and a laminate is obtained by heating and pressing. A composite sheet in which a fibrous sheet substrate and a sheet of a dihydro-1.3-benzoxazine compound are pressure-bonded with a heating roll in advance may be used. If the fibrous sheet-like substrate is coated with a dihydrobenzoxazine resin, continuous molding is also possible. If a metal foil, for example, a copper foil is laminated in place of the release film, a metal-clad laminate can be obtained. As the metal foil, copper foil is usually used, but metal foil such as nickel foil or aluminum foil may be used depending on required characteristics.
【0017】[0017]
実施例1 フェノール1.9kg、ホルマリン(37%水溶性)
1.0kg、しゅう酸4gを5リットルの反応釜に仕込
み、還流温度で6時間反応させた。引き続き内部を減圧
して未反応のフェノール及び水を除去した。得られた樹
脂は軟化点84℃(環球法)3〜多核体比82/18
(ゲルバ−ミエ−シヨンクロマトグラフィ−によるピー
ク面積比)であった。Example 1 phenol 1.9 kg, formalin (37% water-soluble)
1.0 kg and 4 g of oxalic acid were charged into a 5 liter reactor and reacted at reflux temperature for 6 hours. Subsequently, the internal pressure was reduced to remove unreacted phenol and water. The obtained resin has a softening point of 84 ° C. (ring and ball method) 3 to polynuclear ratio 82/18.
(Peak area ratio according to gel-barrier chromatography).
【0018】上記により合成したフェノールノボラック
樹脂1.70kg(水酸基16mol相当)とアニリン
0.93kg(10mol相当)とを混合し、80℃で
5時間撹拌し均一な混合溶液を調整した。5リットルの
反応釜中にホルマリン1.62kgを仕込み90℃に加
熱し、その中に、前記フェノールノボラック樹脂とアニ
リンとの混合溶液を加え、30分間還流温度に保ち、次
に、100℃で2時間減圧して縮合水を除去した。反応
し得る水酸基の71%がジヒドロ−1.3−ベンゾオキ
サジン化された樹脂組成物を得た。1.70 kg (corresponding to 16 mol of hydroxyl groups) of the phenol novolak resin synthesized above and 0.93 kg (corresponding to 10 mol) of aniline were mixed and stirred at 80 ° C. for 5 hours to prepare a uniform mixed solution. 1.62 kg of formalin was charged into a 5 liter reaction vessel and heated to 90 ° C., and the mixed solution of the phenol novolak resin and aniline was added thereto. The mixture was kept at the reflux temperature for 30 minutes. The pressure was reduced for a time to remove the condensed water. A resin composition in which 71% of the hydroxyl groups capable of reacting were converted to dihydro-1.3-benzoxazine was obtained.
【0019】反応し得る水酸基量の算出法は、以下の通
りである。前記フェノールノボラック樹脂1.70kg
(水酸基16mol相当)をアニリン1.49kg(1
6mol相当)及びホルマリン2.59kgと同様に反
応させ、反応可能な水酸基のすべてをジヒドロ−1.3
−ベンゾオキサジン化する。未反応のアニリン及びホル
マリン並びに反応系の水を除去した残り、即ち、ジヒド
ロベンゾオキサジン樹脂の収量は、3.34kgであ
る。これは、フェノールノボラック樹脂の水酸基のうち
14molが反応し、ジヒドロ−1.3−ベンゾオキサ
ジン化したものに相当する。これから、本実施例におい
て得られた樹脂組成物は、反応し得る水酸基14mol
のうち10mol(71%)がジヒドロ−1.3−ベン
ゾオキサジン化したものであることがわかる。The method for calculating the amount of hydroxyl group capable of reacting is as follows. 1.70 kg of the phenol novolak resin
(Corresponding to 16 mol of hydroxyl groups) to 1.49 kg of aniline (1
(Equivalent to 6 mol) and 2.59 kg of formalin, and all the reactive hydroxyl groups were converted to dihydro-1.3.
