JPS60172343U - semiconductor element - Google Patents

semiconductor element

Info

Publication number
JPS60172343U
JPS60172343U JP6033184U JP6033184U JPS60172343U JP S60172343 U JPS60172343 U JP S60172343U JP 6033184 U JP6033184 U JP 6033184U JP 6033184 U JP6033184 U JP 6033184U JP S60172343 U JPS60172343 U JP S60172343U
Authority
JP
Japan
Prior art keywords
electrode
substrate
disc spring
case
constriction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6033184U
Other languages
Japanese (ja)
Inventor
隆夫 渡邊
Original Assignee
株式会社明電舎
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社明電舎 filed Critical 株式会社明電舎
Priority to JP6033184U priority Critical patent/JPS60172343U/en
Publication of JPS60172343U publication Critical patent/JPS60172343U/en
Pending legal-status Critical Current

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  • Semiconductor Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例を示す縦断側面図、第2図は従
来の半導体素子を示す縦断側面図である。 1・・・基板、2・・・半導体素子本体、3・・・カソ
ード電極、30・・・内部導線部、33・・・外部導線
部、4・・・皿バネ、44・・・押え板、6・・・キャ
ップ、61・・・キャップ保持部、7・・・ゲート電極
端子、8・・・ケース部、82・・・絞り部。
FIG. 1 is a vertical side view showing an embodiment of the present invention, and FIG. 2 is a vertical side view showing a conventional semiconductor device. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Semiconductor element main body, 3... Cathode electrode, 30... Internal conductor part, 33... External conductor part, 4... Disc spring, 44... Holder plate , 6... Cap, 61... Cap holding part, 7... Gate electrode terminal, 8... Case part, 82... Aperture part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一方の電極を兼ねた基板と、この基板の上にこの順に重
ねられた半導体素子本体及び他方の電極と、この他方の
電極の上面に座金を介して下端が圧接された皿バネと、
前記他方の電極に電気的に接続され、皿バネの中央の開
口部に挿入されて上下方向に伸びる内部導線部と、前記
皿バネを取り゛  囲むよう、基板に下縁が固定された
筒状体より成るケース部と、このケース部の上縁部に当
該ケー−ス部の管壁を絞ることにより形成された絞り部
と、前記皿バネの上面に設けられ、当該皿バネの上方側
への復元を阻止するように前記絞り部の下端に押えられ
た押え板と、前記ケースの上に設けられた絶縁性のキャ
ップと、このキャップに画定され、前記内部導線部に電
気的に接続された外部導線部とを有して成ることを特徴
とする半導体素子。
A substrate that also serves as one electrode, a semiconductor element body and another electrode stacked on this substrate in this order, and a disc spring whose lower end is pressed into contact with the upper surface of the other electrode via a washer.
an internal conductive wire portion electrically connected to the other electrode, inserted into the central opening of the disc spring and extending in the vertical direction; and a cylindrical part whose lower edge is fixed to the substrate so as to surround the disc spring. a case portion consisting of a body; a constriction portion formed on the upper edge of the case portion by squeezing the tube wall of the case portion; a holding plate pressed against the lower end of the constriction part to prevent the restoration of the constriction part; an insulating cap provided on the case; What is claimed is: 1. A semiconductor device comprising: an external conductor portion;
JP6033184U 1984-04-24 1984-04-24 semiconductor element Pending JPS60172343U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6033184U JPS60172343U (en) 1984-04-24 1984-04-24 semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6033184U JPS60172343U (en) 1984-04-24 1984-04-24 semiconductor element

Publications (1)

Publication Number Publication Date
JPS60172343U true JPS60172343U (en) 1985-11-15

Family

ID=30587576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6033184U Pending JPS60172343U (en) 1984-04-24 1984-04-24 semiconductor element

Country Status (1)

Country Link
JP (1) JPS60172343U (en)

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