JPS60172343U - semiconductor element - Google Patents
semiconductor elementInfo
- Publication number
- JPS60172343U JPS60172343U JP6033184U JP6033184U JPS60172343U JP S60172343 U JPS60172343 U JP S60172343U JP 6033184 U JP6033184 U JP 6033184U JP 6033184 U JP6033184 U JP 6033184U JP S60172343 U JPS60172343 U JP S60172343U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- substrate
- disc spring
- case
- constriction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Semiconductor Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案の実施例を示す縦断側面図、第2図は従
来の半導体素子を示す縦断側面図である。
1・・・基板、2・・・半導体素子本体、3・・・カソ
ード電極、30・・・内部導線部、33・・・外部導線
部、4・・・皿バネ、44・・・押え板、6・・・キャ
ップ、61・・・キャップ保持部、7・・・ゲート電極
端子、8・・・ケース部、82・・・絞り部。FIG. 1 is a vertical side view showing an embodiment of the present invention, and FIG. 2 is a vertical side view showing a conventional semiconductor device. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Semiconductor element main body, 3... Cathode electrode, 30... Internal conductor part, 33... External conductor part, 4... Disc spring, 44... Holder plate , 6... Cap, 61... Cap holding part, 7... Gate electrode terminal, 8... Case part, 82... Aperture part.
Claims (1)
ねられた半導体素子本体及び他方の電極と、この他方の
電極の上面に座金を介して下端が圧接された皿バネと、
前記他方の電極に電気的に接続され、皿バネの中央の開
口部に挿入されて上下方向に伸びる内部導線部と、前記
皿バネを取り゛ 囲むよう、基板に下縁が固定された
筒状体より成るケース部と、このケース部の上縁部に当
該ケー−ス部の管壁を絞ることにより形成された絞り部
と、前記皿バネの上面に設けられ、当該皿バネの上方側
への復元を阻止するように前記絞り部の下端に押えられ
た押え板と、前記ケースの上に設けられた絶縁性のキャ
ップと、このキャップに画定され、前記内部導線部に電
気的に接続された外部導線部とを有して成ることを特徴
とする半導体素子。A substrate that also serves as one electrode, a semiconductor element body and another electrode stacked on this substrate in this order, and a disc spring whose lower end is pressed into contact with the upper surface of the other electrode via a washer.
an internal conductive wire portion electrically connected to the other electrode, inserted into the central opening of the disc spring and extending in the vertical direction; and a cylindrical part whose lower edge is fixed to the substrate so as to surround the disc spring. a case portion consisting of a body; a constriction portion formed on the upper edge of the case portion by squeezing the tube wall of the case portion; a holding plate pressed against the lower end of the constriction part to prevent the restoration of the constriction part; an insulating cap provided on the case; What is claimed is: 1. A semiconductor device comprising: an external conductor portion;
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6033184U JPS60172343U (en) | 1984-04-24 | 1984-04-24 | semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6033184U JPS60172343U (en) | 1984-04-24 | 1984-04-24 | semiconductor element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60172343U true JPS60172343U (en) | 1985-11-15 |
Family
ID=30587576
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6033184U Pending JPS60172343U (en) | 1984-04-24 | 1984-04-24 | semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60172343U (en) |
-
1984
- 1984-04-24 JP JP6033184U patent/JPS60172343U/en active Pending
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