-Benzoxazine conversion. The unreacted aniline and formalin and the residue obtained by removing the water of the reaction system, that is, the yield of the dihydrobenzoxazine resin is 3.34 kg. This corresponds to a product in which 14 mol of the hydroxyl groups of the phenol novolak resin have reacted and converted to dihydro-1.3-benzoxazine. From this, the resin composition obtained in the present example has 14 mol of reactive hydroxyl groups.
It can be seen that 10 mol (71%) of the compound was converted to dihydro-1.3-benzoxazine.
【0020】実施例2 1,2−ブタジエン(日本曹達株式会社製、B−100
0)0.92kg、フェノール3.30kg、p−トル
エンスルホン酸1gを5リットルの反応釜に仕込み、8
0℃で5時間反応させた。冷却、水洗後、水蒸気蒸留に
より未反応のフェノールを除去しポリブタジエン変性フ
ェノール樹脂1.41kgを得た。付加したフェノール
の重量より、水酸基当量は270となる。Example 2 1,2-butadiene (B-100, manufactured by Nippon Soda Co., Ltd.)
0) 0.92 kg, 3.30 kg of phenol and 1 g of p-toluenesulfonic acid were charged into a 5 liter reactor, and 8
The reaction was performed at 0 ° C. for 5 hours. After cooling and washing with water, unreacted phenol was removed by steam distillation to obtain 1.41 kg of a polybutadiene-modified phenol resin. The hydroxyl equivalent is 270 based on the weight of the added phenol.
【0021】得られたポリブタジエン変性フェノール樹
脂2.70kg(水酸基10mol相当)、アニリン
0.56kg(6mol相当)及びホルマリン0.97
kgを用い、実施例1と同様の操作で反応し得る水酸基
の73%がジヒドロ−1.3−ベンゾオキサジン化され
た樹脂組成物を得た。The resulting polybutadiene-modified phenol resin (2.70 kg, corresponding to 10 mol of hydroxyl groups), 0.56 kg (corresponding to 6 mol) of aniline, and 0.97 kg of formalin
Using kg, a resin composition in which 73% of hydroxyl groups capable of reacting were converted to dihydro-1.3-benzoxazine was obtained in the same manner as in Example 1.
【0022】実施例3 桐油0.50kg、m−クレゾール4.00kg、p−
トルエンスルホン酸4gを5リットルの反応釜に仕込
み、80℃で5時間反応させた。冷却、水洗後、水蒸気
蒸留により未反応のm−クレゾールを除去し桐油/m−
クレゾール反応物0.82kgを得た。付加したm−ク
レゾールの重量より水酸基当量は280となる。Example 3 Tung oil 0.50 kg, m-cresol 4.00 kg, p-
4 g of toluenesulfonic acid was charged into a 5 liter reaction vessel, and reacted at 80 ° C. for 5 hours. After cooling and washing with water, unreacted m-cresol was removed by steam distillation and tung oil / m-
0.82 kg of the cresol reactant was obtained. The hydroxyl equivalent is 280 based on the weight of the added m-cresol.
【0023】得られた桐油/m−クレゾール反応物2.
80kg(水酸基10mol相当)をアニリン0.56
kg(6mol相当)、ホルマリン0.97kgを用い
実施例1と同様の操作で反応し得る水酸基の66%がジ
ヒドロ−1.3−ベンゾオキサジン化された樹脂を得
た。The obtained tung oil / m-cresol reactant
80 kg (corresponding to 10 mol of hydroxyl groups) of aniline 0.56
Using 0.6 kg (equivalent to 6 mol) and 0.97 kg of formalin, a resin in which 66% of hydroxyl groups capable of reacting were converted to dihydro-1.3-benzoxazine was obtained in the same manner as in Example 1.
