JPS60172107A - Lead wire - Google Patents
Lead wireInfo
- Publication number
- JPS60172107A JPS60172107A JP2755384A JP2755384A JPS60172107A JP S60172107 A JPS60172107 A JP S60172107A JP 2755384 A JP2755384 A JP 2755384A JP 2755384 A JP2755384 A JP 2755384A JP S60172107 A JPS60172107 A JP S60172107A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- layer
- lead
- tin
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子部品に使用されるリード線に関するもので
ある。以下の説明においては、電子部品トシてアルミ電
解コンデンサについて詳細説明するが、他の電子部品に
ついても全く同様である。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to lead wires used in electronic components. In the following description, an aluminum electrolytic capacitor will be explained in detail as an electronic component, but the same applies to other electronic components.
従来例の構成とその問題点
従来のこの種のアルミ電解コンデンサ用のＩＪ−ド線は
第１図に示すように構成されていた・すなわち、高純度
アルミニウムより成るアルミ板１にＣＰＰ２Ｏ接続して
構成されていた。このＣＰＰ２Ｏ第２図に示すように鉄
よりなる芯線３に銅層４、スズ層５を順次積層して構成
されていた。Conventional configuration and its problems Conventional IJ-wires for this type of aluminum electrolytic capacitor were configured as shown in Figure 1. In other words, CPP2O was connected to an aluminum plate 1 made of high-purity aluminum. It was configured. As shown in FIG. 2, this CPP2O was constructed by sequentially laminating a copper layer 4 and a tin layer 5 on a core wire 3 made of iron.
この場合、ＣＰＰ２Ｏ用いたアルミ電解コンデンサをプ
リント基板に半田付する場合、ＣＰ線２０半田ぬれ性が
悪いだめ、半田付の作業性が良好なものとはいえなかっ
た。ＣＰＰ２Ｏ半田ぬれ性が悪い理由として、ｃｐ線２
の最外層を構成しているスズ層５の融点が高いためであ
る。一般に各種の電子部品は熱の影響を受けやすく、特
にアルミ電解コンデンサは液状の駆動用電解液を使用し
ているため、半田付作業はごく短時間で終える必要があ
る。In this case, when an aluminum electrolytic capacitor using CPP2O was soldered to a printed circuit board, the soldering workability was not good because the solder wettability of the CP wire 20 was poor. The reason why CPP2O solder wettability is poor is that cp line 2
This is because the melting point of the tin layer 5 constituting the outermost layer is high. In general, various electronic components are easily affected by heat, and aluminum electrolytic capacitors in particular use a liquid driving electrolyte, so the soldering work must be completed in a very short time.
半田付実装作業をごく短時間で終了させ、しかも信頼性
の高い半田付を実現するためにＣＰＰ２Ｏ最外層に半田
メッキを施すことが考えられている。In order to complete the soldering and mounting work in a very short time and to achieve highly reliable soldering, it has been considered to apply solder plating to the outermost layer of CPP2O.
半田メッキ層におけるスズと鉛の構成比率の差によって
特性が大きく変化する。例えば、５、Ｓｎ／Ｐｂ＝９５
１５の構成比率の半田メッキを施すと、この組成の半田
メッキ層の融点は２２４℃であり、かなり高温でないと
融けない。このため半田メッキ層の融点を低下させる目
的で鉛の添加量を増加させ、いわゆる共晶点半田にする
と、その融点は１８５℃まで低下し、半田付作業は改善
される。Characteristics vary greatly depending on the composition ratio of tin and lead in the solder plating layer. For example, 5, Sn/Pb=95
When solder plating is applied with a composition ratio of 15, the melting point of the solder plating layer with this composition is 224° C., and it cannot be melted unless the temperature is quite high. For this reason, if the amount of lead added is increased to lower the melting point of the solder plating layer to form a so-called eutectic point solder, the melting point will be lowered to 185° C. and the soldering work will be improved.
しかしながらこの場合、鉛の添加量が多くなると、半［
１１１ノノキ層の硬度が低下し、製造工程中、例えは前
記リード線をアルミ箔に接続するだめにパーツフィーダ
を通過きせる工程な゛どを経ると、Ｓｎ／／Ｐｂ合金が
飛散し特性劣化の原因となっていた。However, in this case, when the amount of lead added increases, half [
The hardness of the 111 wood layer decreases, and during the manufacturing process, for example, when the lead wire is passed through a parts feeder to connect it to aluminum foil, the Sn//Pb alloy is scattered and the properties deteriorate. It was the cause.
発明の目的
本発明はこのような従来の欠点を除去するもので、リー
ド線の表面キズを押え、アルミ電解コンデンサのもれ電
流不良やノイズ不良を低減すると共に半田付作業の作業
性を良好なものにし、半田伺の信頼性を向上させること
を目的とするものである。Purpose of the Invention The present invention eliminates these conventional drawbacks, suppresses surface scratches on lead wires, reduces leakage current defects and noise defects in aluminum electrolytic capacitors, and improves workability in soldering work. The purpose is to improve the reliability of soldering.
発明の構成
この目的を達成するだめに本発明は、アルミ電解コンデ
ンサのリード線として、鉄を芯線とし銅層、スズ−鉛合
金層、スズ層を順次積層して構成したリード線を用いる
ものである。Structure of the Invention In order to achieve this object, the present invention uses, as a lead wire for an aluminum electrolytic capacitor, a lead wire composed of an iron core wire and a copper layer, a tin-lead alloy layer, and a tin layer laminated in sequence. be.