【0024】実施例4 キシレン樹脂(三菱瓦斯化学株式会社製商品名ニカノー
ルH、平均分子量557、反応性基当量96を使用)
0.96kg、フェノール4.00kg、p−トルエン
スルホン酸4gを5リットルの反応釜に仕込み、80℃
で5時間反応させた。冷却、水洗後、水蒸気蒸留により
未反応のフェノールを除去し、フェノール変性キシレン
樹脂1.12kgを得た。未反応フェノール残存量から
オキシメチレン基と置換したフェノールは0.31kg
であった。ここから合成したキシレン樹脂の水酸基当量
は340となる。Example 4 Xylene resin (Nikanol H, trade name, manufactured by Mitsubishi Gas Chemical Co., Ltd., average molecular weight: 557, reactive group equivalent: 96)
0.96 kg, 4.00 kg of phenol and 4 g of p-toluenesulfonic acid were charged into a 5 liter reactor,
For 5 hours. After cooling and washing, unreacted phenol was removed by steam distillation to obtain 1.12 kg of a phenol-modified xylene resin. 0.31 kg of phenol substituted with oxymethylene group based on unreacted phenol residue
Met. The hydroxyl equivalent of the xylene resin synthesized from this becomes 340.
【0025】得られたキシレン変性フェノール樹脂3.
40kg(水酸基10mol相当)、アニリン0.28
kg(3mol相当)、ホルマリン0.49kgを用い
実施例1と同様の操作で反応し得る水酸基の79%がジ
ヒドロ−1.3−ベンゾオキサジン化された樹脂成物を
得た。2. The obtained xylene-modified phenolic resin
40 kg (corresponding to 10 mol of hydroxyl groups), aniline 0.28
kg (corresponding to 3 mol) and 0.49 kg of formalin, a resin product was obtained in which 79% of hydroxyl groups capable of reacting were converted to dihydro-1.3-benzoxazine by the same operation as in Example 1.
【0026】積層板1の製造 得られた4種類のジヒドロベンゾオキサジン樹脂を、ス
チールベルト上に流して冷却してシートとした。シート
は146g/m2 であった。別に、厚さ0.2mmのク
ラフト紙に水溶性メラミン変性フェノール樹脂を、樹脂
分が15重量%となるように塗布した。このクラフト紙
8枚とジヒドロベンゾオキサジン樹脂シートとを重ね、
両外に厚さ18μmの銅はくを重ね、鏡板間にセットし
て、多段プレスで、温度170℃、圧力8MPaで90
分間加熱加圧した。Production of Laminated Plate 1 The obtained four kinds of dihydrobenzoxazine resins were flowed on a steel belt and cooled to form sheets. The sheet weighed 146 g / m 2 . Separately, a water-soluble melamine-modified phenol resin was applied to kraft paper having a thickness of 0.2 mm so that the resin content was 15% by weight. Pile 8 sheets of kraft paper and dihydrobenzoxazine resin sheet,
A copper foil with a thickness of 18 μm is layered on both sides, set between head plates, and pressed at a temperature of 170 ° C. and a pressure of 8 MPa by a multi-stage press.
Heated and pressurized for minutes.
【0027】積層板2の製造 得られた4種類のジヒドロベンゾオキサジン樹脂に、紙
フェノール樹脂積層板(銅はく除去したFR−2板)を
粒径50μmに粉砕した粉砕粉を樹脂に対して20重量
%添加して充分に混合し、スチールベルト上に流して冷
却してシートとした。シートは146g/m2 であっ
た。以下積層板1の製造と同様にして積層板を得た。Production of Laminated Board 2 A pulverized powder obtained by pulverizing a paper-phenol resin laminated board (FR-2 board from which copper has been removed) with the obtained four kinds of dihydrobenzoxazine resins to a particle diameter of 50 μm was applied to the resin. 20% by weight was added, mixed well, flowed on a steel belt and cooled to form a sheet. The sheet weighed 146 g / m 2 . Hereinafter, a laminated plate was obtained in the same manner as in the production of the laminated plate 1.
【0028】積層板3の製造 水溶性メラミン変性フェノール樹脂に紙フェノール樹脂
積層板(銅はく除去したFR−2板)を粒径50μmに
粉砕した粉砕粉を樹脂に対して10重量%添加して充分
に混合した。この水溶性メラミン変性フェノール樹脂
を、樹脂分が15重量%となるように厚さ0.2mmの
クラフト紙に塗布した。以下積層板2の製造と同様にし
て積層板を得た。Manufacture of Laminated Plate 3 A water-soluble melamine-modified phenolic resin was added with 10% by weight of a crushed powder obtained by pulverizing a paper phenolic resin laminated plate (FR-2 plate from which copper was removed) to a particle size of 50 μm. And mixed well. This water-soluble melamine-modified phenol resin was applied to kraft paper having a thickness of 0.2 mm so that the resin content was 15% by weight. Hereinafter, a laminated plate was obtained in the same manner as in the production of the laminated plate 2.
【0029】積層板4の製造 紙フェノール樹脂積層板(銅はく除去したFR−2板)
を粒径50μmに粉砕した粉砕粉を10重量%抄き込ん
だ、厚さ0.2mmのクラフト紙に、水溶性メラミン変
性フェノール樹脂を、樹脂分が15重量%となるように
塗布した。以下積層板2の製造と同様にして積層板を得
た。Manufacture of laminated board 4 Paper phenol resin laminated board (FR-2 board from which copper was removed)
A water-soluble melamine-modified phenolic resin was applied to kraft paper having a thickness of 0.2 mm in which 10% by weight of ground powder having a particle size of 50 μm was incorporated, so that the resin content was 15% by weight. Hereinafter, a laminated plate was obtained in the same manner as in the production of the laminated plate 2.
【0030】比較例 桐油とフェノールとを酸性触媒下で反応させ、次に85
%パラホルムアルデヒド加えてアルカリ触媒下反応させ
て、レゾール化して、桐油変性率39%の桐油変性フェ
ノール樹脂を得た。この桐油変性フェノール樹脂100
重量部に、テトラブロモビスフェノールAジグリシジル
エーテル25重量部を配合してメチルエチルケトンに溶
解して含浸用ワニスとした。厚さ0.2mmのクラフト
紙に、水溶性メラミン変性フェノール樹脂を、樹脂分が
15重量%となるように塗布乾燥し、次に、前記含浸用
ワニスを樹脂付着量が53重量%になるように含浸乾燥
してプリプレグとした。得られたプリプレグ8枚を接着
剤付銅はくと組み合わせて重ね、温度170℃圧力8M
Paで90分間に加熱加圧して積層板を得た。Comparative Example Tung oil and phenol were reacted under an acidic catalyst.
% Paraformaldehyde was added thereto and reacted under an alkali catalyst to form a resol. Thus, a tung oil-modified phenol resin having a tung oil modification rate of 39% was obtained. This tung oil modified phenolic resin 100
25 parts by weight of tetrabromobisphenol A diglycidyl ether was blended with the parts by weight and dissolved in methyl ethyl ketone to obtain a varnish for impregnation. A 0.2 mm thick kraft paper is coated with a water-soluble melamine-modified phenolic resin so as to have a resin content of 15% by weight and dried, and then the impregnating varnish is applied so that the resin adhesion amount becomes 53% by weight. Was impregnated and dried to obtain a prepreg. Eight prepregs thus obtained are combined with copper foil with an adhesive and stacked at a temperature of 170 ° C. and a pressure of 8M.
The laminate was obtained by heating and pressing at 90 Pa for 90 minutes.