この構成によって、最外層に硬いスズ層が存在している
ため、パーツフィーダを通過した場合でもＳ ｎ／Ｐ
ｂ合金粉末の飛散は全くなく、しかも半田付に際しては
、融点の低いスズ−鉛合金層が融けるため、簡単でかつ
信頼性の高い半田付作業が実現できることとなる。With this configuration, there is a hard tin layer on the outermost layer, so even when passing through the parts feeder, the Sn/P
There is no scattering of b-alloy powder, and since the tin-lead alloy layer, which has a low melting point, melts during soldering, a simple and highly reliable soldering operation can be achieved.
実施例の説明 以下、本発明の一実施例について説明する。Description of examples An embodiment of the present invention will be described below.
まず、第３図に示すように、本発明のリード線について
説明する。First, as shown in FIG. 3, the lead wire of the present invention will be explained.
６は鉄よりなる芯線であり、この芯線６に銅層７、この
銅層７上にスズ−鉛合金層８、さらにこの鉛合金層８上
にスズ層９をメッキなどの方法により施して構成されて
いる。Reference numeral 6 denotes a core wire made of iron, which is constructed by applying a copper layer 7 to the core wire 6, a tin-lead alloy layer 8 on the copper layer 7, and a tin layer 9 on the lead alloy layer 8 by a method such as plating. has been done.
このような構成のリード線をアルミ電解コンデンサのリ
ード線として使用する場合には、第１図に示すように高
純度アルミニウムよりなるアルミ板１に上述のリード線
２を接続して構成される。When a lead wire having such a structure is used as a lead wire for an aluminum electrolytic capacitor, the lead wire 2 described above is connected to an aluminum plate 1 made of high-purity aluminum as shown in FIG.
次に従来のリード線と本発明のリード線との比較例につ
いて説明する。Next, a comparative example of a conventional lead wire and a lead wire of the present invention will be described.
従来品として、第１図に示したリード線、すなわち、高
純度のアルミ板１にｃｐ線２を接続し、さらに千円メッ
キを施したリード線を用いｃｓｏＶ１μＦの製品を１０
００個製作した。一方、本発明品として、第１図、第３
図に示したリード線、すなわち、高純度のアルミ板１に
、スズ−鉛合金層が介在しているリード線を接続し、従
来品と同様の５０Ｖ１７１Ｆの製品を１０００個製作し
た。As a conventional product, we used the lead wire shown in Figure 1, that is, the CP wire 2 was connected to the high-purity aluminum plate 1, and the lead wire was plated with 1,000 yen.
00 pieces were produced. On the other hand, as a product of the present invention, Figs.
The lead wire shown in the figure, that is, the lead wire with a tin-lead alloy layer interposed therebetween, was connected to the high-purity aluminum plate 1, and 1000 products of 50V171F similar to the conventional product were manufactured.
これらのアルミ電解コンデンサのもれ電流特性を比較し
た結果を下表に示した。The table below shows the results of comparing the leakage current characteristics of these aluminum electrolytic capacitors.
静電容量およびｔａｎδの値はそれぞれ１０００個の平
均値である。もれ電流については、５０ＶＤＣ印加２分
後の値で２μ八以上の個数を示した。The capacitance and tan δ values are each an average value of 1000 values. Regarding the leakage current, the number of leakage currents was 2μ8 or more after 2 minutes of application of 50VDC.
上記表から明らかなように、従来品と本発明品との対比
において、静電容量やｔａｎδについては差が見られな
い。しかしながら、もれ電流特性においては、従来品の
方が２１．ｔＡ以上であるものが多かった。As is clear from the above table, there is no difference in capacitance or tan δ when comparing the conventional product and the product of the present invention. However, in terms of leakage current characteristics, the conventional product is 21. Many of them were higher than tA.
発明の効果
以上のように本発明のリード線によれば、従来のＣＰ線
の銅層とスズ層の間にスズ−鉛合金層を介在させること
で、半田付温度が低くなり、かつ金属粉の飛散が少なく
、もれ電流特性が改善さｔするという効果が得られる。Effects of the Invention As described above, according to the lead wire of the present invention, by interposing the tin-lead alloy layer between the copper layer and the tin layer of the conventional CP wire, the soldering temperature can be lowered, and metal powder can be reduced. The effect is that there is less scattering and the leakage current characteristics are improved.
第１図は従来のリード線を示す斜視図、第２図は従来の
ＣＰ線の断面図、第３図は本発明によるリード線の一実
施例を示す要部断面図である。
１・・・・・・アルミ板、２・・・・・・リード線、６
・・・・・・鉄、７・・・・・・銅層、８・・・・・・
スズ−鉛合金層、９・・・・・スズＯFIG. 1 is a perspective view of a conventional lead wire, FIG. 2 is a sectional view of a conventional CP wire, and FIG. 3 is a sectional view of a main part of an embodiment of the lead wire according to the present invention. 1...Aluminum plate, 2...Lead wire, 6
...Iron, 7...Copper layer, 8...
Tin-lead alloy layer, 9...Tin O
Claims (1)
層したことを特徴とするリード線。A lead wire characterized by having an iron core wire and sequentially laminating a copper layer, a tin-lead alloy layer, and a tin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2755384A JPS60172107A (en) | 1984-02-16 | 1984-02-16 | Lead wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2755384A JPS60172107A (en) | 1984-02-16 | 1984-02-16 | Lead wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60172107A true JPS60172107A (en) | 1985-09-05 |
Family
ID=12224248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2755384A Pending JPS60172107A (en) | 1984-02-16 | 1984-02-16 | Lead wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60172107A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5479466A (en) * | 1977-12-06 | 1979-06-25 | Sumitomo Electric Industries | Colored lead wire for electronic parts |
-
1984
- 1984-02-16 JP JP2755384A patent/JPS60172107A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5479466A (en) * | 1977-12-06 | 1979-06-25 | Sumitomo Electric Industries | Colored lead wire for electronic parts |
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