【0031】得られた積層板について、気中耐熱性、加
熱減量、吸水率及び絶縁抵抗を調べた。結果を表1に示
す。気中耐熱性は、200℃の乾燥機中に保持してふく
れを生ずるまでの時間である。加熱減量は、200℃の
乾燥機中に10分間保持したときの保持前後の重量変化
である。吸水率は、50℃で24時間処理した後、23
℃の水の中に24時間保持したときの保持前後の重量変
化の百分率である。絶縁抵抗率は、銅はくをエッチング
で除去し、煮沸水中で2時間保持した後、中心間隔15
mmで設けた直径5mmの二つの穴に、絶縁抵抗計のテ
ーパーピンを挿入し、直流500Vを1分間印加したと
きの絶縁抵抗計の読みである。The obtained laminate was examined for heat resistance in air, weight loss on heating, water absorption and insulation resistance. Table 1 shows the results. Aerial heat resistance is the time it takes for blistering to occur in a drier at 200 ° C. Heat loss is the weight change before and after holding in a dryer at 200 ° C. for 10 minutes. The water absorption was measured at 50 ° C for 24 hours.
The percentage change in weight before and after holding for 24 hours in water at ° C. The insulation resistivity was determined by removing the copper foil by etching and keeping it in boiling water for 2 hours.
5 is a reading of an insulation resistance meter when a taper pin of the insulation resistance meter is inserted into two holes having a diameter of 5 mm and a DC voltage of 500 V is applied for 1 minute.
【0032】[0032]
【表1】 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 試験項目 積層板1 積層板2 積層板3 積層板4 比較例 ──────────────────────────────────── 気中耐熱性(分) 60 45 40 38 30 加熱減量(%) 0.10 0.18 0.15 0.20 0.35 吸水率(%) 0.65 0.73 0.70 0.75 0.70 絶縁抵抗(Ω)×108 5 3 1 3 2 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━[Table 1] ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Test items Laminated board 1 Laminated board 2 Laminated board 3 Laminated plate 4 Comparative example ──────────────────────────────────── Heat resistance in air (min) 60 45 40 38 30 Loss on heating (%) 0.10 0.18 0.15 0.20 0.35 Water absorption (%) 0.65 0.73 0.70 0.75 0.70 Insulation resistance (Ω) × 10 8 5 3 1 3 2 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━
【0033】[0033]
【発明の効果】本発明方法によれば、ベンゾオキサジン
樹脂が硬化するときに低分子量の反応副生物を生成しな
いという特徴を活かし、溶剤を使用しないで成形できる
ため、安全面及び環境衛生上優れている。According to the method of the present invention, the benzoxazine resin can be molded without using a solvent, taking advantage of the fact that a low-molecular-weight reaction by-product is not produced when the resin is cured. ing.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI B29K 105:08 B29K 105:08 105:22 105:22 461:04 461:04 (72)発明者 平井 康之 茨城県下館市大字小川1500番地 日立化 成工業株式会社下館工場内 (56)参考文献 特開 平6−345898(JP,A) 特開 平2−69567(JP,A) 特開 昭54−3166(JP,A) 特開 昭49−47678(JP,A) (58)調査した分野(Int.Cl.7,DB名) B29C 43/18 - 43/20 B29C 70/04 - 70/06 B32B 27/00 - 27/42 C08J 5/24 C08L 61/04 - 61/14 C08L 79/00 C08G 73/00 C08G 14/00 - 14/06 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification code FI B29K 105: 08 B29K 105: 08 105: 22 105: 22 461: 04 461: 04 (72) Inventor Yasuyuki Hirai Shimodate, Ibaraki 1500 Ogawa, Shimodate Plant, Hitachi Chemical Co., Ltd. (56) References JP-A-6-345898 (JP, A) JP-A-2-69567 (JP, A) JP-A-54-3166 (JP, A) JP-A-49-47678 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) B29C 43/18-43/20 B29C 70/04-70/06 B32B 27/00-27 / 42 C08J 5/24 C08L 61/04-61/14 C08L 79/00 C08G 73/00 C08G 14/00-14/06
Claims (5)
ヒドロ−1.3−ベンゾオキサジン類をシート状にし、
このシートと、所定枚数の繊維質シート基材とを重ねて
加熱加圧することを特徴とする積層板の製造方法。 【化1】 式中R1 は、フェニル基、置換フェニル基、メチル基又
はシクロヘキシル基であり、R3 は、水素、メチル基、
エチル基又はフェニル基である。1. A sheet of a dihydro-1.3-benzoxazine having at least two groups of the formula 1 in a molecule,
A method for manufacturing a laminate, comprising laminating a predetermined number of fibrous sheet base materials with the sheet and heating and pressing. Embedded image In the formula, R 1 is a phenyl group, a substituted phenyl group, a methyl group or a cyclohexyl group, and R 3 is a hydrogen, a methyl group,
It is an ethyl group or a phenyl group.
が、フェノール樹脂にホルマリン及び一級アミンを反応
させて得られたジヒドロ−1.3−ベンゾオキサジンで
あることを特徴とする積層板の製造方法。2. A method for producing a laminate, wherein the dihydro1.3-benzoxazine is dihydro1.3-benzoxazine obtained by reacting formalin and a primary amine with a phenol resin.
ヒドロ−1.3−ベンゾオキサジン類に熱硬化性樹脂粉
末を配合した組成物をシート状にし、このシートと所定
枚数の繊維質シート基材とを重ねて加熱加圧することを
特徴とする積層板の製造方法。3. A composition comprising a thermosetting resin powder mixed with a dihydro-1.3-benzoxazine having two or more groups represented by the following formulas in the molecule into a sheet, and the sheet and a predetermined number of fibers A method for producing a laminate, comprising laminating a sheet base material and heating and pressing.
砕した粉末である請求項3記載の積層板の製造方法。4. The method for producing a laminate according to claim 3, wherein the thermosetting resin powder is a powder obtained by pulverizing a laminate for electric use.
の外側に金属はくを重ねて加熱加圧することを特徴とす
る請求項1、2、3又は4記載の積層板の製造方法。5. The method for producing a laminate according to claim 1, wherein a predetermined number of fibrous sheet substrates are stacked, and a metal foil is stacked on the outside thereof and heated and pressed.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12997294A JP3222689B2 (en) | 1994-06-13 | 1994-06-13 | Manufacturing method of laminated board |
TW084104843A TW308566B (en) | 1994-06-13 | 1995-05-16 | |
MYPI95001514A MY138359A (en) | 1994-06-13 | 1995-06-08 | Method of producing laminate |
CN95105865A CN1057728C (en) | 1994-06-13 | 1995-06-09 | Method of producing laminate |
KR1019950015294A KR0162709B1 (en) | 1994-06-13 | 1995-06-10 | Manufacture of laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12997294A JP3222689B2 (en) | 1994-06-13 | 1994-06-13 | Manufacturing method of laminated board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07329087A JPH07329087A (en) | 1995-12-19 |
JP3222689B2 true JP3222689B2 (en) | 2001-10-29 |
Family
ID=15022995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12997294A Expired - Lifetime JP3222689B2 (en) | 1994-06-13 | 1994-06-13 | Manufacturing method of laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3222689B2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3349884B2 (en) * | 1995-05-09 | 2002-11-25 | 日立化成工業株式会社 | Expanded graphite sheet with resin and method for producing the same |
JP3473928B2 (en) * | 1995-12-25 | 2003-12-08 | 住友ベークライト株式会社 | Phenolic resin composition |
JP3724047B2 (en) * | 1996-04-12 | 2005-12-07 | 日立化成工業株式会社 | Laminated board for printed wiring boards |
JP2004217941A (en) * | 1997-01-20 | 2004-08-05 | Hitachi Chem Co Ltd | Thermosetting composition and its cured product |
EP1063262A4 (en) * | 1998-02-23 | 2001-07-11 | Asahi Chemical Ind | Thermosetting polyphenylene ether resin composition, cured resin composition obtained therefrom, and laminated structure |
-
1994
- 1994-06-13 JP JP12997294A patent/JP3222689B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH07329087A (en) | 1995-12-19 |
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